Noise Coupling in System-on-Chip (Hardcover)

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

General

Imprint:	Productivity Press
Country of origin:	United States
Series:	Devices, Circuits, and Systems
Release date:	December 2017
First published:	2017
Editors:	Thomas Noulis
Dimensions:	234 x 156 x 30mm (L x W x T)
Format:	Hardcover
Pages:	518
ISBN-13:	978-1-4987-9677-4
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Communications engineering / telecommunications > General
LSN:	1-4987-9677-X
Barcode:	9781498796774

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