MCM C/Mixed Technologies and Thick Film Sensors (Hardcover, 1995 ed.)

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

General

Imprint:	Springer
Country of origin:	Netherlands
Series:	NATO Science Partnership Subseries: 3, 2
Release date:	April 1995
First published:	1995
Editors:	W.K. Jones • Karel Kurzweil • Gabor Harsanyi • Sylvia Mergui
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Hardcover
Pages:	318
Edition:	1995 ed.
ISBN-13:	978-0-7923-3460-6
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	0-7923-3460-4
Barcode:	9780792334606

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