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Electroless Copper and Nickel-Phosphorus Plating - Processing, Characterisation and Modelling (Paperback)
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Electroless Copper and Nickel-Phosphorus Plating - Processing, Characterisation and Modelling (Paperback)
Series: Woodhead Publishing Series in Metals and Surface Engineering
Expected to ship within 12 - 19 working days
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Unlike electroplating, electroless plating allows uniform deposits
of coating materials over all surfaces, regardless of size, shape
and electrical conductivity. Electroless copper and
nickel-phosphorus deposits provide protective and functional
coatings in industries as diverse as electronics, automotive,
aerospace and chemical engineering. This book discusses the latest
research in electroless depositions. After an introductory chapter,
part one focuses on electroless copper depositions reviewing such
areas as surface morphology and residual stress, modelling surface
structure, adhesion strength of electroless copper deposit,
electrical resistivity and applications of electroless copper
deposits. Part two goes on to look at electroless nickel-phosphorus
depositions with chapters on the crystallisation of
nickel-phosphorus deposits, modelling the thermodynamics and
kinetics of crystallisation of nickel-phosphorus deposits,
artificial neural network (ANN) modelling of crystallisation
temperatures, hardness evolution of nickel-phosphorus deposits and
applications of electroless nickel-phosphorus plating. Written by
leading experts in the field Electroless copper and
nickel-phosphorus plating: Processing, characterisation and
modelling is an invaluable guide for researchers studying
electroless deposits or materials science as well as for those
working in the chemical, oil and gas, automotive, electronics and
aerospace industries.
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