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Electroless Copper and Nickel-Phosphorus Plating - Processing, Characterisation and Modelling (Paperback) Loot Price: R3,555
Discovery Miles 35 550
You Save: R260 (7%)
Electroless Copper and Nickel-Phosphorus Plating - Processing, Characterisation and Modelling (Paperback): W. Sha, Xiaomin Wu,...

Electroless Copper and Nickel-Phosphorus Plating - Processing, Characterisation and Modelling (Paperback)

W. Sha, Xiaomin Wu, K. G. Keong

Series: Woodhead Publishing Series in Metals and Surface Engineering

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List price R3,815 Loot Price R3,555 Discovery Miles 35 550 | Repayment Terms: R333 pm x 12* You Save R260 (7%)

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Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

General

Imprint: Woodhead Publishing Ltd
Country of origin: United Kingdom
Series: Woodhead Publishing Series in Metals and Surface Engineering
Release date: August 2016
First published: 2011
Authors: W. Sha • Xiaomin Wu • K. G. Keong
Dimensions: 234 x 156 x 16mm (L x W x T)
Format: Paperback
Pages: 304
ISBN-13: 978-0-08-101497-4
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 0-08-101497-X
Barcode: 9780081014974

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