Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process."

Green Manufacturing: Fundamentals and Applications introduces the basic definitions and issues surrounding green manufacturing at the process,machine and system (including supply chain) levels. It also shows, by way of several examples from different industry sectors, the potential for substantial improvement and the paths to achieve the improvement. Additionally, this book discusses regulatory and government motivations for green manufacturing and outlines the path for making manufacturing more green as well as making production more sustainable. This book also: Discusses new engineering approaches for manufacturing and provides a path from traditional manufacturing to green manufacturing Addresses regulatory and economic issues surrounding green manufacturing Details new supply chains that need to be in place before going green Includes state-of-the-art case studies in the areas of automotive, semiconductor and medical areas as well as in the supply chain and packaging areas

The 19th CIRP Conference on Life Cycle Engineering continues a strong tradition of scientific meetings in the areas of sustainability and engineering within the community of the International Academy for Production Engineering (CIRP). The focus of the conference is to review and discuss the current developments, technology improvements, and future research directions that will allow engineers to help create green businesses and industries that are both socially responsible and economically successful. The symposium covers a variety of relevant topics within life cycle engineering including Businesses and Organizations, Case Studies, End of Life Management, Life Cycle Design, Machine Tool Technologies for Sustainability, Manufacturing Processes, Manufacturing Systems, Methods and Tools for Sustainability, Social Sustainability, and Supply Chain Management.

Green Manufacturing: Fundamentals and Applications introduces the basic definitions and issues surrounding green manufacturing at the process,machine and system (including supply chain) levels. It also shows, by way of several examples from different industry sectors, the potential for substantial improvement and the paths to achieve the improvement. Additionally, this book discusses regulatory and government motivations for green manufacturing and outlines the path for making manufacturing more green as well as making production more sustainable. This book also: Discusses new engineering approaches for manufacturing and provides a path from traditional manufacturing to green manufacturing Addresses regulatory and economic issues surrounding green manufacturing Details new supply chains that need to be in place before going green Includes state-of-the-art case studies in the areas of automotive, semiconductor and medical areas as well as in the supply chain and packaging areas

In many machining operations burrs cannot be avoided. They can affect the functionality and the safe handling of the workpiece in the subsequent processing, and have to be removed by a special deburring process. Toleration of burrs, which are not part of functional edges, depends on their respective shape and size. High inspection effort is necessary to guarantee the workpiece quality. Therefore, the research results on burrs, with a focus on burr analysis and control as well as on cleanability and burr removal based on the presentations held at the conference are valuable for researchers and engineers in manufacturing development.

Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process."

Today there is a high demand for high-precision products. The manufacturing processes are now highly sophisticated and derive from a specialized genre called precision engineering. Precision Manufacturing provides an introduction to precision engineering and manufacturing with an emphasis on the design and performance of precision machines and machine tools, metrology, tooling elements, machine structures, sources of error, precision machining processes and precision process planning. As well as discussing the critical role precision machine design for manufacturing has had in technological developments over the last few hundred years. In addition, the influence of sustainable manufacturing requirements in precision processes is introduced.

Drawing upon years of practical experience and using numerous examples and illustrative applications, David Dornfeld Dae-Eun Lee cover precision manufacturing as it applies to:

The importance of measurement and metrology in the context of Precision manufacturing.

The role of sensors in precision manufacturing and how they can reduce uncertainty in systems introduced by interfaces between machine elements, process elements and materials, etc.

New and emerging fields of micromachining and nano manufacturing and their importance and impact on precision manufacturing.

Adherence to precision manufacturing techniques during the production process prevents waste, increases interchangeability among similar parts, lowers the manufacturing cost and increases quality.

Precision Manufacturing will be of interest to design engineers, quality engineers and manufacturing engineers, academics and those who may or may not have previous experience with precision manufacturing, but want to learn more.