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Electronics has become the largest industry, surpassing
agriCUlture, auto. and heavy metal industries. It has become the
industry of choice for a country to prosper, already having given
rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong
Kong. and Ireland among others. At the current growth rate, total
worldwide semiconductor sales will reach $300B by the year 2000.
The key electronic technologies responsible for the growth of the
industry include semiconductors. the packaging of semiconductors
for systems use in auto, telecom, computer, consumer, aerospace,
and medical industries. displays. magnetic, and optical storage as
well as software and system technologies. There has been a paradigm
shift, however, in these technologies. from mainframe and
supercomputer applications at any cost. to consumer applications at
approximately one-tenth the cost and size. Personal computers are a
good example. going from $500IMIP when products were first
introduced in 1981, to a projected $lIMIP within 10 years. Thin.
light portable. user friendly and very low-cost are. therefore. the
attributes of tomorrow's computing and communications systems.
Electronic packaging is defined as interconnection. powering, cool
ing, and protecting semiconductor chips for reliable systems. It is
a key enabling technology achieving the requirements for reducing
the size and cost at the system and product level."
Thin-Film Capacitors for Packaged Electronics deals with the
capacitors of a wanted kind, still needed and capable of keeping
pace with the demands posed by ever greater levels of integration.
It spans a wide range of topics, from materials properties to
limits of what's the best one can achieve in capacitor properties
to process modeling to application examples. Some of the topics
covered are the following:
-Novel insights into fundamental relationships between dielectric
constant and the breakdown field of materials and related
capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of
frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
Electronics has become the largest industry, surpassing
agriculture, auto, and heavy metal industries. It has become the
industry of choice for a country to prosper, already having given
rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong
Kong, and Ireland among others. At the current growth rate, total
worldwide semiconductor sales will reach $300B by the year 2000.
The key electronic technologies responsible for the growth of the
industry include semiconductors, the packaging of semiconductors
for systems use in auto, telecom, computer, consumer, aerospace,
and medical industries, displays, magnetic, and optical storage as
well as software and system technologies. There has been a paradigm
shift, however, in these technologies, from mainframe and
supercomputer applications at any cost, to consumer applications at
approximately one-tenth the cost and size. Personal computers are a
good example, going from $500IMIP when products were first
introduced in 1981, to a projected $IIMIP within 10 years. Thin,
light portable, user friendly and very low-cost are, therefore, the
attributes of tomorrow's computing and communications systems.
Electronic packaging is defined as interconnection, powering, cool
ing, and protecting semiconductor chips for reliable systems. It is
a key enabling technology achieving the requirements for reducing
the size and cost at the system and product level."
Electronics has become the largest industry, surpassing
agriCUlture, auto. and heavy metal industries. It has become the
industry of choice for a country to prosper, already having given
rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong
Kong. and Ireland among others. At the current growth rate, total
worldwide semiconductor sales will reach $300B by the year 2000.
The key electronic technologies responsible for the growth of the
industry include semiconductors. the packaging of semiconductors
for systems use in auto, telecom, computer, consumer, aerospace,
and medical industries. displays. magnetic, and optical storage as
well as software and system technologies. There has been a paradigm
shift, however, in these technologies. from mainframe and
supercomputer applications at any cost. to consumer applications at
approximately one-tenth the cost and size. Personal computers are a
good example. going from $500IMIP when products were first
introduced in 1981, to a projected $lIMIP within 10 years. Thin.
light portable. user friendly and very low-cost are. therefore. the
attributes of tomorrow's computing and communications systems.
Electronic packaging is defined as interconnection. powering, cool
ing, and protecting semiconductor chips for reliable systems. It is
a key enabling technology achieving the requirements for reducing
the size and cost at the system and product level."
This thoroughly revised and updated three volume set continues to
be the standard reference in the field, providing the latest in
microelectronics design methods, modeling tools, simulation
techniques, and manufacturing procedures. Unlike reference books
that focus only on a few aspects of microelectronics packaging,
these outstanding volumes discuss state-of-the-art packages that
meet the power, cooling, protection, and interconnection
requirements of increasingly dense and fast microcircuitry.
Providing an excellent balance of theory and practical
applications, this dynamic compilation features step-by-step
examples and vital technical data, simplifying each phase of
package design and production. In addition, the volumes contain
over 2000 references, 900 figures, and 250 tables. Part I:
Technology Drivers covers the driving force of microelectronics
packaging - electrical, thermal, and reliability. It introduces the
technology developer to aspects of manufacturing that must be
considered during product development. Part II: Semiconductor
Packaging discusses the interconnection of the IC chip to the first
level of packaging and all first level packages. Electrical test,
sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as
well as connectors, cables, and optical packaging.
Thin-Film Capacitors for Packaged Electronics deals with the
capacitors of a wanted kind, still needed and capable of keeping
pace with the demands posed by ever greater levels of integration.
It spans a wide range of topics, from materials properties to
limits of what's the best one can achieve in capacitor properties
to process modeling to application examples. Some of the topics
covered are the following: -Novel insights into fundamental
relationships between dielectric constant and the breakdown field
of materials and related capacitance density and breakdown voltage
of capacitor structures, -Electrical characterization techniques
for a wide range of frequencies (1 kHz to 20 GHz), -Process
modeling to determine stable operating points, -Prevention of metal
(Cu) diffusion into the dielectric, -Measurements and modeling of
the dielectric micro-roughness.
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