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Microelectronics Packaging Handbook - Technology Drivers Part I (Paperback, Softcover reprint of the original 2nd ed. 1997) Loot Price: R5,561
Discovery Miles 55 610
Microelectronics Packaging Handbook - Technology Drivers Part I (Paperback, Softcover reprint of the original 2nd ed. 1997): R....

Microelectronics Packaging Handbook - Technology Drivers Part I (Paperback, Softcover reprint of the original 2nd ed. 1997)

R. R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

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Loot Price R5,561 Discovery Miles 55 610 | Repayment Terms: R521 pm x 12*

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Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level."

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: October 2012
First published: October 2012
Authors: R. R. Tummala • Eugene J. Rymaszewski • Alan G. Klopfenstein
Dimensions: 235 x 155 x 38mm (L x W x T)
Format: Paperback
Pages: 720
Edition: Softcover reprint of the original 2nd ed. 1997
ISBN-13: 978-1-4613-6829-8
Categories: Books > Computing & IT > General theory of computing > Data structures
Books > Computing & IT > Computer programming > Algorithms & procedures
Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 1-4613-6829-4
Barcode: 9781461368298

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