Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal-oxide-semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe. The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include: Nanoscale advances in current MOSFET/CMOS technology Nano capacitors for applications such as electronics packaging and humidity sensors Single electron transistors and other electron tunneling devices Quantum cellular automata and nanomagnetic logic Memristors as switching devices and for memory Graphene preparation, properties, and devices Carbon nanotubes (CNTs), both single CNT and random network Other CNT applications such as terahertz, sensors, interconnects, and capacitors Nano system architectures for reliability Nanowire device fabrication and applications Nanowire transistors Nanodevices for spintronics The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.

Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled. The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires. Featuring contributions by experts from academia and industry around the world, this book presents cutting-edge nanofabrication research in a wide range of areas. Topics include: CNT electrodynamics and signal propagation models Electronic structure calculations of a graphene-hexagonal boron nitride interface to aid the understanding of experimental devices based on these heterostructures How a laser field would modify the electronic structure and transport response of graphene, to generate bandgaps The fabrication of transparent CNT electrodes for organic light-emitting diodes Direct graphene growth on dielectric substrates, and potential applications in electronic and spintronic devices CNTs as a promising candidate for next-generation interconnect conductors CMOS-CNT integration approaches, including the promising localized heating CNT synthesis method CNTs in electrochemical and optical biosensors The synthesis of diamondoids by pulsed laser ablation plasmas generated in supercritical fluids, and possible applications The use of DNA nanostructures in lithography CMOS-compatible silicon nanowire biosensors The use of titanium oxide-B nanowires to detect explosive vapors The properties of protective layers on silver nanoparticles for ink-jet printing Nanostructured thin-film production using microreactors A one-stop reference for professionals, researchers, and graduate students working in nanofabrication, this book will also be useful for investors who want an overview of the current nanofabrication landscape.

Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal-oxide-semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe. The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include: Nanoscale advances in current MOSFET/CMOS technology Nano capacitors for applications such as electronics packaging and humidity sensors Single electron transistors and other electron tunneling devices Quantum cellular automata and nanomagnetic logic Memristors as switching devices and for memory Graphene preparation, properties, and devices Carbon nanotubes (CNTs), both single CNT and random network Other CNT applications such as terahertz, sensors, interconnects, and capacitors Nano system architectures for reliability Nanowire device fabrication and applications Nanowire transistors Nanodevices for spintronics The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled. The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires. Featuring contributions by experts from academia and industry around the world, this book presents cutting-edge nanofabrication research in a wide range of areas. Topics include: CNT electrodynamics and signal propagation models Electronic structure calculations of a graphene-hexagonal boron nitride interface to aid the understanding of experimental devices based on these heterostructures How a laser field would modify the electronic structure and transport response of graphene, to generate bandgaps The fabrication of transparent CNT electrodes for organic light-emitting diodes Direct graphene growth on dielectric substrates, and potential applications in electronic and spintronic devices CNTs as a promising candidate for next-generation interconnect conductors CMOS-CNT integration approaches, including the promising localized heating CNT synthesis method CNTs in electrochemical and optical biosensors The synthesis of diamondoids by pulsed laser ablation plasmas generated in supercritical fluids, and possible applications The use of DNA nanostructures in lithography CMOS-compatible silicon nanowire biosensors The use of titanium oxide-B nanowires to detect explosive vapors The properties of protective layers on silver nanoparticles for ink-jet printing Nanostructured thin-film production using microreactors A one-stop reference for professionals, researchers, and graduate students working in nanofabrication, this book will also be useful for investors who want an overview of the current nanofabrication landscape.

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.