Reliability of Microtechnology discusses the reliability of
microtechnology products from the bottom up, beginning with devices
and extending to systems. The book's focus includes but is not
limited to reliability issues of interconnects, the methodology of
reliability concepts and general failure mechanisms. Specific
failure modes in solder and conductive adhesives are discussed at
great length. Coverage of accelerated testing, component and system
level reliability, and reliability design for manufacturability are
also described in detail.
The book also includes exercises and detailed solutions at the
end of each chapter.
General
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