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This book starts with background concerning three-dimensional
integration - including their low energy consumption and high speed
image processing - and then proceeds to how to construct them and
which materials to use in particular situations. The book covers
numerous applications, including next generation smart phones,
driving assistance systems, capsule endoscopes, homing missiles,
and many others. The book concludes with recent progress and
developments in three dimensional packaging, as well as future
prospects.
This book discusses the scientific mechanism of copper
electrodeposition and it's wide range of applications. The book
will cover everything from the basic fundamentals to practical
applications. In addition, the book will also cover important
topics such as: * ULSI wiring material based upon copper nanowiring
* Printed circuit boards * Stacked semiconductors * Through Silicon
Via * Smooth copper foil for Lithium-Ion battery electrodes. This
book is ideal for nanotechnologists, industry professionals, and
practitioners.
This book starts with background concerning three-dimensional
integration - including their low energy consumption and high speed
image processing - and then proceeds to how to construct them and
which materials to use in particular situations. The book covers
numerous applications, including next generation smart phones,
driving assistance systems, capsule endoscopes, homing missiles,
and many others. The book concludes with recent progress and
developments in three dimensional packaging, as well as future
prospects.
This book discusses the scientific mechanism of copper
electrodeposition and it's wide range of applications. The book
will cover everything from the basic fundamentals to practical
applications. In addition, the book will also cover important
topics such as: * ULSI wiring material based upon copper nanowiring
* Printed circuit boards * Stacked semiconductors * Through Silicon
Via * Smooth copper foil for Lithium-Ion battery electrodes. This
book is ideal for nanotechnologists, industry professionals, and
practitioners.
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