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This book on mechanical microsensors is based on a course organized
by the Swiss Foundation for Research in Microtechnology (FSRM) in
Neuchatel, Swit zerland, and developed and taught by the authors.
Support by FSRM is herewith gratefully acknowledged. This book
attempts to serve two purposes. First it gives an overview on me
chanical microsensors (sensors for pressure, force, acceleration,
angular rate and fluid flow, realized by silicon micromachining).
Second, it serves as a textbook for engineers to give them a
comprehensive introduction on the basic design issues of these
sensors. Engineers active in sensor design are usually educated
either in electrical engineering or mechanical engineering. These
classical educa tional pro grams do not prepare the engineer for
the challenging task of sensor design since sensors are instruments
typically bridging the disciplines: one needs a rather deep
understanding of both mechanics and electronics. Accordingly, the
book contains discussion of the basic engineering sciences relevant
to mechanical sensors, hopefully in a way that it is accessible for
all colours of engineers. Engi rd th neering students in their 3 or
4 year should have enough knowledge to be able to follow the
arguments presented in this book. In this sense, this book should
be useful as textbook for students in courses on mechanical
microsensors (as is CUf rently being done at the University
ofTwente)."
This book provides a comprehensive description of microsensors for mechanical quantities (flow, pressure, force, inertia) fabricated by silicon micromachining. Since the design of such sensors requires interdisciplinary teamwork, the presentation is made accessible to engineers trained in electrical and mechanical engineering, physics and chemistry. The reader is guided through the micromachining fabrication process. A chapter on microsensor packaging completes the discussion of technological problems. The description of the basic physics required for sensor design includes the mechanics of deformation and the piezoresistive transduction to electrical signals. There is also a comprehensive discussion of resonant sensors, the hydrodynamics and heat transfer relevant for flow sensors, and, finally, electronic interfacing and readout circuitry. Numerous up-to-date case studies are presented, together with the working, fabrication and design of the sensors.
This comprehensive book provides an overview of the key techniques
used in the fabrication of micron-scale structures in silicon.
Recent advances in these techniques have made it possible to create
a new generation of microsystem devices, such as microsensors,
accelerometers, micropumps, and miniature robots. The authors
underpin the discussion of each technique with a brief review of
the fundamental physical and chemical principles involved. They pay
particular attention to methods such as isotropic and anisotropic
wet chemical etching, wafer bonding, reactive ion etching, and
surface micromachining. There is a special section on bulk
micromachining, and the authors also discuss release mechanisms for
movable microstructures. The book is a blend of detailed
experimental and theoretical material, and will be of great
interest to graduate students and researchers in electrical
engineering and materials science whose work involves the study of
micro-electromechanical systems (MEMS).
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