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Nanoscale Characterisation of Ferroelectric Materials - Scanning Probe Microscopy Approach (Hardcover, 2004 ed.): Marin Alexe,... Nanoscale Characterisation of Ferroelectric Materials - Scanning Probe Microscopy Approach (Hardcover, 2004 ed.)
Marin Alexe, Alexei Gruverman
R4,271 Discovery Miles 42 710 Ships in 10 - 15 working days

This book presents recent advances in the field of nanoscale characterization of ferroelectric materials using scanning probe microscopy (SPM). It addresses various imaging mechanisms of ferroelectric domains in SPM, quantitative analysis of the piezoresponse signals as well as basic physics of ferroelectrics at the nanoscale level, such as nanoscale switching, scaling effects, and transport behavior. This state-of-the-art review of theory and experiments on nanoscale polarization phenomena will be a useful reference for advanced readers as well for newcomers and graduate students interested in the SPM techniques. The non-specialists will obtain valuable information about different approaches to electrical characterization by SPM, while researchers in the ferroelectric field will be provided with details of SPM-based measurements of ferroelectrics.

Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.): Marin Alexe, Ulrich Goesele Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.)
Marin Alexe, Ulrich Goesele
R9,104 Discovery Miles 91 040 Ships in 12 - 17 working days

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004): Marin Alexe, Ulrich... Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004)
Marin Alexe, Ulrich Goesele
R9,333 Discovery Miles 93 330 Ships in 10 - 15 working days

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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