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Showing 1 - 4 of 4 matches in All Departments

Fundamentals of  Nanoscale Film Analysis (Hardcover, 2007 ed.): Terry L. Alford, L.C. Feldman, James W. Mayer Fundamentals of Nanoscale Film Analysis (Hardcover, 2007 ed.)
Terry L. Alford, L.C. Feldman, James W. Mayer
R2,769 Discovery Miles 27 690 Ships in 10 - 15 working days

From materials science to integrated circuit development, much of modern technology is moving from the microscale toward the nanoscale. This book focuses on the fundamental physics underlying innovative techniques for analyzing surfaces and near-surfaces. New analytical techniques have emerged to meet these technological requirements, all based on a few processes that govern the interactions of particles and radiation with matter. This book addresses the fundamentals and application of these processes, from thin films to field effect transistors.

Silver Metallization - Stability and Reliability (Hardcover, 2008 ed.): Daniel Adams, Terry L. Alford, James W. Mayer Silver Metallization - Stability and Reliability (Hardcover, 2008 ed.)
Daniel Adams, Terry L. Alford, James W. Mayer
R2,653 Discovery Miles 26 530 Ships in 18 - 22 working days

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.

Silver Metallization - Stability and Reliability (Paperback, 2008): Daniel Adams, Terry L. Alford, James W. Mayer Silver Metallization - Stability and Reliability (Paperback, 2008)
Daniel Adams, Terry L. Alford, James W. Mayer
R2,610 Discovery Miles 26 100 Ships in 18 - 22 working days

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.

Fundamentals of  Nanoscale Film Analysis (Paperback, Softcover reprint of hardcover 1st ed. 2007): Terry L. Alford, L.C.... Fundamentals of Nanoscale Film Analysis (Paperback, Softcover reprint of hardcover 1st ed. 2007)
Terry L. Alford, L.C. Feldman, James W. Mayer
R2,442 Discovery Miles 24 420 Ships in 18 - 22 working days

From materials science to integrated circuit development, much of modern technology is moving from the microscale toward the nanoscale. This book focuses on the fundamental physics underlying innovative techniques for analyzing surfaces and near-surfaces. New analytical techniques have emerged to meet these technological requirements, all based on a few processes that govern the interactions of particles and radiation with matter. This book addresses the fundamentals and application of these processes, from thin films to field effect transistors.

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