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Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture

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Materials for Advanced Packaging (Hardcover, 2nd ed. 2017) Loot Price: R7,329
Discovery Miles 73 290
Repayment Terms: R687 pm x 12*
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Materials for Advanced Packaging (Hardcover, 2nd ed. 2017): Daniel Lu, C.P. Wong

Materials for Advanced Packaging (Hardcover, 2nd ed. 2017)

Daniel Lu, C.P. Wong

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Loot Price R7,329 Discovery Miles 73 290 | Repayment Terms: R687 pm x 12*

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Release date: December 2016
First published: 2017
Editors: Daniel Lu • C.P. Wong
Dimensions: 235 x 155 x 51mm (L x W x T)
Format: Hardcover
Pages: 969
Edition: 2nd ed. 2017
ISBN-13: 978-3-319-45097-1
Categories: Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 3-319-45097-2
Barcode: 9783319450971

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