Materials for Advanced Packaging (Hardcover, 2nd ed. 2017)

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	December 2016
First published:	2017
Editors:	Daniel Lu • C.P. Wong
Dimensions:	235 x 155 x 51mm (L x W x T)
Format:	Hardcover
Pages:	969
Edition:	2nd ed. 2017
ISBN-13:	978-3-319-45097-1
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	3-319-45097-2
Barcode:	9783319450971

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!