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Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture

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Materials for Advanced Packaging (Hardcover, 2nd ed. 2017) Loot Price: R7,946

Discovery Miles 79 460

Repayment Terms: R745 pm x 12*

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Materials for Advanced Packaging (Hardcover, 2nd ed. 2017): Daniel Lu, C.P. Wong

Materials for Advanced Packaging (Hardcover, 2nd ed. 2017)

Daniel Lu, C.P. Wong

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Loot Price R7,946 Discovery Miles 79 460 | Repayment Terms: R745 pm x 12*

Expected to ship within 12 - 19 working days

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	December 2016
First published:	2017
Editors:	Daniel Lu • C.P. Wong
Dimensions:	235 x 155 x 51mm (L x W x T)
Format:	Hardcover
Pages:	969
Edition:	2nd ed. 2017
ISBN-13:	978-3-319-45097-1
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General Promotions
LSN:	3-319-45097-2
Barcode:	9783319450971