Welcome to Loot.co.za! Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search

Checkout
- Your Cart Price

Your cart

Your cart is empty

Books > Professional & Technical > Energy technology & engineering > Electrical engineering

Buy Now

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original 1st ed. 2003) Loot Price: R5,061

Discovery Miles 50 610

Repayment Terms: R474 pm x 12*

Add to cart

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original...

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original 1st ed. 2003)

Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

Series: The Springer International Series in Engineering and Computer Science, 719

(sign in to rate)

Loot Price R5,061 Discovery Miles 50 610 | Repayment Terms: R474 pm x 12*

Expected to ship within 10 - 15 working days

Description
Details
Customer Reviews

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS (R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS (R) to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	The Springer International Series in Engineering and Computer Science, 719
Release date:	March 2013
First published:	2003
Authors:	Erdogan Madenci • Ibrahim Guven • Bahattin Kilic
Dimensions:	235 x 155 x 11mm (L x W x T)
Format:	Paperback
Pages:	185
Edition:	Softcover reprint of the original 1st ed. 2003
ISBN-13:	978-1-4613-4989-1
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General Promotions
LSN:	1-4613-4989-3
Barcode:	9781461349891