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Books > Professional & Technical > Energy technology & engineering > Electrical engineering
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original 1st ed. 2003)
Loot Price: R4,923
Discovery Miles 49 230
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original 1st ed. 2003)
Series: The Springer International Series in Engineering and Computer Science, 719
Expected to ship within 10 - 15 working days
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Fatigue Life Prediction of Solder Joints in Electronic Packages
with ANSYS (R) describes the method in great detail starting from
the theoretical basis. The reader is supplied with an add-on
software package to ANSYS (R) that is designed for solder joint
fatigue reliability analysis of electronic packages. Specific steps
of the analysis method are discussed through examples without
leaving any room for confusion. The add-on package along with the
examples make it possible for an engineer with a working knowledge
of ANSYS (R) to perform solder joint reliability analysis. Fatigue
Life Prediction of Solder Joints in Electronic Packages with ANSYS
(R) allows the engineers to conduct fatigue reliability analysis of
solder joints in electronic packages.
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