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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original 1st ed. 2003) Loot Price: R5,172
Discovery Miles 51 720
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original...

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Paperback, Softcover reprint of the original 1st ed. 2003)

Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

Series: The Springer International Series in Engineering and Computer Science, 719

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Loot Price R5,172 Discovery Miles 51 720 | Repayment Terms: R485 pm x 12*

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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS (R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS (R) to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: The Springer International Series in Engineering and Computer Science, 719
Release date: March 2013
First published: 2003
Authors: Erdogan Madenci • Ibrahim Guven • Bahattin Kilic
Dimensions: 235 x 155 x 11mm (L x W x T)
Format: Paperback
Pages: 185
Edition: Softcover reprint of the original 1st ed. 2003
ISBN-13: 978-1-4613-4989-1
Categories: Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-4613-4989-3
Barcode: 9781461349891

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