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Books > Professional & Technical > Energy technology & engineering > Electrical engineering
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (Paperback, Softcover reprint of the original 1st ed. 1999)
Loot Price: R2,873
Discovery Miles 28 730
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (Paperback, Softcover reprint of the original 1st ed. 1999)
Expected to ship within 10 - 15 working days
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One of the greatest challenges facing package manufacturers is to
develop reliable fine pitch thin packages with high leadcounts,
capable of dissipating heat, and deliver them in volume to the
market in a very short space of time. How can this be done?
Firstly, package structures, materials, and manufacturing processes
must be optimised. Secondly, it is necessary to predict the likely
failures and behaviour of parts before manufacture, whilst
minimising the amount of time and money invested in undertaking
costly experimental trials. In a high volume production
environment, any design improvement that increases yield and
reliability can be of immense benefit to the manufacturer.
Components and systems need to be packaged to protect the IC from
its environment. Encapsulating devices in plastic is very cheap and
has the advantage of allowing them to be produced in high volume on
an assembly line. Currently 95% of all ICs are encapsulated in
plastic. Plastic packages are robust, light weight, and suitable
for automated assembly onto printed circuit boards. They have
developed from low pincount (14-28 pins) dual-in-line (DIP)
packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack)
and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts
as high as 256. The demand for PQFPs in 1997 was estimated to be 15
billion and this figure is expected to grow to 20 billion by the
year 2000.
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