Reflow Soldering - Apparatus and Heat Transfer Processes (Paperback)

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries.

General

Imprint:	Elsevier Science Publishing Co Inc
Country of origin:	United States
Release date:	July 2020
First published:	2020
Authors:	Habil. Illes Balazs • Oliver Krammer • Attila Geczy
Dimensions:	229 x 152mm (L x W)
Format:	Paperback
Pages:	294
ISBN-13:	978-0-12-818505-6
Categories:	Books > Professional & Technical > Energy technology & engineering > Heat transfer processes Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Promotions
LSN:	0-12-818505-8
Barcode:	9780128185056

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