Bonding in Microsystem Technology concerns the exciting field of
microsystems (known under varying names as: MEMS, uTAS (analytical
or chemical Microsystems), MOEMS: the micro-miniature devices,
utilizing extremely miniaturized mechanical structures made usually
from silicon by wet deep anisotropic etching. Such structures
cannot be used directly, they must be designed and fabricated as a
part of the three dimensional multi-layer sandwich built from
silicon or silicon and glass. The procedures of formation of such a
sandwich are known as bonding. The book contains the description of
wet anisotropic micromachining of basic silicon micromechanical
constructions and their utilization in microsystems followed by the
detailed discussion of all of methods of bonding used for the
formation of silicon and silicon-glass microsystems, with the
special attention paid to the anodic bonding technique.
Bonding in Microsystem Technology starts with descriptions of
terminology, kinds of microsystems and market analysis. Following
this, presentation of mechanisms of wet etching, set of process
parameters, description of micromachining methods, examples of
procedures, process flow-charts and applications of basic
micromechanical structures in microsystems are shown. Next,
high-temperature, low temperature and room-temperature bonding and
their applications in microsystem technology are presented. The
following part of the book contains the detailed description of
anodic bonding, starting from analysis of properties of glasses
suitable for anodic bonding, and discussion of the nature of the
process. Next all types of anodic bonding and sealing procedures
used in microsystem technology are presented. This part of the book
finishes with examples of applications of anodic bonding in
microsystem technology taken from the literature but mainly based
on the author s personal experience.
Bonding in Microsystem Technology is addressed to scientists and
researchers, as well as to academic teachers and students,
engineers active in the field of electric/electronics and
microelectronics. It can serve as the encyclopaedia of wet etching
and bonding for microsystem technology. Technological results
presented in the book have been tested experimentally by the author
and his team, and can be utilized in day-to-day laboratory
practice. Special attention has been paid to the highest level of
accessibility of the book by students. The book contains a large
number of illustrations, algorithmic flow-charts and microsystems
description and a rich index of literature sources.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
Welcome to Loot.co.za!
Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search
