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Books > Professional & Technical > Mechanical engineering & materials > Materials science
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Three-Dimensional Molded Interconnect Devices (3D-MID) - Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers (Hardcover)
Loot Price: R2,949
Discovery Miles 29 490
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Three-Dimensional Molded Interconnect Devices (3D-MID) - Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers (Hardcover)
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Three-dimensional molded interconnect devices (MIDs) enable
mechanical, electronic, optical, thermal and fluidic functions to
be integrated into injection-molded components. Function
integration on this scale goes hand in hand with a high level of
geometrical design freedom and opportunities for miniaturization,
plus the associated reduction in weight and savings on product
costs. MIDs are made primarily of recyclable thermoplastics, so
they are more environmentally compatible than alternatives produced
using other available technologies. MIDs are used in virtually
every sector of electronics. The many standard applications for
MIDs in the automotive industry in particular also drive for
further development and research into MID technology. The
significance of MID technology is also increasing in medical
engineering, IT and telecommunications and in industrial
automation, with numerous applications now successfully implemented
in all these various fields. This book offers a comprehensive
insight into the state of the art in 3D-MID technology along the
entire process chain. Individual chapters, moreover, deal with
systematics of targeted development of MID parts and explore, with
a dozen and more successful series-production applications as
examples, the widely diverse fields of application for MID
technology.
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