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Fan-Out Wafer-Level Packaging (Hardcover, 1st ed. 2018)
Loot Price: R4,170
Discovery Miles 41 700
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Fan-Out Wafer-Level Packaging (Hardcover, 1st ed. 2018)
Expected to ship within 10 - 15 working days
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This comprehensive guide to fan-out wafer-level packaging (FOWLP)
technology compares FOWLP with flip chip and fan-in wafer-level
packaging. It presents the current knowledge on these key enabling
technologies for FOWLP, and discusses several packaging
technologies for future trends. The Taiwan Semiconductor
Manufacturing Company (TSMC) employed their InFO (integrated
fan-out) technology in A10, the application processor for Apple's
iPhone, in 2016, generating great excitement about FOWLP technology
throughout the semiconductor packaging community. For many
practicing engineers and managers, as well as scientists and
researchers, essential details of FOWLP - such as the temporary
bonding and de-bonding of the carrier on a reconstituted
wafer/panel, epoxy molding compound (EMC) dispensing, compression
molding, Cu revealing, RDL fabrication, solder ball mounting, etc.
- are not well understood. Intended to help readers learn the
basics of problem-solving methods and understand the trade-offs
inherent in making system-level decisions quickly, this book serves
as a valuable reference guide for all those faced with the
challenging problems created by the ever-increasing interest in
FOWLP, helps to remove roadblocks, and accelerates the design,
materials, process, and manufacturing development of key enabling
technologies for FOWLP.
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