Advances in Cryogenic Engineering (Paperback, Softcover reprint of the original 1st ed. 1978)

The Second International Cryogenic Materials Conference (ICMC) was held in Boulder, Colorado, in conjunction with the 1977 Cryogenic Engineering Con ference (CEC). Special thanks must be given to the University of Colorado for their skillful hosting of these two conferences. Collaboration between the two con ferences has been mutually beneficial, providing the materials special ist with insight into new applications and design concepts and the cryogenic engineer with exposure to modern materials accomplishments and potentials. The Proceedings of the 1977 Cryogenic Engineering Conference are published in Volume 23 of Advances in Cryogenic Engineering. Both conferences will be held again simul taneously in Madison, Wisconsin, in August 1979. The success and growth of the two International Cryogenic Materials Con ferences have led to the formation of an ICMC Board of Directors. The board members will serve a four-year term and include: Chairman, R. P. Reed (U.S.), R. W. Boom (U.S.), A. F. Clark (U.S.), G. Hartwig (W. Germany), J. W. Morris (U.S.), M. Suenaga (U.S.), K. Tachikawa (Japan), J. Tanaka (Japan), and K. A. Yushchenko (USSR)."

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	Advances in Cryogenic Engineering, 24
Release date:	May 2013
First published:	1978
Editors:	K Timmerhaus
Dimensions:	244 x 170 x 31mm (L x W x T)
Format:	Paperback
Pages:	586
Edition:	Softcover reprint of the original 1st ed. 1978
ISBN-13:	978-1-4613-9855-4
Categories:	Books > Professional & Technical > Technology: general issues > Engineering: general Books > Science & Mathematics > Physics > Applied physics & special topics > Cryogenics
LSN:	1-4613-9855-X
Barcode:	9781461398554

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