Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Hardcover)

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

General

Imprint:	Crc Press
Country of origin:	United States
Series:	Mechanical Engineering
Release date:	February 2004
First published:	2004
Authors:	Karl J. Puttlitz • Kathleen A. Stalter
Dimensions:	254 x 178 x 64mm (L x W x T)
Format:	Hardcover
Pages:	1048
ISBN-13:	978-0-8247-4870-8
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology
LSN:	0-8247-4870-0
Barcode:	9780824748708

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