Microwave and millimeter-wave integrated circuits (MMICs) are of
increasing im- portance in modern military and commercial wireless
communication systems. Current trends are towards low-cost,
high-density, multilevel,and multifunctional integration, cover-
ingmillimeterand submillimeterwave regions.The integrationofdiverse
subfunctions, such as light-wave devices, superconductor circuits,
digital circuits and ferrite devices, together with conventional
microwave or millimeter-wave devices, circuits and antennas, will
allow implementation of large systems on a single chip. Research on
advanced device concepts, 3-D interconnects, high-performance
packaging methods, advanced CAD-tools, measure- ment and testing
techniques, as weil as material and fabrication technologies, are
being di- rected to meet these new challenges. Continuing on the
series ofsymposia sponsored by the Weber Research Institute of
Polytechnic University, an international symposium focusing on the
current developments and new research initiatives for the next
generation ofmicrowave and millimeter wave inte- grated circuits
and systems was held at Brooklyn, New York,during September 11-13,
1996. The symposium was organizedas a3-dayevent,running mostly ina
single-session format of regular papers and panel discussions, It
was co-sponsored by the Army Research Office, Re- search Triangle
Park, NC, in cooperation with the IEEE Microwave Theory and
Techniques Society, the IEEE Antennas and Propagation Society, and
IEEE Long Island and New York MetropolitanSections.The papers
published in this volume are extended versionsofselected papers
presented at this symposium.
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