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Fine Pitch Surface Mount Technology - Quality, Design, and Manufacturing Techniques (Paperback, Softcover reprint of the original 1st ed. 1992) Loot Price: R3,127
Discovery Miles 31 270
Fine Pitch Surface Mount Technology - Quality, Design, and Manufacturing Techniques (Paperback, Softcover reprint of the...

Fine Pitch Surface Mount Technology - Quality, Design, and Manufacturing Techniques (Paperback, Softcover reprint of the original 1st ed. 1992)

Phil Marcoux

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Loot Price R3,127 Discovery Miles 31 270 | Repayment Terms: R293 pm x 12*

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Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: February 2014
First published: 1992
Authors: Phil Marcoux
Dimensions: 235 x 155 x 19mm (L x W x T)
Format: Paperback
Pages: 340
Edition: Softcover reprint of the original 1st ed. 1992
ISBN-13: 978-1-4613-6567-9
Categories: Books > Computing & IT > General theory of computing > Data structures
Books > Computing & IT > Computer programming > Algorithms & procedures
Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 1-4613-6567-8
Barcode: 9781461365679

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