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Books > Professional & Technical > Mechanical engineering & materials > Materials science
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Hardcover, 1st ed. 2016)
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Hardcover, 1st ed. 2016)
Series: Springer Theses
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This thesis presents a series of mechanical test methods and
comprehensively investigates the deformation and damage behavior of
Cu/Pb-free solder joints under different loading conditions. The
fracture behavior of Pb-free joint interfaces induced by stress,
deformation of solder and substrate are shown, the shear fracture
strength of the Cu6Sn5 IMC is measured experimentally for the first
time, and the dynamic damage process and microstructure evolution
behavior of Pb-free solder joints are revealed intuitively. The
thesis puts forward the argument that the local cumulative damage
is the major cause of failure in solder joints. The research
results provide the experimental and theoretical basis for
improving the reliability of solder joints.
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