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Advances in Chemical Mechanical Planarization (CMP) (Paperback, 2nd edition)
Loot Price: R5,914
Discovery Miles 59 140
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Advances in Chemical Mechanical Planarization (CMP) (Paperback, 2nd edition)
Series: Woodhead Publishing Series in Electronic and Optical Materials
Expected to ship within 12 - 19 working days
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Advances in Chemical Mechanical Planarization (CMP), Second Edition
provides the latest information on a mainstream process that is
critical for high-volume, high-yield semiconductor manufacturing,
and even more so as device dimensions continue to shrink. The
second edition includes the recent advances of CMP and its emerging
materials, methods, and applications, including coverage of
post-CMP cleaning challenges and tribology of CMP. This important
book offers a systematic review of fundamentals and advances in the
area. Part one covers CMP of dielectric and metal films, with
chapters focusing on the use of current and emerging techniques and
processes and on CMP of various materials, including ultra low-k
materials and high-mobility channel materials, and ending with a
chapter reviewing the environmental impacts of CMP processes. New
content addressed includes CMP challenges with tungsten, cobalt,
and ruthenium as interconnect and barrier films, consumables for
ultralow topography and CMP for memory devices. Part two addresses
consumables and process control for improved CMP and includes
chapters on CMP pads, diamond disc pad conditioning, the use of
FTIR spectroscopy for characterization of surface processes and
approaches for defection characterization, mitigation, and
reduction. Advances in Chemical Mechanical Planarization (CMP),
Second Edition is an invaluable resource and key reference for
materials scientists and engineers in academia and R&D.
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