This volume contains the proceedings of the 12th International
Conference on Simulation of Semiconductor Processes and Devices,
SISPAD 2007, held September 2007 in Vienna, Austria. It provides a
global forum for the presentation and discussion of recent advances
and developments in the theoretical description, physical modeling
and numerical simulation and analysis of semiconductor fabrication
processes, device operation and system performance.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!