Simulation of Semiconductor Processes and Devices 2007 - SISPAD 2007 (Paperback, Softcover reprint of the original 1st ed. 2007)

This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.

General

Imprint:	Springer-Verlag
Country of origin:	Austria
Release date:	April 2017
First published:	2007
Editors:	Tibor Grasser • Siegfried Selberherr
Dimensions:	244 x 170 x 25mm (L x W x T)
Format:	Paperback
Pages:	463
Edition:	Softcover reprint of the original 1st ed. 2007
ISBN-13:	978-3-7091-1911-2
Categories:	Books > Professional & Technical > Technology: general issues > Nanotechnology Books > Computing & IT > Applications of computing > Computer modelling & simulation Books > Computing & IT > Applications of computing > Artificial intelligence > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	3-7091-1911-1
Barcode:	9783709119112

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