Bond Graph Modelling of Engineering Systems - Theory, Applications and Software Support (Hardcover, 2011)

The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling.
It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields.
This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	June 2011
First published:	2011
Editors:	Wolfgang Borutzky
Dimensions:	235 x 155 x 33mm (L x W x T)
Format:	Hardcover
Pages:	435
Edition:	2011
ISBN-13:	978-1-4419-9367-0
Categories:	Books > Science & Mathematics > Mathematics > Applied mathematics > Mathematics for scientists & engineers Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Mechanical engineering & materials > Materials science > Mechanics of solids > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Automatic control engineering > General
LSN:	1-4419-9367-3
Barcode:	9781441993670

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