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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials

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Mobile 3D Graphics SoC - From Algorithm To Chip (Hardcover) Loot Price: R4,378
Discovery Miles 43 780
Mobile 3D Graphics SoC - From Algorithm To Chip (Hardcover): Woo

Mobile 3D Graphics SoC - From Algorithm To Chip (Hardcover)

Woo

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Loot Price R4,378 Discovery Miles 43 780 | Repayment Terms: R410 pm x 12*

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The first book to explain the principals behind mobile 3D hardware implementation, helping readers understand advanced algorithms, produce low-cost, low-power SoCs, or become familiar with embedded systems

As mobile broadcasting and entertainment applications evolve, there is increasing interest in 3D graphics within the field of mobile electronics, particularly for handheld devices. In "Mobile 3D Graphics SoC," Yoo provides a comprehensive understanding of the algorithms of mobile 3D graphics and their real chip implementation methods. 3D graphics SoC (System on a Chip) architecture and its interaction with embedded system software are explained with numerous examples. Yoo divides the book into three sections: general methodology of low power SoC, design of low power 3D graphics SoC, and silicon implementation of 3D graphics SoCs and their application to mobile electronics. Full examples are presented at various levels such as system level design and circuit level optimization along with design technology. Yoo incorporates many real chip examples, including many commercial 3D graphics chips, and provides cross-comparisons of various architectures and their performance. Furthermore, while advanced 3D graphics techniques are well understood and supported by industry standards, this is less true in the emerging mobile applications and games market. This book redresses this imbalance, providing an in-depth look at the new OpenGL ES (The Standard for Embedded Accelerated 3D Graphics), and shows what these new embedded systems graphics libraries can provide for 3D graphics and games developers.

General

Imprint: John Wiley & Sons
Country of origin: United States
Release date: June 2010
First published: 2010
Authors: Woo
Dimensions: 236 x 151 x 18mm (L x W x T)
Format: Hardcover
Pages: 344
ISBN-13: 978-0-470-82377-4
Categories: Books > Computing & IT > Applications of computing > Computer modelling & simulation
Books > Computing & IT > Computer software packages > Computer graphics software > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 0-470-82377-1
Barcode: 9780470823774

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