This book highlights research-based case studies in order to analyze the wealth created in the world's largest mergers and acquisitions (M&A). This book encourages cross fertilization in theory building and applied research by examining the links between M&A and wealth creation. Each chapter covers a specific case and offers a focused clinical examination of the entire lifecycle of M&A for each mega deal, exploring all aspects of the process. The success of M&A are analyzed through two main research approaches: event studies and financial performance analyses. The event studies examine the abnormal returns to the shareholders in the period surrounding the merger announcement. The financial performance studies examine the reported financial results of acquirers before and after the acquisition to see whether financial performance has improved after merger. The relation between method of payment, premium paid and stock returns are examined. The chapters also discuss synergies of the deal-cost and revenue synergies. Mergers and acquisitions represent a major force in modern financial and economic environment. Whether in times of boom or bust, M&As have emerged as a compelling strategy for growth. The biggest companies of modern day have all taken form through a series of restructuring activities like multiple mergers. Acquisitions continue to remain as the quickest route companies take to operate in new markets and to add new capabilities and resources. The cases covered in this book highlights high profile M&As and focuses on the wealth creation for shareholders of acquirer and target firms as a financial assessment of the merger's success. The book should be useful for finance professionals, corporate planners, strategists, and managers.

Despite major advances in healthcare over the past century, the successful treatment of cancer has remained a significant challenge, and cancers are the second leading cause of death worldwide behind cardiovascular disease. Early detection and survival are important issues to control cancer. The development of quantitative methods and computer technology has facilitated the formation of new models in medical and biological sciences. The application of mathematical modelling in solving many real-world problems in medicine and biology has yielded fruitful results. In spite of advancements in instrumentations technology and biomedical equipment, it is not always possible to perform experiments in medicine and biology for various reasons. Thus, mathematical modelling and simulation are viewed as viable alternatives in such situations, and are discussed in this book. The conventional diagnostic techniques of cancer are not always effective as they rely on the physical and morphological appearance of the tumour. Early stage prediction and diagnosis is very difficult with conventional techniques. It is well known that cancers are involved in genome level changes. As of now, the prognosis of various types of cancer depends upon findings related to the data generated through different experiments. Several machine learning techniques exist in analysing the data of expressed genes; however, the recent results related with deep learning algorithms are more accurate and accommodative, as they are effective in selecting and classifying informative genes. This book explores the probabilistic computational deep learning model for cancer classification and prediction.

Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and senior undergraduate/graduate students in electrical and electronics engineering, microelectronics, nanoelectronics and nanotechnology, this book: Provides broad and comprehensive coverage from Microelectronics to Nanoelectronics including design in analog and digital electronics. Includes HDL, and VLSI design going into the nanoelectronics arena. Discusses devices, circuit analysis, design methodology, and real-time simulation based on industry standard HSPICE tool. Explores emerging devices such as FinFETs, Tunnel FETs (TFETs) and CNTFETs including their circuit co-designing. Covers real time illustration using industry standard Verilog, Cadence and Synopsys simulations.

Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and senior undergraduate/graduate students in electrical and electronics engineering, microelectronics, nanoelectronics and nanotechnology, this book: Provides broad and comprehensive coverage from Microelectronics to Nanoelectronics including design in analog and digital electronics. Includes HDL, and VLSI design going into the nanoelectronics arena. Discusses devices, circuit analysis, design methodology, and real-time simulation based on industry standard HSPICE tool. Explores emerging devices such as FinFETs, Tunnel FETs (TFETs) and CNTFETs including their circuit co-designing. Covers real time illustration using industry standard Verilog, Cadence and Synopsys simulations.

The Department of Electronics and Communication Engineering of KIET Group of Institutions, Delhi-NCR organized the 4th International Conference ICCE-2020 during November 28-29, 2020. Information compiled in this book is based on the 114 research papers of excellent quality covering different domains of Electronics and Communication Engineering, Computer Science Engineering, Information Technology, Electrical Engineering, Electronics and Instrumentation Engineering. The subject areas treated in the book are: Satellite, Radar and Microwave Techniques, Secure, Smart, and Reliable Networks, Next Generation Networks, Devices & Circuits, Signal & Image Processing, New Emerging Technologies, having the central focus on Recent Trends in Communication & Electronics (ICCE-2020). In addition, a few themes based on Special Sessions have also been conducted in ICCE-2020. The objective of the book resulting from the 4th International Conference on Recent Trends in Communication & Electronics (ICCE-2020) is to provide a resource for the study and research work for an interested audience comprising of researchers, students, audience, and practitioners in the areas of Communications & Computing Systems.

This book focusses on the spacer engineering aspects of novel MOS-based device-circuit co-design in sub-20nm technology node, its process complexity, variability, and reliability issues. It comprehensively explores the FinFET/tri-gate architectures with their circuit/SRAM suitability and tolerance to random statistical variations.

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

This book focusses on the spacer engineering aspects of novel MOS-based device-circuit co-design in sub-20nm technology node, its process complexity, variability, and reliability issues. It comprehensively explores the FinFET/tri-gate architectures with their circuit/SRAM suitability and tolerance to random statistical variations.

Large projects are defining moments for companies and countries. When large projects succeed, they can dramatically improve the social and economic conditions in a region. This book focuses on major aspects of the world’s largest infrastructural, industrial and public service projects through the lens of structuring, valuing, managing risk and financing projects. The book analyses and discuss large projects in government, private and public and private partnership. The author sheds light into the attributes of project finance which have unique structural elements. The book focuses on case studies related to 50 mega projects which includes infrastructural projects, energy related projects, industrial projects, roads, ports and bridges among others. This book covers both the theoretical aspects of financing of mega projects and the practical applications by including case studies of the world’s largest projects in terms of value.

This book presents new knowledge and recent developments in all aspects of computational techniques, mathematical modeling, energy systems, applications of fuzzy sets and intelligent computing. The book is a collection of best selected research papers presented at the International Conference on "Mathematical Modeling, Computational Intelligence Techniques and Renewable Energy," organized by the Department of Mathematics, Pandit Deendayal Petroleum University, in association with Forum for Interdisciplinary Mathematics, Institution of Engineers (IEI) - Gujarat and Computer Society of India (CSI) - Ahmedabad. The book provides innovative works of researchers, academicians and students in the area of interdisciplinary mathematics, statistics, computational intelligence and renewable energy.

The primary aim of this book is to discuss various aspects of nanoscale device design and their applications including transport mechanism, modeling, and circuit applications. . Provides a platform for modeling and analysis of state-of-the-art devices in nanoscale regime, reviews issues related to optimizing the sub-nanometer device performance and addresses simulation aspect and/or fabrication process of devices Also, includes design problems at the end of each chapter

Nanoelectronics: Devices, Circuits and Systems explores current and emerging trends in the field of nanoelectronics, from both a devices-to-circuits and circuits-to-systems perspective. It covers a wide spectrum and detailed discussion on the field of nanoelectronic devices, circuits and systems. This book presents an in-depth analysis and description of electron transport phenomenon at nanoscale dimensions. Both qualitative and analytical approaches are taken to explore the devices, circuit functionalities and their system applications at deep submicron and nanoscale levels. Recent devices, including FinFET, Tunnel FET, and emerging materials, including graphene, and its applications are discussed. In addition, a chapter on advanced VLSI interconnects gives clear insight to the importance of these nano-transmission lines in determining the overall IC performance. The importance of integration of optics with electronics is elucidated in the optoelectronics and photonic integrated circuit sections of this book. This book provides valuable resource materials for scientists and electrical engineers who want to learn more about nanoscale electronic materials and how they are used.

This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.

This book offers detailed insights into spin transfer torque (STT) based devices, circuits and memories. Starting with the basic concepts and device physics, it then addresses advanced STT applications and discusses the outlook for this cutting-edge technology. It also describes the architectures, performance parameters, fabrication, and the prospects of STT based devices. Further, moving from the device to the system perspective it presents a non-volatile computing architecture composed of STT based magneto-resistive and all-spin logic devices and demonstrates that efficient STT based magneto-resistive and all-spin logic devices can turn the dream of instant on/off non-volatile computing into reality.

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Large projects are defining moments for companies and countries. When large projects succeed, they can dramatically improve the social and economic conditions in a region. This book focuses on major aspects of the world's largest infrastructural, industrial and public service projects through the lens of structuring, valuing, managing risk and financing projects. The book analyses and discuss large projects in government, private and public and private partnership. The author sheds light into the attributes of project finance which have unique structural elements. The book focuses on case studies related to 50 mega projects which includes infrastructural projects, energy related projects, industrial projects, roads, ports and bridges among others. This book covers both the theoretical aspects of financing of mega projects and the practical applications by including case studies of the world's largest projects in terms of value.

The primary aim of this book is to discuss various aspects of nanoscale device design and their applications including transport mechanism, modeling, and circuit applications. . Provides a platform for modeling and analysis of state-of-the-art devices in nanoscale regime, reviews issues related to optimizing the sub-nanometer device performance and addresses simulation aspect and/or fabrication process of devices Also, includes design problems at the end of each chapter

This book gathers a collection of high-quality peer-reviewed research papers presented at the 3rd International Conference on Data and Information Sciences (ICDIS 2021), held at Raja Balwant Singh Engineering Technical Campus, Agra, India, on May 14 - 15, 2021. In chapters written by leading researchers, developers, and practitioner from academia and industry, it covers virtually all aspects of computational sciences and information security, including central topics like artificial intelligence, cloud computing, and big data. Highlighting the latest developments and technical solutions, it will show readers from the computer industry how to capitalize on key advances in next-generation computer and communication technology.

Nanoparticles in Green Organic Synthesis: Strategy towards Sustainability presents the fundamental and latest practical uses of metal nanoparticles (MNPs) in organic synthesis, as well as their promising multidimensional applications. The book examines the latest emerging research on MNP synthesis and their applications-from organic transformation to energy and the environment-allowing readers to critically analyze the role of different MNPs in seeking ideas for widespread application. The book covers the fundamentals while also providing a comprehensive account of MNPs and their modification for a variety of green platform-based derivatives, focusing on the multifunctional technological evolution. The book covers a wide range of applications in organic synthesis using a variety of transition-metal-based nanoparticles in both homo- and heterogeneous media. The text details the concept of catalyst design and recent developments in the preparation and characterization of nanomaterials, followed by several chapters on the design of catalysts for specific applications. This volume is a valuable resource for those working in green chemistry, sustainability, material science and engineering, nanotechnology, energy, and the environment.

Covering detailed discussion of fundamental concepts of economics, the textbook commences with comprehensive explanation of theory of consumer behavior, utility maximization and optimal choice, profit function, cost minimization and cost function. The textbook covers methods including present worth method, future worth method, annual worth method, internal rate of return method, explicit re-investment rate of return method and payout method useful for studying economic studies. A chapter on value engineering discusses important topics such as function analysis systems techniques, the value index, value measurement techniques, innovative phase and constraints analysis in depth. It facilitates the understanding of the concepts through illustrations and solved problems. This text is the ideal resource for Indian undergraduate engineering students in the fields of mechanical engineering, computer science and engineering and electronics engineering for a course on engineering economics/engineering economy.

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.