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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology

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Theory and Methods of Quantification Design on System-Level Electromagnetic Compatibility (Hardcover, 1st ed. 2019) Loot Price: R2,839
Discovery Miles 28 390
Theory and Methods of Quantification Design on System-Level Electromagnetic Compatibility (Hardcover, 1st ed. 2019): Donglin...

Theory and Methods of Quantification Design on System-Level Electromagnetic Compatibility (Hardcover, 1st ed. 2019)

Donglin Su, Shuguo Xie, Fei Dai, Yan Liu, Yunfeng Jia

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Loot Price R2,839 Discovery Miles 28 390 | Repayment Terms: R266 pm x 12*

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This book systematically explains the fundamentals of system-level electromagnetic compatibility and introduces the basic concept of system-level electromagnetic compatibility quantification design. The topics covered include the critical technologies in the top-down quantification design of electromagnetic compatibility, quantification design of system-level electromagnetic compatibility, evaluation methods and application examples, quality control and application examples of electromagnetic compatibility development process, and real-world engineering example analysis of electromagnetic compatibility.The book proposes a top-down system-level electromagnetic compatibility quantification design method and is the first book to describe in detail how to quantitatively evaluate and predict system-level electromagnetic compatibility performance. It includes abundant engineering examples and experimental data demonstrating the usage and results of the top-down quantification design methods of system-level electromagnetic compatibility.It enables readers to obtain a thorough understanding of the theory and methods of system-level electromagnetic compatibility quantification design as well as the methodologies for engineering practice.

General

Imprint: Springer Verlag, Singapore
Country of origin: Singapore
Release date: March 2019
First published: 2019
Authors: Donglin Su • Shuguo Xie • Fei Dai • Yan Liu • Yunfeng Jia
Dimensions: 235 x 155mm (L x W)
Format: Hardcover
Pages: 346
Edition: 1st ed. 2019
ISBN-13: 978-981-13-3689-8
Categories: Books > Science & Mathematics > Physics > Optics (light)
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology
LSN: 981-13-3689-X
Barcode: 9789811336898

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