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Books > Science & Mathematics > Physics > Nuclear structure physics

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Low Pressure Plasmas and Microstructuring Technology (Paperback, Softcover reprint of hardcover 1st ed. 2009) Loot Price: R5,562
Discovery Miles 55 620
Low Pressure Plasmas and Microstructuring Technology (Paperback, Softcover reprint of hardcover 1st ed. 2009): Gerhard Franz

Low Pressure Plasmas and Microstructuring Technology (Paperback, Softcover reprint of hardcover 1st ed. 2009)

Gerhard Franz

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Loot Price R5,562 Discovery Miles 55 620 | Repayment Terms: R521 pm x 12*

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Over the last forty years, plasma supported processes have attracted ever - creasing interest, and now, all modern semiconductor devices undergo at least one plasma-involved processing step, starting from surface cleaning via coating to etching. In total, the range of the treated substrates covers some orders of magnitude: Trenches and linewidths of commercially available devices have - ready passed the boundary of 100 nm, decorative surface treatment will happen 2 in the mm range, and the upper limit is reached with surface protecting layers of windows which are coated with ?/4 layers against IR radiation. The rapid development of the semiconductor industry is inconceivable wi- outthegiantprogressintheplasmatechnology.Moore'slawisnotcarvedinto 1 stone, and not only the ITRS map is subject to change every ?ve years but also new branches develop and others mingle together. Moreover, the quality of conventional materials can be improved by plasma treatment: Cottonbecomesmorecrease-resistant, leathermoredurable, andthe shrinking of wool ?bers during the washing process can be signi?cantly reduced. To cut a long story short: More than 150 years after the discovery of the sputtering e?ect by Grove, plasma-based processes are about to spread out into new ?elds of research and application 1]-no wonder that the market for etching machines kept growing by an annual rate of 17 % up to the burst of the internet bubble, and it took only some years of recovery to continue the voyage 2].

General

Imprint: Springer-Verlag
Country of origin: Germany
Release date: October 2010
First published: 2009
Authors: Gerhard Franz
Dimensions: 235 x 155 x 38mm (L x W x T)
Format: Paperback
Pages: 732
Edition: Softcover reprint of hardcover 1st ed. 2009
ISBN-13: 978-3-642-09939-7
Categories: Books > Science & Mathematics > Physics > Nuclear structure physics
Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN: 3-642-09939-4
Barcode: 9783642099397

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