Die-Attach Materials for High Temperature Applications in Microelectronics Packaging - Materials, Processes, Equipment, and Reliability (Hardcover, 1st ed. 2019)

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	February 2019
First published:	2019
Editors:	Kim S. Siow
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Hardcover
Pages:	279
Edition:	1st ed. 2019
ISBN-13:	978-3-319-99255-6
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Mechanical engineering & materials > Production engineering > Reliability engineering Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	3-319-99255-4
Barcode:	9783319992556

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