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Books > Professional & Technical > Mechanical engineering & materials > Production engineering > Reliability engineering
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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging - Materials, Processes, Equipment, and Reliability (Hardcover, 1st ed. 2019)
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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging - Materials, Processes, Equipment, and Reliability (Hardcover, 1st ed. 2019)
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This book presents the scientific principles, processing
conditions, probable failure mechanisms, and a description of
reliability performance and equipment required for implementing
high-temperature and lead-free die attach materials. In particular,
it addresses the use of solder alloys, silver and copper sintering,
and transient liquid-phase sintering. While different solder alloys
have been used widely in the microelectronics industry, the
implementation of sintering silver and transient liquid-phase
sintering remains limited to a handful of companies. Hence, the
book devotes many chapters to sintering technologies, while
simultaneously providing only a cursory coverage of the more
widespread techniques employing solder alloys. Addresses the
differences between sintering and soldering (the current die-attach
technologies), thereby comprehensively addressing principles,
methods, and performance of these high-temperature die-attach
materials; Emphasizes the industrial perspective, with chapters
written by engineers who have hands-on experience using these
technologies; Baker Hughes, Bosch and ON Semiconductor, are
represented as well as materials suppliers such as Indium;
Simultaneously provides the detailed science underlying these
technologies by leading academic researchers in the field.
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