All packaging engineers and technologists who want to ensure that
they give their customers the highest quality, most cost-effective
products should know that the paradigm has shifted. It has shifted
away from the MIL-STDs and other government standards and test
procedures that don't cost-effectively address potential failure
mechanisms or the manufacturing processes of the product. It has
shifted decisively towards tackling the root causes of failure and
the appropriate implementation of cost-effective process controls,
qualityscreens, and tests.
This book's groundbreaking, science-based approach to developing
qualification and quality assurance programs helps engineers reach
a new level of reliability in today's high-performance
microelectronics. It does this with powerful...
* Techniques for identifying and modeling failure mechanisms
earlier in the design cycle, breaking the need to rely on field
data
* Physics-of-failure product reliability assessment methods that
can be proactively implemented throughout the design and
manufacture of the product
* Process controls that decrease variabilities in the end product
and reduce end-of-line screening and testing
A wide range of microelectronic package and interconnect
configurations for both single-and multi-chip modules is examined,
including chip and wire-bonds, tape-automated (TAB), flip-TAB,
flip-chip bonds, high-density interconnects, chip-on-board designs
(COB), MCM, 3-D stack, and many more. The remaining package
elements, such as die attachment, case and lid, leads, and lid and
lead seals are also discussed in detail.
The product of a distinguished team of authors and editors, this
book's guidelines for avoiding potential high-risk manufacturing
and qualification problems, as well as for implementing ongoing
quality assurance, are sure to prove invaluable to both students
and practicing professionals.
For the professional engineer involved in the design and
manufacture of products containing electronic components, here is a
comprehensive handbook to the theory and methods surrounding the
assembly of microelectronic and electronic components. The book
focuses on computers and consumer electronic products with internal
subsystems that reflect mechanical design constraints, cost
limitations, and aesthetic and ergonomic concerns. Taking a total
system approach to packaging, the book systematically examines:
basic chip and computer architecture; design and layout;
interassembly and interconnections; cooling scheme; materials
selection, including ceramics, glasses, and metals; stress,
vibration, and acoustics; and manufacturing and assembly
technology. 1994 (0-471-53299-1) 800 pp.
INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN
GUIDELINES: A Focus on Reliability --Michael Pecht
This comprehensive guide features a uniquely organized time-phased
approach to design, development, qualification, manufacture, and
in-service management. It provides step-by-step instructions on how
to define realistic system requirements, define the system usage
environment, identify potential failure modes, characterize
materials and processes by the key control label factors, and use
experiment, step-stress, and accelerated methods to ensure optimum
design before production begins. Topics covered include: detailed
design guidelines for substrate...wire and wire, tape automated,
and flip-chip bonding...element attachment and case, lead, lead and
lid seals--incorporating dimensional and geometric configurations
of package elements, manufacturing and assembly conditions,
materials selection, and loading conditions. 1993 (0-471-59446-6)
454 pp.
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