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Books > Professional & Technical > Mechanical engineering & materials > Production engineering
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Copper Wire Bonding (Paperback, Softcover reprint of the original 1st ed. 2014)
Loot Price: R4,317
Discovery Miles 43 170
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Copper Wire Bonding (Paperback, Softcover reprint of the original 1st ed. 2014)
Expected to ship within 10 - 15 working days
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This critical volume provides an in-depth presentation of copper
wire bonding technologies, processes and equipment, along with the
economic benefits and risks. Due to the increasing cost of
materials used to make electronic components, the electronics
industry has been rapidly moving from high cost gold to
significantly lower cost copper as a wire bonding material.
However, copper wire bonding has several process and reliability
concerns due to its material properties. Copper Wire Bonding book
lays out the challenges involved in replacing gold with copper as a
wire bond material, and includes the bonding process changes-bond
force, electric flame off, current and ultrasonic energy
optimization, and bonding tools and equipment changes for first and
second bond formation. In addition, the bond-pad metallurgies and
the use of bare and palladium-coated copper wires on aluminum are
presented, and gold, nickel and palladium surface finishes are
discussed. The book also discusses best practices and
recommendations on the bond process, bond-pad metallurgies, and
appropriate reliability tests for copper wire-bonded electronic
components. In summary, this book: Introduces copper wire bonding
technologies Presents copper wire bonding processes Discusses
copper wire bonding metallurgies Covers recent advancements in
copper wire bonding including the bonding process, equipment
changes, bond-pad materials and surface finishes Covers the
reliability tests and concerns Covers the current implementation of
copper wire bonding in the electronics industry Features 120
figures and tables Copper Wire Bonding is an essential reference
for industry professionals seeking detailed information on all
facets of copper wire bonding technology.
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