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Mechanical resonator for hermeticity evaluation of RF MEMS wafer-level packages (Paperback)
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Mechanical resonator for hermeticity evaluation of RF MEMS wafer-level packages (Paperback)
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Total price: R1,643
Discovery Miles: 16 430
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Master's Thesis from the year 2002 in the subject
Electrotechnology, grade: 1.0 (A), University of Applied Sciences
Berlin (FB1), 49 entries in the bibliography, language: English,
comment: CD not included in downloadfile., abstract: Common test
standards for evaluating the hermeticity of microsystem packages
are unsuitable for small MEMS-devices. It is the task of this
Master thesis to create a universal test device to measure and to
compare the hermeticities of different wafer-level packaging
concepts, especially for RF MEMS devices. Resonator structures were
found to be most suitable to measure low pressures and low pressure
changes over time, due to the high sensitivity of their Q-value to
the pressure in the cavity. The resonators are electrostatically
actuated by using a novel coupling concept of the excitation
voltage. The detection of the resonator movement is done by
laser-interferometry. Sensors fulfilling the specific demands were
designed, simulated and fabricated in the cleanroom. The
fabrication process is based on SOI (Silicon On Insulator) wafers.
Finally, the sensors were evaluated and characterized. A suitable
resonator with a length of 500 um reaches a Q-factor of 8070, at an
ambient pressure of 0,02 mbar, and a resonance frequency of 36329
Hz. The sensitivity of the Q-value to pressure change is 4000
%/mbar at 0,02 mbar. This work was carried out within the Summit RF
MEMS project, a collaborative project involving Ericsson, the Royal
Institute of Technology-S3, Acreo and Saab Ericsson Space.
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