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Books > Professional & Technical > Energy technology & engineering > Electrical engineering
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Self-Organized 3D Integrated Optical Interconnects - with All-Photolithographic Heterogeneous Integration (Hardcover)
Loot Price: R3,598
Discovery Miles 35 980
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Self-Organized 3D Integrated Optical Interconnects - with All-Photolithographic Heterogeneous Integration (Hardcover)
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Currently, light waves are ready to come into boxes of computers in
high-performance computing systems like data centers and super
computers to realize intra-box optical interconnects. For inter-box
optical interconnects, light waves have successfully been
introduced by OE modules, in which discrete bulk-chip OE/electronic
devices are assembled using the flip-chip-bonding-based packaging
technology. OE modules, however, are not applicable to intra-box
optical interconnects, because intra-box interconnects involve
"short line distances of the cm-mm order" and "large line counts of
hundreds-thousands." This causes optics excess, namely, excess
components, materials, spaces, fabrication efforts for packaging,
and design efforts. The optics excess raises sizes and costs of
intra-box optical interconnects enormously when they are built
using conventional OE modules. This book proposes the concept of
self-organized 3D integrated optical interconnects and the strategy
to reduce optics excess in intra-box optical interconnects.
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