Interfaces between dissimilar materials are met everywhere in
microelectronics and microsystems. In order to ensure faultless
operation of these highly sophisticated structures, it is mandatory
to have fundamental understanding of materials and their
interactions in the system. In this difficult task, the traditional
method of trial and error is not feasible anymore; it takes too
much time and repeated efforts. In "Interfacial Compatibility in
Microelectronics," an alternative approach is introduced.
In this revised method four fundamental disciplines are
combined: i) thermodynamics of materials ii) reaction kinetics iii)
theory of microstructures and iv) stress and strain analysis. The
advantages of the method are illustrated in "Interfacial
Compatibility in Microelectronics" which includes:
solutions to several common reliability issues in microsystem
technology,
methods to understand and predict failure mechanisms at
interfaces between dissimilar materials and
an approach to DFR based on deep understanding in materials
science, rather than on the use of mechanistic tools, such as
FMEA.
Interfacial Compatibility in Microelectronics provides a clear
and methodical resource for graduates and postgraduates alike."
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