Electronic Engineering and Computing Technology contains sixty-one revised and extended research articles written by prominent researchers participating in the conference. Topics covered include Control Engineering, Network Management, Wireless Networks, Biotechnology, Signal Processing, Computational Intelligence, Computational Statistics, Internet Computing, High Performance Computing, and industrial applications. Electronic Engineering and Computing Technology will offer the state of art of tremendous advances in electronic engineering and computing technology and also serve as an excellent reference work for researchers and graduate students working with/on electronic engineering and computing technology.

Microsystems are an important success factor in the automobile industry. In order to fulfil the customers requests for safety convenience and vehicle economy, and to satisfy environmental requirements, microsystems are becoming indispensable. Thus a large number of microsystem applications came into the discussion. With the international conference AMAA 2002, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacturers.

Intelligent/smart systems have become common practice in many engineering applications. On the other hand, current low cost standard CMOS technology (and future foreseeable developments) makes available enormous potentialities. The next breakthrough will be the design and development of "smart adaptive systems on silicon" i.e. very power and highly size efficient complete systems (i.e. sensing, computing and "actuating" actions) with intelligence on board on a single silicon die. Smart adaptive systems on silicon will be able to "adapt" autonomously to the changing environment and will be able to implement "intelligent" behaviour and both perceptual and cognitive tasks. At last, they will communicate through wireless channels, they will be battery supplied or remote powered (via inductive coupling) and they will be ubiquitous in our every day life.

Although many books deal with research and engineering topics (i.e. algorithms, technology, implementations, etc.) few of them try to bridge the gap between them and to address the issues related to feasibility, reliability and applications. Smart Adaptive Systems on Silicon, though not exhaustive, tries to fill this gap and to give answers mainly to the feasibility and reliability issues.

Smart Adaptive Systems on Silicon mainly focuses on the analog and mixed mode implementation on silicon because this approach is amenable of achieving impressive energy and size efficiency. Moreover, analog systems can be more easily interfaced with sensing and actuating devices.

Desktop or DIY 3D printers are devices you can either buy preassembled as a kit, or build from a collection of parts to design and print physical objects including replacement household parts, custom toys, and even art, science, or engineering projects. Maybe you have one, or maybe you're thinking about buying or building one. Practical 3D Printers takes you beyond how to build a 3D printer, to calibrating, customizing, and creating amazing models, including 3D printed text, a warship model, a robot platform, windup toys, and arcade-inspired alien invaders. You'll learn about the different types of personal 3D printers and how they work; from the MakerBot to the RepRap printers like the Huxley and Mendel, as well as the whiteAnt CNC featured in the Apress book Printing in Plastic. You'll discover how easy it is to find and design 3D models using web-based 3D modeling, and even how to create a 3D model from a 2D image. After learning the basics, this book will walk you through building multi-part models with a steampunk warship project, working with meshes to build your own action heroes, and creating an autonomous robot chassis. Finally, you'll find even more bonus projects to build, including wind-up walkers, faceted vases for the home, and a handful of useful upgrades to modify and improve your 3D printer.

Nanoelectronics, as a true successor of microelectronics, is certainly a major technology boomer in the 21st century. This has been shown by its several applications and also by its enormous potential to influence all areas of electronics, computers, information technology, aerospace defense, and consumer goods. Although the current semiconductor technology is projected to reach its physical limit in about a decade, nanoscience and nanotechnology promise breakthroughs for the future. The present books provides an in-depth review of the latest advances in the technology of nanoelectronic devices and their developments over the past decades. Moreover, it introduces new concepts for the realization of future nanoelectronic devices. The main focus of the book is on three fundamental branches of semiconductor products or applications: logic, memory, and RF and communication. By pointing out to the key technical challenges, important aspects and characteristics of various designs are used to illustrate mechanisms that overcome the technical barriers. Furthermore, by comparing advantages and disadvantages of different designs, the most promising solutions are indicated for each application.

One of the most promising technologies to resolve the bottlenecks in traffic capacity of future wireless networks is multiple-input multiple-output (MIMO) communications and space-time processing. MIMO wireless technology has progressed from the stage of fundamental research to commercially available products within a decade. With over sixty contributors from the field, this book provides an extensive overview of the state-of-the-art in MIMO communications, ranging from its roots in antenna array processing to advanced cellular communication systems. A balanced treatment of three key areas---information theory, algorithms and systems studies, and implementation issues---has been assembled by four editors with a broad range of academic and industry experience. This comprehensive reference will appeal to practitioners, researchers, and graduate students in wireless communications.

So you're interested in Arduino or making your own robots -- but where do you start? What parts are essential, and which are just nice to have? And how do you organize it all? Dale Wheat, the author of Arduino Internals, will show you how to build your own electronics lab complete with tools, parts, and power sources. You'll learn how to create a portable lab, a small lab to save space, and even a lab for small groups and classrooms. You'll learn which parts and tools are indispensable no matter what type projects you're working on: which soldering irons are best, which tools, cables, and testing equipment you'll need. You'll also learn about different chips, boards, sensors, power sources, and which ones you'll want to keep on hand. Finally, you'll learn how to assemble everything for the type of lab best suited to your needs. If you need to carry everything to your local makerspace, you can build the Portable Lab. If you plan to tinker at home or in the garage, there is the Corner Lab. If you're going to run your own local makerspace or you need to set up a lab to teach others, there is the Small-Group Lab.No matter what your gadgeteering needs may be, Building Your Own Electronics Lab will show you exactly how to put it all together so you have what you need to get started. What you'll learn * Essential components of every electronics lab, and how to get them without going broke * The differences between types of electronics parts, accessories, and tools you may need * Designing a lab for portability * Designing a lab to save space * Designing a lab to share space and resources Who this book is for Electronics hobbyists, Arduino enthusiasts, hardware hackers, ham radio tinkerers, or anyone wanting to build their own makerspace. Table of Contents * Planning Your Electronics Workshop * Building Your Tool Chest * Parts -- Both Spare and Not-so-Spare * Portable Mini-Lab * The Corner Lab * The Small-Group Lab * Appendix: Getting Started with Tool-Building

This volume is about automation - automation in design, automation in manufacturing, and automation in production. Automation is essen tial for increased productivity of quality products at reduced costs. That even partial or piecemeal automation of a production facility can deliver dramatic improvements in productivity has been amply demon strated in many a real-life situation. Hence, currently, great ef forts are being devoted to research and development of general as well special methodologies of and tools for automation. This volume re ports on some of these methodologies and tools. In general terms, methodologies for automation can be divided into two groups. There are situations where a process, whether open-loop or closed-loop, is fairly clearly understood. In such a situation, it is possible to create a mathematical model and to prescribe a mathe matical procedure to optimize the output. If such mathematical models and procedures are computationally tractable, we call the correspond ing automation - algorithmic or parametric programming. There is, however, a second set of situations which include process es that are not well understood and the available mathematical models are only approximate and discrete. While there are others for which mathematical procedures are so complex and disjoint that they are computationally intractable. These are the situations for which heuristics are quite suitable for automation. We choose to call such automation, knowledge-based automation or heuristic programming."

Microdroplet technology has recently emerged to provide new and diverse applications via microfluidic functionality, especially in various areas of biology and chemistry. This book, then, gives an overview of the principle components and wide-ranging applications for state-of-the-art of droplet-basedmicrofluidics. Chapter authors are internationally-leading researchers from chemistry, biology, physics and engineering that present various key aspects of micrdroplet technology -- fundamental flow physics, methodology and components for flow control, applications in biology and chemistry, and a discussion of future perspectives. This book acts as a reference for academics, post-graduate students, and researcher wishing to deepen their understand of microfluidics and introduce optimal design and operation of new droplet-based microfluidic devices for more comprehensive analyte assessments."

The strong interaction between the demand for increasing chip functionality and data-processing speeds, and technological trends in the integrated circuit industry, like e.g. shrinking device geometry, growing chip area and increased transistor switching speeds, cause a huge increase in power dissipation for deep sub-micron digital CMOS circuits. Low-Power Deep Sub-micron CMOS Logic, Sub-threshold Current Reduction classifies all power dissipation sources in digital CMOS circuits and provides for a systematic approach of power reduction techniques. A clear distinction has been made between power dissipated to perform a calculation in a certain time frame, i.e. functional power dissipation, and power dissipated even when a circuit is idle, i.e. parasitical power dissipation. The threshold voltage level forms an important link between the functional and the parasitical power dissipation. Since for high data-processing speeds the threshold voltage needs to be low, whereas for low sub-threshold leakage currents it needs to be high. The latter is extremely important for battery operated circuits in standby modes.Therefore, a separate classification of sub-threshold current reduction techniques is presented showing existing and new circuit topologies. Low-Power Deep Sub-micron CMOS Logic, Sub-threshold Current Reduction is a valuable book for researchers, designers as well as students in the field of low-power digital design. Power dissipation is discussed from a fundamental, quantum mechanical and a practical point of view. Theory is accompanied with practical circuit implementations and measurement results.

This book is part of a popular series on the materials science of MEMS devices, first published in 1999. In the years since, many sophisticated devices have emerged and many aspects of MEMS materials behaviors have been characterized. However, there remain many basic questions about the relationship between process, properties and function for MEMS materials. Experimental methods have been developed, but there REMAINS a lack of standardization that would allow comparison between laboratories and commercial vendors or the creation of materials specifications that would enable greater commercialization of MEMS. The book addresses many of these issues including: RF-MEMS; optical MEMS; MEMS metrology, tribology, materials characterization and mechanical behavior; MEMS surfaces, MEMS reliability, packaging and life assessment; MEMS modeling and software tools for materials integration; biocompatibility of MEMS materials and devices; new materials and fabrication methodologies for MEMS; microfluidics and nanofluidics; in vivo drug/gene/protein delivery; novel actuators; MEMS cell-based systems; MEMS neural interfaces; MEMS sensors; and MEMS microengines and microfuel cells.

The contributions to this book cover a wide range of applications of Soft Computing to the chemical domain. The early roots of Soft Computing can be traced back to Lotfi Zadeh's work on soft data analysis [1] published in 1981. 'Soft Computing' itself became fully established about 10 years later, when the Berkeley Initiative in Soft Computing (SISC), an industrial liaison program, was put in place at the University of California - Berkeley. Soft Computing applications are characterized by their ability to: * approximate many different kinds of real-world systems; * tolerate imprecision, partial truth, and uncertainty; and * learn from their environment. Such characteristics commonly lead to a better ability to match reality than other approaches can provide, generating solutions of low cost, high robustness, and tractability. Zadeh has argued that soft computing provides a solid foundation for the conception, design, and application of intelligent systems employing its methodologies symbiotically rather than in isolation. There exists an implicit commitment to take advantage of the fusion of the various methodologies, since such a fusion can lead to combinations that may provide performance well beyond that offered by any single technique.

The total integration of the process of designing, manufacturing, and supporting a product from the earliest conceptual phase to the time it is removed from service remains an unfulfilled dream. Yet, when we look at the enormity of the process of integration even for the most simply conceived and manufactured items, we can recognize that substantial progress has been and is being made. It is our nature to be dissatisfied with near term progress, but when we realize how short a time the tools to do that integration have been available, the progress is clearly noteworthy - considering the multitudes of subjects we have to deal with. Most of the integration problems we confront today are multidisciplinary in nature. They require not only the knowledge and experience in a variety of fields but also good cooperation from different disciplined organizations to adequately comprehend and solve such problems. In Volume I we have many examples that reflect the current state of the art in integration of engineer ing and production processes. The papers for Volume I have been arranged in a more or less logical order of conceptual. design, computer-based modeling, analysis, production, and manufacturing. Chapter I is devoted to those with a design and geometrie modeling emphasis; Chapter II is devoted to an engineering analysis emphasis; and Chapter III to a production/manufacturing emphasis."

The workshop on "The structure of small molecules and ions" was held at the Neve-Han guest house, near Jerusalem, Israel on December 13 to 18 in mem ory of the late Professor Itzhak Plesser. Professor Plesser played a central role in the research done both at the Weizmann Institute and at Argonne National Laboratories on the "Coulomb explosion" method. His friends honored his memory by organizing a meeting in which subjects related to Plesser's interests would be discussed. Just a week be fore the conference started we were struck by another tragedy -the death of our graduate student Ms. Hana Kovner, who participated in many of the Coulomb explosion experiments at the Weizmann Institute. We would like to dedicate these proceedings to her memory as well. The goal of the workshop was to bring together chemists and physicists working on different aspects of the structural problems of small molecular en tities. The time seemed appropriate for discussing experimental and theoretical concepts, since in recent years new methods have been introduced, and a large amount of information has been accumulated on systems not studied before, like unstable molecules, ions, van der Waals molecules and clusters. The program of the workshop reflects, we believe, these new developments. The meeting was characterized by intensive discussions in which the weak nesses and strengths of new and of well established concepts were revealed. We hope that it measured up to the high standards Itzhak Plesser maintained all through his scientific life."

Incentives provided by European governments have resulted in the rapid growth of the photovoltaic (PV) market. Many PV modules are now commercially available, and there are a number of power electronic systems for processing the electrical power produced by PV systems, especially for grid-connected applications. Filling a gap in the literature, Power Electronics and Control Techniques for Maximum Energy Harvesting in Photovoltaic Systems brings together research on control circuits, systems, and techniques dedicated to the maximization of the electrical power produced by a photovoltaic (PV) source. Tools to Help You Improve the Efficiency of Photovoltaic Systems The book supplies an overview of recent improvements in connecting PV systems to the grid and highlights various solutions that can be used as a starting point for further research and development. It begins with a review of methods for modeling a PV array working in uniform and mismatched conditions. The book then discusses several ways to achieve the best maximum power point tracking (MPPT) performance. A chapter focuses on MPPT efficiency, examining the design of the parameters that affect algorithm performance. The authors also address the maximization of the energy harvested in mismatched conditions, in terms of both power architecture and control algorithms, and discuss the distributed MPPT approach. The final chapter details the design of DC/DC converters, which usually perform the MPPT function, with special emphasis on their energy efficiency. Get Insights from the Experts on How to Effectively Implement MPPT Written by well-known researchers in the field of photovoltaic systems, this book tackles state-of-the-art issues related to how to extract the maximum electrical power from photovoltaic arrays under any weather condition. Featuring a wealth of examples and illustrations, it offers practical guidance for researchers and industry professionals who want to implement MPPT in photovoltaic systems.

Electronic Theses and Dissertations examines how electronic publication of theses and dissertations might enhance graduate education. This text clarifies the composition, evaluation, dissemination, and preservation of electronic theses and dissertations (ETDs), and provides a conceptual framework for the development of effective ETD programs. It identifies the main technical concerns related to the adoption of ETD initiatives and contains answers and methods that have proven effective in the longest-running library-group support effort for campus ETDs, making it the foremost guide to the latest innovations, practices, and policies in ETD production, distribution, and institutionalization.

Beams of accelerated particles are of particular importance in researching the structure of matter, for example, the structure of elementary particles and nature of nuclear forces. The present book reviews the problems concerned both with generation of accelerated particles and with application of electron beams for exerting chemical, thermal and other effects on matter. The book is designed for experts specializing in designing and servicing electron accelerators or developing new production processes with the use of accelerated particles.

If you are working in digital signal processing, control or numerical analysis, you will find this authoritative analysis of quantization noise (roundoff error) invaluable. Do you know where the theory of quantization noise comes from, and under what circumstances it is true? Get answers to these and other important practical questions from expert authors, including the founder of the field and formulator of the theory of quantization noise, Bernard Widrow. The authors describe and analyze uniform quantization, floating-point quantization, and their applications in detail. Key features include: - Analysis of floating point round off - Dither techniques and implementation issues analyzed - Offers heuristic explanations along with rigorous proofs, making it easy to understand 'why' before the mathematical proof is given

There is a rapidly expanding literature on the economics of the so called 'new technologies' - especially on those using microelectronic systems. Dr. Jacobsson's book deals with microelectronics-based innovation in machine tools: with the production and use of computer numerically controlled machine tools in the world economy and especially in the Third World. Jacobsson is mainly interested in the implications which CNC machine tools may be expected to have for users and producers in the Newly Industrialising Countries. He approaches this as a problem in applied economics and the book will have a primary interest for those economists whose concern is with the problems of industrialisation in developing countries. It will be parti cularly valuable to those who are preoccupied with the role of local capital goods manufacture and with the technological preconditions for this kind of production. Jacobsson is able to give detailed and specific arguments on these matters as far as CNC machine tools are concerned. In my view, the book has a considerably wider interest and relevance than its specification may at first sight suggest. Jacobsson's achieve ment is not just that he has provided valuable and convincing quantita tive arguments about policy in setting up production of CNC machine tools. In addition, he has set a new and much needed methodological standard for analysis of the impacts of 'new technologies' on the international economy."

This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.

The development of new-generation micro-manufacturing technologies and systems has revolutionised the way products are designed and manufactured today with a s- nificant impact in a number of key industrial sectors. Micro-manufacturing techno- gies are often described as disruptive, enabling and interdisciplinary leading to the creation of whole new classes of products that were previously not feasible to ma- facture. While key processes for volume manufacture of micro-parts such as mach- ing and moulding are becoming mature technologies, micro-assembly remains a key challenge for the cost-effective manufacture of complex micro-products. The ability to manufacture customizable micro-products that can be delivered in variable volumes within relatively short timescales is very much dependent on the level of development of the micro-assembly processes, positioning, alignment and measurement techniques, gripping and feeding approaches and devices. Micro-assembly has developed rapidly over the last few years and all the pred- tions are that it will remain a critical technology for high-value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new gene- tion of micro-products that will establish firmly micro-assembly as a mature manuf- turing process. th The book includes the set of papers presented at the 5 International Precision - sembly Seminar IPAS 2010 held in Chamonix, France from the 14th to the 17th February 2010.

Multiobjective Shape Design in Electricity and Magnetism is entirely focused on electric and magnetic field synthesis, with special emphasis on the optimal shape design of devices when conflicting objectives are to be fulfilled. Direct problems are solved by means of finite-element analysis, while evolutionary computing is used to solve multiobjective inverse problems. This approach, which is original, is coherently developed throughout the whole manuscript. The use of game theory, dynamic optimisation, and Bayesian imaging strengthens the originality of the book. Covering the development of multiobjective optimisation in the past ten years, Multiobjective Shape Design in Electricity and Magnetism is a concise, comprehensive and up-to-date introduction to this research field, which is growing in the community of electricity and magnetism. Theoretical issues are illustrated by practical examples. In particular, a test problem is solved by different methods so that, by comparison of results, advantages and limitations of the various methods are made clear.

The idea of this symposium grew out of our discussions on the need to review the advances that had been made in the theoretical description of inelastic scattering reactions in the last few years. Since a microscopic description of inelastic scattering uses realistic effective interactions, we felt that it was appropriate to begin such a summary with a discussion of the free two-nucleon force. However as we thought further about this review, it became increasingly apparent that a rather more ambitious program linking the free two-nucleon force and nuclear matter calculations both to shell model calculations and to reaction theory, would be appropriate and perhaps even necessary to do full justice to the subject. We hope that the symposium as it emerged did fulfill these aims, better perhaps than we expected. There are some comments required concerning the presentation of the material. First the papers are grouped by session number for convenient gathering of the same topic in the same place. Secondly, because of the rather tight constraint on pages, it was possible to print only those contributions which were presented orally at the symposium. The remainner are included as abstracts. The full text of all the contributed papers is available as a Michigan State University Cyclotron Laboratory Report (MSUCL 39/1971).

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging."

The aim of computer-aided surgery (CAS) is to advance the utilization of computers in the development of new technologies for medical services. The Asian Conference on Computer Aided Surgery (ACCAS) series provides a forum for academic researchers, clinical scientists, surgeons, and industrial partners to exchange new ideas, techniques, and the latest developments in the field. The ACCAS brings together researchers from all fields related to medical activity visualization, simulation and modeling, virtual reality for CAS, image-guided diagnosis and therapies, CAS for minimally invasive intervention, medical robotics and instrumentation, surgical navigation, clinical application of CAS, telemedicine and telesurgery, and CAS education. The ACCAS is also interested in promoting collaboration among people from different disciplines and different countries in Asia and the world. This volume helps to achieve that goal and is a valuable resource for researchers and clinicians in the field.