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Plasma Charging Damage (Paperback, Softcover reprint of the original 1st ed. 2001)
Loot Price: R5,191
Discovery Miles 51 910
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Plasma Charging Damage (Paperback, Softcover reprint of the original 1st ed. 2001)
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In the 50 years since the invention of transistor, silicon
integrated circuit (IC) technology has made astonishing advances. A
key factor that makes these advances possible is the ability to
have precise control on material properties and physical
dimensions. The introduction of plasma processing in pattern
transfer and in thin film deposition is a critical enabling advance
among other things. In state of the art silicon Ie manufacturing
process, plasma is used in more than 20 different critical steps.
Plasma is sometimes called the fourth state of matter (other than
gas, liquid and solid). It is a mixture of ions (positive and
negative), electrons and neutrals in a quasi-neutral gaseous steady
state very far from equilibrium, sustained by an energy source that
balances the loss of charged particles. It is a very harsh
environment for the delicate ICs. Highly energetic particles such
as ions, electrons and photons bombard the surface of the wafer
continuously. These bombardments can cause all kinds of damage to
the silicon devices that make up the integrated circuits.
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