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Books > Professional & Technical > Technology: general issues > Nanotechnology
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Design of 3D Integrated Circuits and Systems (Paperback)
Loot Price: R1,399
Discovery Miles 13 990
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Design of 3D Integrated Circuits and Systems (Paperback)
Series: Devices, Circuits, and Systems
Expected to ship within 12 - 17 working days
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Total price: R1,419
Discovery Miles: 14 190
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Three-dimensional (3D) integration of microsystems and subsystems
has become essential to the future of semiconductor technology
development. 3D integration requires a greater understanding of
several interconnected systems stacked over each other. While this
vertical growth profoundly increases the system functionality, it
also exponentially increases the design complexity. Design of 3D
Integrated Circuits and Systems tackles all aspects of 3D
integration, including 3D circuit and system design, new processes
and simulation techniques, alternative communication schemes for 3D
circuits and systems, application of novel materials for 3D
systems, and the thermal challenges to restrict power dissipation
and improve performance of 3D systems. Containing contributions
from experts in industry as well as academia, this authoritative
text: Illustrates different 3D integration approaches, such as
die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of
interposer technology and the role of Through-Silicon Vias (TSVs)
Presents the latest improvements in three major fields of thermal
management for multiprocessor systems-on-chip (MPSoCs) Explores
ThruChip Interface (TCI), NAND flash memory stacking, and emerging
applications Describes large-scale integration testing and
state-of-the-art low-power testing solutions Complete with
experimental results of chip-level 3D integration schemes tested at
IBM and case studies on advanced complementary
metal-oxide-semiconductor (CMOS) integration for 3D integrated
circuits (ICs), Design of 3D Integrated Circuits and Systems is a
practical reference that not only covers a wealth of design issues
encountered in 3D integration but also demonstrates their impact on
the efficiency of 3D systems.
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