* describes new advances in development of detection systems based on CdZnTe (CZT) and CdTe detectors utilizing a direct conversion of radiation to electric signals * reports a recent progress in technologies and performance of silicon photomultipliers (SiPM) used for reading the light from scintillators * explores exciting new application opportunities created by development of the cutting-edge detection technologies in X-ray spectroscopy, Computed Tomography (CT), bone dosimetry, and nuclear medicine (PET, SPECT) * considers the future use of photon counting detectors in clinical computed tomography (CT) scanners providing K-edge imaging to reduce the amount of contrast agents and ultimately offering both an anatomical and a functional information * describes, uses of radiation detection systems in security applications such as luggage scanning, dirty bomb detection, and border control

The advances in semiconductor detectors, scintillators, photodetectors such as silicon photomultipliers (SiPM), and reaodut electronics have experienced tremendous growth in recent years in terms of basic technologies and variety of applications.The second edition of the book Radiation Detection Systems presents variety of radiation detection systems giving readers a broad view of the state-of-the-art in the design of detectors, front-end electronics and systems offering optimized choices of the detection tools for a particular application. The new edition has been divided into two volumes. This first volume, on Sensor Materials, Systems, Technology and Characterization Measurements puts emphasis on sensor materials, detector structures, front electronics technology and their designs as well as system optimization for different applications. Also, the book include characterization measurements of the developed detection systems. Featuring contributions from leading experts and pioneers in their respective fields, this book * describes progress in growth technologies of cadmium zinc telluride (CdZnTe) and cadmium telluride (CdTe) materials * shows variety of specific detector structure designs and their integration with front-end amplification/processing electronics * presents detection systems based on CdZnTe and CdTe detector technologies that are optimized for specific applications. The designed systems are characterized in terms of their spectral responses, spatial and timing resolutions * addresses incomplete charge collection, pulse pileup, charge sharing between neighboring detector pixels and other phenomena that can degrade the spectral response of photon-counting detectors * reports new developments of silicon photomultipliers used for reading the light from scintillators that starting to make a big impact particularly in the design concepts of novel medical instrumentation With its combined coverage of new materials and innovative new system approaches, as well as a succinct overview of recent developments, this book is an invaluable tool for any engineer, professional, or student working in electronics or an associated field. Readers can refer to the second book to get a detailed understanding of more specific applications of the detection systems in medical imaging, industrial testing and security applications.

This book describes the physics of phase change memory devices, starting from basic operation to reliability issues. The book gives a comprehensive overlook of PCM with particular attention to the electrical transport and the phase transition physics between the two states. The book also contains design engineering details on PCM cell architecture, PCM cell arrays (including electrical circuit management), as well as the full spectrum of possible future applications.

This reference text discusses principles, design, and applications of various types of multiplier-cum-divider circuits (MCDs), and covers applications of operational amplifiers to perform as MCDs circuits The text covers principles of multiplying circuits, dividing circuits, square rooting, and vector magnitude circuits in detail. It discusses how multiplier-cum-divider circuits are developed with saw tooth and triangular waves. It covers important topics including non-linear op-amp circuits, triangular wave referenced multiplier-cum-divider with multiplexes, saw tooth wave referenced MCD with analog switches, peak responding MCD with analog switches and triangular wave referenced MCD with analog switches. The text will be useful for senior undergraduate, graduate students, and professionals in the fields of electrical engineering, and electronics and communication engineering.

Safety or protective grounding is of vital importance for the protection of individuals from electric shock and structures and industrial concerns from potentially damaging lightning and electrostatic discharges. To many electrical engineers the notion of grounding is nebulous and safety grounding is quite often confused with neutral grounding of the power supply. The main objective of this book is to give the reader a better understanding of safety grounding, why it is needed, where it is needed, and what are the requirements which must be met in order to have an effective grounding system. The text as a whole serves to provide the reader with the necessary background for a better appreciation of the various National and International Standards concerned with safety grounding. This book gives the reader a good understanding of the fundamentals of safety grounding. It is a practical guide that provides a comprehensive coverage of all types of grounding requirements and is intended for students and practicing electrical engineers alike. Summarizes the physiological effects of current on the human body and the effect of current duration Gives the various methods of measuring soil resistivity and measuring the resistance to ground of an electrode or grounding system Reviews different types of ground electrodes and the effect of their geometry and numbers on the resistance to ground Presents the components of a ground system, methods of improving soil resistivity, the types of welds and joints, the criteria for determining conductor cross-sections, galvanic corrosion, and a survey of the different grounding practices used at substations and the different types of grounding systems used for the protection of consumers Deals with electrostatic and lightning hazards that can cause serious damage and the measures used to protect against such damage Throughout the text frequent reference is made to various National and International Standards and their requirements as compliance with these standards is highly advised Asser A. Zaky, Ph.D., FIET, F.Inst.P., FIEEE, is Emeritus Professor of Electrical Engineering at University of Alexandria, Egypt.

This book explores novel methods for implementing X-ray diffraction technology as an imaging modality, which have been made possible through recent breakthroughs in detector technology, computational power, and data processing algorithms. The ability to perform fast, spatially-resolved X-ray diffraction throughout the volume of a sample opens up entirely new possibilities in areas such as material analysis, cancer diagnosis, and explosive detection, thus offering the potential to revolutionize the fields of medical, security, and industrial imaging and detection. Featuring chapters written by an international selection of authors from both academia and industry, the book provides a comprehensive discussion of the underlying physics, architectures, and applications of X-ray diffraction imaging that is accessible and relevant to neophytes and experts alike. Teaches novel methods for X-ray diffraction imaging Comprehensive and self-contained discussion of the relevant physics, imaging techniques, system components, and data processing algorithms Features state-of-the-art work of international authors from both academia and industry. Includes practical applications in the medical, industrial, and security sectors

This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.

This book provides comprehensive coverage of Network-on-Chip (NoC) security vulnerabilities and state-of-the-art countermeasures, with contributions from System-on-Chip (SoC) designers, academic researchers and hardware security experts. Readers will gain a clear understanding of the existing security solutions for on-chip communication architectures and how they can be utilized effectively to design secure and trustworthy systems.

"Complete dependence on semiconductor vendors' application notes and data sheets is now a thing of the past thanks to this all-in-one comparison text on nonvolatile semiconductor memory (NVSM) technology. Working electronics engineers can now refer to this book to access the technical data and applications-focused perspective they need to make intelligent decisions regarding the selection, specification, procurement, and application of NVSM devices.
The most comprehensive book in the field, NONVOLATILE SEMICONDUCTOR MEMORY TECHNOLOGY gathers expertly-written information scattered throughout device literature in a single, well-balanced volume. This book features an in-depth overview accompanied by applications-oriented chapters on device reliability and endurance, radiation tolerance, as well as device physics and design. It is an essential reference for electronics engineers."
Sponsored by:
IEEE Components, Packaging, and Manufacturing Technology Society, IEEE Solid-State Circuits Council/Society.

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits. The design of I/O protection circuits has been done in a hit-or-miss way due to the lack of systematic analysis tools and concrete design guidelines. In general, the development of on-chip protection structures is a lengthy expensive iterative process that involves tester design, fabrication, testing and redesign. When the technology is changed, the same process has to be repeated almost entirely. This can be attributed to the lack of efficient CAD tools capable of simulating the device behavior up to the onset of failure which is a 3-D electrothermal problem. For these reasons, it is important to develop and use an adequate measure of the EOS robustness of integrated circuits in order to address the on-chip EOS protection issue. Fundamental understanding of the physical phenomena leading to device failures under ESD/EOS events is needed for the development of device models and CAD tools that can efficiently describe the device behavior up to the onset of thermal failure. Modeling of Electrical Overstress in Integrated Circuits is for VLSI designers and reliability engineers, particularly those who are working on the development of EOS/ESD analysis tools. CAD engineers working on development of circuit level and device level electrothermal simulators will also benefit from the material covered. This book will also be of interest to researchers and first and second year graduate students working in semiconductor devices and IC reliability fields.

This book provides an introduction to Bluetooth technology, with a specific focus on developing a hardware architecture for its modem. The major concepts and techniques involved in Bluetooth technology are discussed, with special emphasis on hardware mapping. The book starts simply to allow the reader to master quickly the basic concepts, before addressing the advanced features. This book differs from existing content in that it presents Bluetooth Transceiver architecture suitable for implementation in an FPGA for IoT Devices. It will examine several digital algorithms for modulation and demodulation of Bluetooth signals, locking on the carrier phase, and synchronizing the symbol. Many of these previously analog designs have been translated to the digital domain.

This book discusses design techniques, layout details and measurements of several key analog building blocks that currently limit the performance of 5G and E-Band transceivers implemented in deep-scaled CMOS. The authors present recent developments in low-noise quadrature VCOs and tunable inductor-less frequency dividers. Moreover, the design of low-loss broadband transformer-based filters that realize inter-stage matching, power division/combining and impedance transformation is discussed in great detail. The design and measurements of a low-noise amplifier, a downconverter and a highly-linear power amplifier that leverage the proposed techniques are shown. All the prototypes were realized in advanced nanometer scaled CMOS technologies without RF thick to metal option.

"Op Amps for Everyone" is an indispensable guide and reference for designing circuits that are reliable, have low power consumption, and are as small and low-cost as possible. Operational amplifiers are essential in modern electronics design, and are used in medical devices, communications technology, optical networks, and sensor interfacing.

This book is informed by the authors' years of experience, wisdom and expertise, giving engineers all the methods, techniques and tricks that they need to optimize their analog electronic designs.

With this book you will learn: Single op amp designs that get the most out of every amplifier Which specifications are of most importance to your design, enabling you to narrow down the list of amplifiers to those few that are most suitable Strategies for making simple "tweaks" to the design - changes that are often apparent once a prototype has been constructedHow to design for hostile environments - extreme temperatures, high levels of shock, vibration, and radiation - by knowing what circuit parameters are likely to degrade and how to counteract that degradation

New to this edition: Unified design procedures for gain and offset circuits, and filter circuitsTechniques for voltage regulator designInclusion of design utilities for filter design, gain and offset, and voltage regulationAnalysis of manufacturer design aids Companion website with downloadable material
A complete, cookbook-style guide for designing and building analog circuits A multitude of workable designs that are ready to use, based on real-world component values from leading manufacturers using readily available componentsA treasure trove of practical wisdom: strategies to tweak a design; guidelines for developing the entire signal chain; designing for hostile environments, and more

This book summarizes the key scientific outcomes of the Horizon 2020 research project TULIPP: Towards Ubiquitous Low-power Image Processing Platforms. The main focus lies on the development of high-performance, energy-efficient embedded systems for the growing range of increasingly complex image processing applications. The holistic TULIPP approach is described in the book, which addresses hardware platforms, programming tools and embedded operating systems. Several of the results are available as open-source hardware/software for the community. The results are evaluated with several use cases taken from real-world applications in key domains such as Unmanned Aerial Vehicles (UAVs), robotics, space and medicine. Discusses the development of high-performance, energy-efficient embedded systems for the growing range of increasingly complex image processing applications; Covers the hardware architecture of embedded image processing systems, novel methods, tools and libraries for programming those systems as well as embedded operating systems to manage those systems; Demonstrates results with several challenging applications, such as medical systems, robotics, drones and automotive.

Discusses construction and working of sensors including ultrasonic sensor, temperature sensor and optical sensor. Covers construction, working, programming and interfacing of IO devices. Discusses programming, interfacing construction, and working of relay with Arduino board for controlling high voltage devices. Covers interfacing diagram of devices with Arduino board. Provides videos demonstrating implementation of programs on Arduino board.

This book introduces the foundations and fundamentals of electronic circuits. It broadly covers the subjects of circuit analysis, as well as analog and digital electronics. It features discussion of essential theorems required for simplifying complex circuits and illustrates their applications under different conditions. Also, in view of the emerging potential of Laplace transform method for solving electrical networks, a full chapter is devoted to the topic in the book. In addition, it covers the physics and technical aspects of semiconductor diodes and transistors, as well as discrete-time digital signals, logic gates, and combinational logic circuits. Each chapter is presented as complete as possible, without the reader having to refer to any other book or supplementary material. Featuring short self-assessment questions distributed throughout, along with a large number of solved examples, supporting illustrations, and chapter-end problems and solutions, this book is ideal for any physics undergraduate lecture course on electronic circuits. Its use of clear language and many real-world examples make it an especially accessible book for students unfamiliar or unsure about the subject matter.

This book introduces readers to the latest advances in sensing technology for a broad range of non-volatile memories (NVMs). Challenges across the memory technologies are highlighted and their solutions in mature technology are discussed, enabling innovation of sensing technologies for future NVMs. Coverage includes sensing techniques ranging from well-established NVMs such as hard disk, flash, Magnetic RAM (MRAM) to emerging NVMs such as ReRAM, STTRAM, FeRAM and Domain Wall Memory will be covered.

This book gives a detailed analysis of switched-capacitor DC-DC converters that are entirely integrated on a single chip and establishes that these converters are mainly limited by the large parasitic coupling, the low capacitor energy density, and the fact that switched-capacitor converter topologies only have a fixed voltage conversion ratio. The authors introduce the concept of Advanced Multiphasing as a way to circumvent these limitations by having multiple out-of-phase parallel converter cores interact with each other to minimize capacitor charging losses, leading to several techniques that demonstrate record efficiency and power-density, and even a fundamentally new type of switched-capacitor topology that has a continuously-scalable conversion ratio. Provides single-source reference to the recently-developed Advanced Multiphasing concept; Enables greatly improved performance and capabilities in fully integrated switched-capacitor converters; Enables readers to design DC-DC converters, where multiple converter cores are put in parallel and actively interact with each other over several phases to improve their capabilities.

This book covers evolution, concept and applications of modern semiconductor devices such as tunnel field effect transistors (TFETs), vertical super-thin body MOSFETs, ion sensing FETs (ISFETs), non-conventional solar cells, opto-electro mechanical devices and thin film transistors (TFTs). Comprising of theory, experimentation and applications of devices, the chapters describe state-of-art methods and techniques which shall be highly assistive in having an overall perspective on emerging technologies and working on a research area. The book is aimed at the scholars, enthusiasts and researchers who are currently working on devices in the contemporary era of semiconductor devices. Additionally, the chapters are lucid and descriptive and carry the potential of serving as a reference book for scholars in their undergraduate studies, who are looking ahead for a prospective career in semiconductor devices.

Design of analog multipliers discusses what an analog multiplier and its related types is, how different types of analog multipliers are implemented with analog two to one multiplexers and op-amps, and how the types of analog multipliers are implemented with transistors and op-amps. Describing forty-eight analog multiplier circuits, book explains six building blocks as integrator, comparator, switch, low pass filter, peak detector and sample & hold circuit. All analog multiplier circuits presented in this book use a maximum of four operational amplifiers which will enable the readers to simulate the multipliers with minimum number of components and use for their application at low cost.

This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.

This book is a summary of a series of achievements made by the authors and colleagues in the areas of radio frequency power amplifier modeling (including neural Volterra series modeling, neural network modeling, X-parameter modeling), nonlinear analysis methods, and power amplifier predistortion technology over the past 10 years. The book is organized into ten chapters, which respectively describe an overview of research of power amplifier behavioral models and predistortion technology, nonlinear characteristics of power amplifiers, power amplifier behavioral models and the basis of nonlinear analysis, an overview of power amplifier predistortion, Volterra series modeling of power amplifiers, power amplifier modeling based on neural networks, power amplifier modeling with X-parameters, the modeling of other power amplifiers, nonlinear circuit analysis methods, and predistortion algorithms and applications. Blending theory with analysis, this book will provide researchers and RF/microwave engineering students with a valuable resource.

Technological advances in the field of materials, devices, circuits, and systems began by the discovery of new properties of objects, or the entrepreneurship with the applications of unique or practical concepts for commercial goods. To implement products using these findings and challenges textbook knowledge is usually sufficient. "Semiconductor Technologies in the Era of Electronics" therefore does not aim to look deeper in certain areas but it offers a broad and comprehensive overview of the field to:

- Experts of specific knowledge who want to expand the overall understanding to different areas
- Persons who wish to understand the principle of electronic devices often seen in everyday life
- Entrepreneurs interested in the innovations and changes of semiconductor technologies and overall electronics industry

Aprofound and theoretical approach is therefore used and special cases essential to understanding these important concept are presented."

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world's foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.