The book presents laboratory experiments concerning ARM microcontrollers, and discusses the architecture of the Tiva Cortex-M4 ARM microcontrollers from Texas Instruments, describing various ways of programming them. Given the meager peripherals and sensors available on the kit, the authors describe the design of Padma - a circuit board with a large set of peripherals and sensors that connects to the Tiva Launchpad and exploits the Tiva microcontroller family's on-chip features. ARM microcontrollers, which are classified as 32-bit devices, are currently the most popular of all microcontrollers. They cover a wide range of applications that extend from traditional 8-bit devices to 32-bit devices. Of the various ARM subfamilies, Cortex-M4 is a middle-level microcontroller that lends itself well to data acquisition and control as well as digital signal manipulation applications. Given the prominence of ARM microcontrollers, it is important that they should be incorporated in academic curriculums. However, there is a lack of up-to-date teaching material - textbooks and comprehensive laboratory manuals. In this book each of the microcontroller's resources - digital input and output, timers and counters, serial communication channels, analog-to-digital conversion, interrupt structure and power management features - are addressed in a set of more than 70 experiments to help teach a full semester course on these microcontrollers. Beyond these physical interfacing exercises, it describes an inexpensive BoB (break out board) that allows students to learn how to design and build standalone projects, as well a number of illustrative projects.

This book describes vector network analyzer measurements and uncertainty assessments, particularly in waveguide test-set environments, in order to establish their compatibility to the International System of Units (SI) for accurate and reliable characterization of communication networks. It proposes a fully analytical approach to measurement uncertainty evaluation, while also highlighting the interaction and the linear propagation of different uncertainty sources to compute the final uncertainties associated with the measurements. The book subsequently discusses the dimensional characterization of waveguide standards and the quality of the vector network analyzer (VNA) calibration techniques. The book concludes with an in-depth description of the novel verification artefacts used to assess the performance of the VNAs. It offers a comprehensive reference guide for beginners to experts, in both academia and industry, whose work involves the field of network analysis, instrumentation and measurements.

This book discusses control units represented by the model of a finite state machine (FSM). It contains various original methods and takes into account the peculiarities of field-programmable gate arrays (FPGA) chips and a FSM model. It shows that one of the peculiarities of FPGA chips is the existence of embedded memory blocks (EMB). The book is devoted to the solution of problems of logic synthesis and reduction of hardware amount in control units. The book will be interesting and useful for researchers and PhD students in the area of Electrical Engineering and Computer Science, as well as for designers of modern digital systems.

Common Waveform Analysis, which will be of interest to both electrical engineers and mathematicians, applies the classic Fourier analysis to common waveforms. The following questions are answered: Can a signal be considered a superposition of common waveforms with different frequencies? How can a signal be decomposed into a series of common waveforms? How can a signal best be approximated using finite common waveforms? How can a combination of common waveforms that equals a given signal at N uniform points be found? Can common waveforms be used in techniques that have traditionally been based on sine-cosine functions? Common Waveform Analysis represents the most advanced research available to research scientists and scholars working in fields related to the area.

Features The first book to unify the lumped-element modelling techniques for various inductively-coupled pulsed accelerator implementations. Discussion of modelling different accelerators in a coherent, rigorous manner, demonstrating the similarities and differences for each type. Authored by authorities in the field.

Enabling Technologies for the Internet of Things: Wireless Circuits, Systems and Networks collects slides and notes from the lectures given in the 2017 Seasonal School Enabling Technologies for the Internet-of-Things, supported by IEEE CAS Society and by INTEL funding, and organized by Prof. Sergio Saponara, and Prof. Giuliano Manara. The book discusses new trends in Internet-of-Things (IoT) technologies, considering technological and training aspects, with special focus on electronic and electromagnetic circuits and systems. IoT involves research and design activities both in analog and in digital circuit/signal domains, including focus on sensors interfacing and conditioning, energy harvesting, low-power signal processing, wireless connectivity and networking, functional safety (FuSa). FuSa is one of the emerging key issues in IoT applications in safety critical domain like industry 4.0, autonomous and connected vehicles and e-health. Our world is becoming more and more interconnected. Currently it is estimated that two hundred billion smart objects will be part of the IoT by 2020. This new scenario will pave the way to innovative business models and will bring new experiences in everyday life. The challenge is offering products, services and comprehensive solutions for the IoT, from technology to intelligent and connected objects and devices to connectivity and data centers, enhancing smart home, smart factory, autonomous driving cars and much more, while at the same time ensuring the highest safety standards. In safety-critical contexts, where a fault could jeopardize the human life, safety becomes a key aspect.

This book covers the theory, modeling, and implementation of different RF energy harvesting systems. RF energy harvesting is the best choice among the existing renewable energy sources, in terms of availability, cost, size, and integration with other systems. The device used for harvesting RF energy is called rectenna. A rectenna can work at the microwave, millimeter-wave, and terahertz waves. It also has the capability to operate at optical frequencies to be used for 6G and beyond communication systems. This book covers all aspects of wireless power transfer (WPT)/wireless energy harvesting (WEH), basics, theoretical concepts, and advanced developments occurring in the field of energy harvesting. It also covers the design theory for different types of antenna, rectifier, and impedance matching circuits used in RF energy harvesting systems. Different future and present applications, such as charging of vehicles, smart medical health care, self-driven e-vehicles, self-sustainable home automation system, and wireless drones, have also been discussed in detail.

This book provides a practical guide to terahertz electronics, especially for readers with an electronics background. The author guides readers through the all the key concepts of terahertz electronics, including terahertz sources, detectors, and waveguides, together with reviews on key terahertz applications on spectroscopy, imaging, communication, and radar. This book will serve as a handy reference for graduate students and engineers in the field of terahertz with a viewpoint from electronics. Presents the topic of terahertz from electronics viewpoint; Designed to be particularly helpful for the readers familiar with semiconductor devices and circuits; Enables optics-based terahertz researchers to understand terahertz electronics; Based on the author's extensive experience from both industry and academia.

Embedded System Design: Modeling, Synthesis and Verification introduces a model-based approach to system level design. It presents modeling techniques for both computation and communication at different levels of abstraction, such as specification, transaction level and cycle-accurate level. It discusses synthesis methods for system level architectures, embedded software and hardware components. Using these methods, designers can develop applications with high level models, which are automatically translatable to low level implementations. This book, furthermore, describes simulation-based and formal verification methods that are essential for achieving design confidence. The book concludes with an overview of existing tools along with a design case study outlining the practice of embedded system design. Specifically, this book addresses the following topics in detail:

. System modeling at different abstraction levels

. Model-based system design

. Hardware/Software codesign

. Software and Hardware component synthesis

. System verification

This book is for groups within the embedded system community: students in courses on embedded systems, embedded application developers, system designers and managers, CAD tool developers, design automation, and system engineering.

This book provides an in-depth introduction to the newest technologies for designing wireless power transfer systems for medical applications. The authors present a systematic classification of the various types of wireless power transfer, with a focus on inductive power coupling. Readers will learn to overcome many challenges faced in the design a wirelessly powered implant, such as power transfer efficiency, power stability, and the size of power antennas and circuits. This book focuses exclusively on medical applications of the technology and a batteryless capsule endoscopy system and other, real wirelessly powered systems are used as examples of the techniques described.

This is an open access book. Important tasks must be completed on time and with guaranteed quality; that is the consensus reached by system designers and users. However, for too long, important tasks have often been given unnecessary urgency, and people intuitively believe that important tasks should be executed first so that their performance can be guaranteed. Actually, in most cases, their performance can be guaranteed even if they are executed later, and the "early" resources can be utilized for other, more urgent tasks. Therefore, confusing importance with urgency hinders the proper use of system resources. In 2007, mixed criticality was proposed to indicate that a system may contain tasks of various importance levels. Since then, system designers and users have distinguished between importance and urgency. In the industrial field, due to the harsh environment they operate in, industrial wireless networks' quality of service (QoS) has always been a bottleneck restricting their applications. Therefore, this book introduces criticality to label important data, which is then allocated more transmission resources, ensuring that important data's QoS requirements can be met to the extent possible. To help readers understand how to apply mixed-criticality data to industrial wireless networks, the content is divided into three parts. First, we introduce how to integrate the model of mixed-criticality data into industrial wireless networks. Second, we explain how to analyze the schedulability of mixed-criticality data under existing scheduling algorithms. Third, we present a range of novel scheduling algorithms for mixed-criticality data. If you want to improve the QoS of industrial wireless networks, this book is for you.

A subtle change that leads to disastrous consequences-hardware Trojans undoubtedly pose one of the greatest security threats to the modern age. How to protect hardware against these malicious modifications? One potential solution hides within logic locking; a prominent hardware obfuscation technique. In this book, we take a step-by-step approach to understanding logic locking, from its fundamental mechanics, over the implementation in software, down to an in-depth analysis of security properties in the age of machine learning. This book can be used as a reference for beginners and experts alike who wish to dive into the world of logic locking, thereby having a holistic view of the entire infrastructure required to design, evaluate, and deploy modern locking policies.

A practical, comprehensive survey of SOI CMOS devices and circuits for microelectronics engineers

The microelectronics industry is becoming increasingly dependent on SOI CMOS VLSI devices and circuits. This book is the first to address this important topic with a practical focus on devices and circuits. It provides an up-to-date survey of the current knowledge regarding SOI device behaviors and describes state-of-the-art low-voltage CMOS VLSI analog and digital circuit techniques.

Low-Voltage SOI CMOS VLSI Devices and Circuits covers the entire field, from basic concepts to the most advanced ideas. Topics include:

• SOI device behavior: fundamental and floating body effects, hot carrier effects, sensitivity, reliability, self-heating, breakdown, ESD, dual-gate devices, accumulation-mode devices, short channel effects, and narrow channel effects
• Low-voltage SOI digital circuits: floating body effects, DRAM, SRAM, static logic, dynamic logic, gate array, CPU, frequency divider, and DSP
• Low-voltage SOI analog circuits: op amps, filters, ADC/DAC, sigma-delta modulators, RF circuits, VCO, mixers, low-noise amplifiers, and high-temperature circuits

With over 300 references to the state of the art and over 300 important figures on low-voltage SOI CMOS devices and circuits, this volume serves as an authoritative, reliable resource for engineers designing these circuits in high-tech industries.

This book provides an invaluable reference to Piezoelectric Accelerometers with Integral Electronics (IEPE). It describes the design and performance parameters of IEPE accelerometers and their key elements, PE transducers and FET-input amplifiers. Coverage includes recently designed, low-noise and high temperature IEPE accelerometers. Readers will benefit from the detailed noise analysis of the IEPE accelerometer, which enables estimation of its noise floor and noise limits. Other topics useful for designers of low-noise, high temperature silicon-based electronics include noise analysis of FET amplifiers, experimental investigation and comparison of low-frequency noise in different JFETs and MOSFETs, and ultra-low-noise JFETs (at level of 0.6 nV/ Hz). The discussion also includes ultra-low-noise (at level of 3 ng/ Hz) seismic IEPE accelerometers and high temperature (up to 175 C) triaxial and single axis miniature IEPE accelerometers, along with key factors for their design. * Provides a comprehensive reference to the design and performance of IEPE accelerometers, including low-noise and high temperature IEPE sensors; * Includes noise analysis of the IEPE accelerometer, which enables estimation of the its noise floor and noise limits; * Describes recently design of ultra-low-noise (at level of 3 ng/ Hz) IEPE seismic accelerometers and high temperature (up to 175 C) triaxial and single axis miniature IEPE accelerometers; * Compares low-frequency noise in different JFETs and MOSFETs including measurement results of ultra-low-noise (at level of 0.6 nV/ Hz) JFET; * Presents key factors for design of low-noise and high temperature IEPE accelerometer and their electronics.

This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.

This new edition covers the theory and design techniques of the major types of radio-frequency power amplifiers (also named resonant DC-to-AC power inverters). Included are descriptions of Class A, B, AB, C, D, E, DE, and F RF power amplifiers which are used primarily in radio transmitters. The second edition has been completely revised and updated for a new generation of students and design engineers. Some examples are replaced by new and better examples, with many more added. Some end-of-chapter problems are replaced by new problems, and more have been added. More rigorous treatment of many concepts is seen in all chapters (plus all typographical errors have been corrected since the first edition). Chapter 1: Introduction containsmore in-depth coverage of radio communication systems, statistics of transmitter output power level and long-term average transmitter efficiency, and transmitter noise. Many students who take related classes based on the book do not have sufficient background in communications systems, and this updated chapter will help them in their studies. Two brand chapters have been added - the first -Chapter 11 - describes RF power amplifiers with dynamic power supplies. It details the improvement of the efficiency of nearly linear RF power amplifiers (Class A and AB) by the application of a variable supply voltage of RF power amplifiers, as opposed to fixed voltage power supplies, where a variable envelope signals are amplified, such as AM signals. This chapter also covers the applications of variable voltage supply as an AM modulator for RF power amplifiers, where the transistors are operated as switches. The second brand new chapter (Chapter 12) describes RF LC oscillators; an integral part of RF transmitters and also RF receivers. Chapter 8 (Class F RF Power Amplifiers) has been completely revised to cover the latest research results in this area. Old examples are replaced by new examples based on the new equations. Chapter 9 (Linearization and Efficiency Improvements of RF Power Amplifiers) has been extended to include new research results. In the author's experience, some students who take classes based on the first edition do not have sufficient background in electronics. To resolve this, he has added descriptions of operation of transistors as dependent-current sources and as switches. The author has added coverage of transistor current and voltage stresses, and information on the long-term average efficiency of RF transmitters.

This book comprises select peer-reviewed papers from the International Conference on VLSI, Communication and Signal processing (VCAS) 2019, held at Motilal Nehru National Institute of Technology (MNNIT) Allahabad, Prayagraj, India. The contents focus on latest research in different domains of electronics and communication engineering, in particular microelectronics and VLSI design, communication systems and networks, and signal and image processing. The book also discusses the emerging applications of novel tools and techniques in image, video and multimedia signal processing. This book will be useful to students, researchers and professionals working in the electronics and communication domain.

The most comprehensive work on a number of practical numerical methods for analyzing passive structures in microwave and millimeter--wave integrated circuits. The introduction presents a brief comparison of the various numerical methods and how they may be integrated into computer--aided design programs, so the reader can make the appropriate choice. Chapters following present step--by--step, detailed descriptions of the methods, each chapter written by the utmost authority on the subject. Chapters provide illustrative examples and are written so that the reader can write his own computer program based on the numerical method described (some chapters include sample computer programs).

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers

Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.

This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding—including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others.

For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

This book highlights the innovative applications of electromagnetics, optics, thermodynamics theories in creating methods for physical-layer collision prevention- "physical anti-collision" in radio frequency identification (RFID) systems. Using engineering mathematical methods as the core of detection and control algorithm design, it proposes semi-physical verification and detection techniques to the dynamic performance testing in RFID systems. The book also introduces the methods to build semi-physical hardware platforms using photoelectric sensing technology. The book provides valuable ideas to the applications of Internet of Things (IOT) systems in smart logistics, car networking, food traceability, anti-counterfeiting and other livelihood fields. It is worth reading for all researchers in IOT and optoelectronic engineering related industries.

This thesis presents the SiGe source and drain (S/D) technology in the context of advanced CMOS, and addresses both device processing and epitaxy modelling. As the CMOS technology roadmap calls for continuously downscaling traditional transistor structures, controlling the parasitic effects of transistors, e.g. short channel effect, parasitic resistances and capacitances is becoming increasingly difficult. The emergence of these problems sparked a technological revolution, where a transition from planar to three-dimensional (3D) transistor design occurred in the 22nm technology node. The selective epitaxial growth (SEG) method has been used to deposit SiGe as stressor material in S/D regions to induce uniaxial strain in the channel region. The thesis investigates issues of process integration in IC production and concentrates on the key parameters of high-quality SiGe selective epitaxial growth, with a special focus on its pattern dependency behavior and on key integration issues in both 2D and 3D transistor structures, the goal being to improve future applications of SiGe SEG in advanced CMOS.

Unique selling point: * Contains electronics device, Circuits, systems as well as applications of Integrated Circuits in healthcare and security never before considered Core audience: * Researchers and post graduates Place in the market: * Includes key new finding of electronic devices for Security Applications, and Integrated Circutis for healthcare and security Applications with advanced

What you'll find here is a fascinating compendium of fundamental problem formulations of analog design centering and sizing. This essential work provides a differentiated knowledge about the tasks of analog design centering and sizing. In particular, worst-case scenarios are formulated and analyzed. This work is right at the crossing point between process and design technology, and is both reference work and textbook for understanding CAD methods in analog sizing.