Technological advances in the field of materials, devices, circuits, and systems began by the discovery of new properties of objects, or the entrepreneurship with the applications of unique or practical concepts for commercial goods. To implement products using these findings and challenges textbook knowledge is usually sufficient. "Semiconductor Technologies in the Era of Electronics" therefore does not aim to look deeper in certain areas but it offers a broad and comprehensive overview of the field to:

- Experts of specific knowledge who want to expand the overall understanding to different areas
- Persons who wish to understand the principle of electronic devices often seen in everyday life
- Entrepreneurs interested in the innovations and changes of semiconductor technologies and overall electronics industry

Aprofound and theoretical approach is therefore used and special cases essential to understanding these important concept are presented."

This book brings together papers presented at the 3rd International Conference on Artificial Intelligence in China (ChinaAI), which provides a venue to disseminate the latest developments and to discuss the interactions and links between these multidisciplinary fields. Spanning topics covering all topics in Artificial Intelligence with new development in China, this book is aimed at undergraduate and graduate students in Electrical Engineering, Computer Science and Mathematics, researchers and engineers from academia and industry as well as government employees (such as NSF, DOD, DOE, etc).

The Verilog language provides a means to model a digital system at many levels of abstraction from a logic gate to a complex digital system to a mainframe computer. The purpose of this book is to present the Verilog language together with a wide variety of examples, so that the reader can gain a firm foundation in the design of the digital system using Verilog HDL. The Verilog projects include the design module, the test bench module, and the outputs obtained from the simulator that illustrate the complete functional operation of the design. Where applicable, a detailed review of the theory of the topic is presented together with the logic design principles-including: state diagrams, Karnaugh maps, equations, and the logic diagram. Numerous examples and homework problems are included throughout. The examples include logical operations, counters of different moduli, half adders, full adders, a carry lookahead adder, array multipliers, different types of Moore and Mealy machines, and arithmetic logic units (ALUs).

Optical Imaging Devices: New Technologies and Applications delivers a comprehensive introduction to optical imaging and sensing, from devices to system-level applications. Drawing upon the extensive academic and industrial experience of its prestigious editors and renowned chapter authors, this authoritative text: Explains the physical principles of optical imaging and sensing Covers topics such as silicon-based imaging characteristics, nanophotonic phased arrays, thin-film sensors, label-free DNA sensors, and in vivo flow cytometry Presents the contributions of leading researchers, real-world examples from biomedicine, recommendations for further reading, and all measurements in SI units Optical Imaging Devices: New Technologies and Applications provides an essential understanding of the design, operation, and practical applications of optical imaging and sensing systems, making it a handy reference for students and practitioners alike.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

This book discusses the security issues in a wide range of wireless devices and systems, such as RFID, Bluetooth, ZigBee, GSM, LTE, and GPS. It collects the findings of recent research by the UnicornTeam at 360 Technology, and reviews the state-of-the-art literature on wireless security. The book also offers detailed case studies and theoretical treatments - specifically it lists numerous laboratory procedures, results, plots, commands and screenshots from real-world experiments. It is a valuable reference guide for practitioners and researchers who want to learn more about the advanced research findings and use the off-the-shelf tools to explore the wireless world.

Liquid Crystals LCs] are synthetic functional materials par excellence and are to be found in many types of LCDs; LCs self-assemble into ordered, but fluid, supramolecular structures and domains; they can be oriented in large homogeneous monodomains by electric and magnetic fields, Langmuir Blodgett techniques and also by self-orientation on suitable alignment layers; they are also anisotropic with preferred axes of light absorption, emission and charge transport with excellent semiconducting properties; they are soluble in organic solvents and can be deposited as uniform thin layers on device substrates, including plastic, by low-cost deposition processes, such as spin coating and doctor blade techniques; reactive mesogens polymerisable LC monomers] can be photopatterned and fixed in position and orientation as insoluble polymer networks. LCs are increasingly being used as active components in electronic and photonic organic devices, such as Organic Light-Emitting Diodes OLEDs], Organic Field Effect Transistors OFETs], Thin Film Transistors TFTs] and photovoltaic cells PVs]. Such devices on plastic substrates represent a major component of the plastic electronics revolution. The self-assembling properties and supramolecular structures of liquid crystals can be made use of in order to improve the performance of such devices. The relationships between chemical structure, liquid crystalline behaviour and other physical properties, such as charge-transport, photoluminescence and electroluminescence are discussed and explained. For example, high carrier-mobility, polarised emission and enhanced output-coupling are identified as the key advantages of nematic and smectic liquid crystals for electroluminescence. The advantageous use of anisotropic polymer networks formed by the polymerisation of reactive mesogens RMs] in devices with multilayer capability and photopatternability is described. The anisotropic transport and high carrier mobilities of columnar liquid crystals make them promising candidates for photovoltaics and transistors. The issues in the design and processing of liquid crystalline semiconductors for such devcies with improved performance are described. The photonic properties of chiral liquid crystals and their use as mirror-less lasers are also discussed.

This book discusses design techniques, layout details and measurements of several key analog building blocks that currently limit the performance of 5G and E-Band transceivers implemented in deep-scaled CMOS. The authors present recent developments in low-noise quadrature VCOs and tunable inductor-less frequency dividers. Moreover, the design of low-loss broadband transformer-based filters that realize inter-stage matching, power division/combining and impedance transformation is discussed in great detail. The design and measurements of a low-noise amplifier, a downconverter and a highly-linear power amplifier that leverage the proposed techniques are shown. All the prototypes were realized in advanced nanometer scaled CMOS technologies without RF thick to metal option.

This book highlights recent advances and applications in terahertz (THz) technology, addressing advanced topics such as THz biomedical imaging, pattern recognition and tomographic reconstruction for THz biomedical imaging by machine learning and artificial intelligence, THz imaging radars for autonomous vehicle applications, and THz imaging systems for security and surveillance. It also discusses theoretical, experimental, established and validated empirical work on these topics.

This book provides a platform to understand Internet of things with Raspberry Pi and the basic knowledge of the programming and interfacing of the devices and designed systems. It broadly covers introduction to Internet of Things and enabling technologies, interfacing with Raspberry Pi and Arduino and interfacing with Raspberry Pi GPIO. Internet of Things with Raspberry pi and Arduino is aimed at senior undergraduate, graduate students and professionals in electrical engineering, computer engineering including robotics.

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.

This book presents a synthesis of the research carried out in the Laboratory of Signal Processing and Communications (LaPSyC), CONICET, Universidad Nacional del Sur, Argentina, since 2003. It presents models and techniques widely used by the signal processing community, focusing on low-complexity methodologies that are scalable to different applications. It also highlights measures of the performance and impact of each compensation technique. The book is divided into three parts: 1) basic models 2) compensation techniques and 3) applications in advanced technologies. The first part addresses basic architectures of transceivers, their component blocks and modulation techniques. It also describes the performance to be taken into account, regardless of the distortions that need to be compensated. In the second part, several schemes of compensation and/or reduction of imperfections are explored, including linearization of power amplifiers, compensation of the characteristics of analog-to- digital converters and CFO compensation for OFDM modulation. The third and last part demonstrates the use of some of these techniques in modern wireless-communication systems, such as full-duplex transmission, massive MIMO schemes and Internet of Things applications.

The Analogue-to-digital converter (ADC) is the most pervasive block in electronic systems. With the advent of powerful digital signal processing and digital communication techniques, ADCs are fast becoming critical components for systema (TM)s performance and flexibility. Knowing accurately all the parameters that characterise their dynamic behaviour is crucial, on one hand to select the most adequate ADC architecture and characteristics for each end application, and on the other hand, to understand how they affect performance bottlenecks in the signal processing chain.

Dynamic Characterisation of Analogue-to-Digital Converters presents a state of the art overview of the methods and procedures employed for characterising ADCsa (TM) dynamic performance behaviour using sinusoidal stimuli. The three classical methods a" histogram, sine wave fitting, and spectral analysis a" are thoroughly described, and new approaches are proposed to circumvent some of their limitations.

This is a must-have compendium, which can be used by both academics and test professionals to understand the fundamental mathematics underlining the algorithms of ADC testing, and as an handbook to help the engineer in the most important and critical details for their implementation.

"Microelectronic Test Structures for CMOS Technology and Products" addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors' overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology. "

This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2020 ApplePies Conference, held online in November 2020, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.

Time-mode circuits, where information is represented by time difference between digital events, offer a viable and technology-friendly means to realize mixed-mode circuits and systems in nanometer complementary metal-oxide semiconductor (CMOS) technologies. Various architectures of time-based signal processing and design techniques of CMOS time-mode circuits have emerged; however, an in-depth examination of the principles of time-based signal processing and design techniques of time-mode circuits has not been available-until now. CMOS Time-Mode Circuits and Systems: Fundamentals and Applications is the first book to deliver a comprehensive treatment of CMOS time-mode circuits and systems. Featuring contributions from leading experts, this authoritative text contains a rich collection of literature on time-mode circuits and systems. The book begins by presenting a critical comparison of voltage-mode, current-mode, and time-mode signaling for mixed-mode signal processing and then: Covers the fundamentals of time-mode signal processing, such as voltage-to-time converters, all-digital phase-locked loops, and frequency synthesizers Investigates the performance characteristics, architecture, design techniques, and implementation of time-to-digital converters Discusses time-mode delta-sigma-based analog-to-digital converters, placing a great emphasis on time-mode quantizers Includes a detailed study of ultra-low-power integrated time-mode temperature measurement systems CMOS Time-Mode Circuits and Systems: Fundamentals and Applications provides a valuable reference for circuit design engineers, hardware system engineers, graduate students, and others seeking to master this fast-evolving field.

With the semiconductor market growth, new Integrated Circuit designs are pushing the limit of the technology and in some cases, require speci?c ?ne-tuning of certain process modules in manufacturing. Thus the communities of design and technology are increasingly intertwined. The issues that require close interactions and colla- ration for trade-off and optimization across the design/device/process ?elds are addressed in this book. It contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference on Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble. The selected papers are spread over ?ve chapters covering various aspects of emerging technologies and devices, advanced circuit design, reliability, variability issues and solutions, advanced memories and analog and mixed signals. All these papers are focusing on design and technology interactions and comply with the scope of the conference. v . Contents Part I Introduction 1 Synergy Between Design and Technology: A Key Factor in the Evolving Microelectronic Landscape. . . . . . . . . . . . . . . . . . . . . . 3 Michel Brilloue]t Part II Emerging Technologies and Circuits 2 New State Variable Opportunities Beyond CMOS: A System Perspective . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Victor V. Zhirnov, Ralph K. Cavin, and George I. Bourianoff 3 A Simple Compact Model to Analyze the Impact of Ballistic and Quasi-Ballistic Transport on Ring Oscillator Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 S. Martinie, D. Munteanu, G. Le Carval, and J. L. Autran Part III Advanced Devices and Circuits 4 Low-Voltage Scaled 6T FinFET SRAM Cells . . . . . . . . . . . . . . . . . . . 55 N. Collaert, K. von Arnim, R. Rooyackers, T."

Abstract This chapter lays the foundation for the work presented in latter chapters. The potential of 60 GHz frequency bands for high data rate wireless transfer is discussed and promising applications are enlisted. Furthermore, the challenges related to 60 GHz IC design are presented and the chapter concludes with an outline of the book. Keywords Wireless communication 60 GHz Millimeter wave integrated circuit design Phase-locked loop CMOS Communication technology has revolutionized our way of living over the last century. Since Marconi's transatlantic wireless experiment in 1901, there has been tremendous growth in wireless communication evolving from spark-gap telegraphy to today's mobile phones equipped with Internet access and multimedia capabilities. The omnipresence of wireless communication can be observed in widespread use of cellular telephony, short-range communication through wireless local area networks and personal area networks, wireless sensors and many others. The frequency spectrum from 1 to 6 GHz accommodates the vast majority of current wireless standards and applications. Coupled with the availability of low cost radio frequency (RF) components and mature integrated circuit (IC) techn- ogies, rapid expansion and implementation of these systems is witnessed. The downside of this expansion is the resulting scarcity of available bandwidth and allowable transmit powers. In addition, stringent limitations on spectrum and energy emissions have been enforced by regulatory bodies to avoid interference between different wireless systems.

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world's foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

The development of computing machines found great success in the last decades. But the ongoing miniaturization of integrated circuits will reach its limits in the near future. Shrinking transistor sizes and power dissipation are the major barriers in the development of smaller and more powerful circuits. Reversible logic p- vides an alternative that may overcome many of these problems in the future. For low-power design, reversible logic offers signi?cant advantages since zero power dissipation will only be possible if computation is reversible. Furthermore, quantum computation pro?ts from enhancements in this area, because every quantum circuit is inherently reversible and thus requires reversible descriptions. However, since reversible logic is subject to certain restrictions (e.g. fanout and feedback are not directly allowed), the design of reversible circuits signi?cantly differs from the design of traditional circuits. Nearly all steps in the design ?ow (like synthesis, veri?cation, or debugging) must be redeveloped so that they become applicable to reversible circuits as well. But research in reversible logic is still at the beginning. No continuous design ?ow exists so far. Inthisbook, contributionstoadesign?owforreversiblelogicarepresented.This includes advanced methods for synthesis, optimization, veri?cation, and debugging

Control Systems Theory with Engineering Applications uses modern concepts of control systems theory to provide an accessible text for the most important aspects in linear and nonlinear multivariable systems.  This book presents well-defined theoretical base with step-by-step instruction on how to apply it by thoroughly studying a great number of practical real world problems and using numerous examples. The book gives basic introductory theory relating to the linear state space concept.  It provides the reader with the necessary background needed to comprehend the principles and models presented throughout the remaining portions of the book.  The methods and applications presented include a variety of relevant topics selected for their insight and pedagogical effectiveness.   Topics: * A vast range of worked-out examples and qualitative illustrations. * Mathematical model developments including Newtonian Mechanics and Lagrange Equations of Motion * Analysis, identification and control of linear and nonlinear dynamic systems * Practical engineering examples including dynamic modeling in MATLAB and SIMULINK * Theory and applications of multivariable control * Constrained optimization of continuos and discrete time systems. Control Systems Theory with Engineering Applications is an exceptionally complete and accessible text/reference for graduates and professionals in automatic control and nonlinear control.  It is an ideal resource to bridge the gap between theory and practice for students and engineers working in the fields of electrical, mechanical and aerospace engineering.

This book discusses recent advances in wearable technologies and personal monitoring devices, covering topics such as skin contact-based wearables (electrodes), non-contact wearables, the Internet of things (IoT), and signal processing for wearable devices. Although it chiefly focuses on wearable devices and provides comprehensive descriptions of all the core principles of personal monitoring devices, the book also features a section on devices that are embedded in smart appliances/furniture, e.g. chairs, which, despite their limitations, have taken the concept of unobtrusiveness to the next level. Wearable and personal devices are the key to precision medicine, and the medical community is finally exploring the opportunities offered by long-term monitoring of physiological parameters that are collected during day-to-day life without the bias imposed by the clinical environment. Such data offers a prime view of individuals' physical condition, as well as the efficacy of therapy and occurrence of events. Offering an in-depth analysis of the latest advances in smart and pervasive wearable devices, particularly those that are unobtrusive and invisible, and addressing topics not covered elsewhere, the book will appeal to medical practitioners and engineers alike.