More than ever, FDL is the place for researchers, developers, industry designers, academia, and EDA tool companies to present and to learn about the latest scientific achievements, practical applications and users experiences in the domain of specification and design languages. FDL covers the modeling and design methods, and their latest supporting tools, for complex embedded systems, systems on chip, and heterogeneous systems.

FDL 2009 is the twelfth in a series of events that were held all over Europe, in selected locations renowned for their Universities and Reseach Institutions as well as the importance of their industrial environment in Computer Science and Micro-electronics. In 2009, FDL was organized in the attractive south of France area of Sophia Antipolis. together with the DASIP (Design and Architectures for Signal and Image Processing) Conference and the SAME (Sophia Antipolis MicroElectronics ) Forum.

All submitted papers were carefully reviewed to build a program with 27 full and 10 short contributions. From these, the Program Committee selected a shorter list, based on the evaluations of the reviewers, and the originality and relevance of the work that was presented at the Forum. The revised, and sometimes extended versions of these contributions constitute the chapters of this volume.

Advances in Design Methods from Modeling Languages for Embedded Systems and SoC's presents extensions to standard specification and description languages, as well as new language-based design techniques and methodologies to solve the challenges raised by mixed signal and multi-processor systems on a chip. It is intended as a reference for researchers and lecturers, as well as a state of the art milestone for designers and CAD developers.

This book describes reliable and efficient design automation techniques for the design and implementation of an approximate computing system. The authors address the important facets of approximate computing hardware design - from formal verification and error guarantees to synthesis and test of approximation systems. They provide algorithms and methodologies based on classical formal verification, synthesis and test techniques for an approximate computing IC design flow. This is one of the first books in Approximate Computing that addresses the design automation aspects, aiming for not only sketching the possibility, but providing a comprehensive overview of different tasks and especially how they can be implemented.

This book focuses on control techniques for LCL-type grid-connected inverters to improve system stability, control performance and suppression ability of grid current harmonics. Combining a detailed theoretical analysis with design examples and experimental validations, the book offers an essential reference guide for graduate students and researchers in power electronics, as well as engineers engaged in developing grid-connected inverters for renewable energy generation systems.

This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

This book provides readers with invaluable overviews and updates of the most important topics in the radiation-effects field, enabling them to face significant challenges in the quest for the insertion of ever-higher density and higher performance electronic components in satellite systems. Readers will benefit from the up-to-date coverage of the various primary (classical) sub-areas of radiation effects, including the space and terrestrial radiation environments, basic mechanisms of total ionizing dose, digital and analog single-event transients, basic mechanisms of single-event effects, system-level SEE analysis, device-level, circuit-level and system-level hardening approaches, and radiation hardness assurance. Additionally, this book includes in-depth discussions of several newer areas of investigation, and current challenges to the radiation effects community, such as radiation hardening by design, the use of Commercial-Off-The-Shelf (COTS) components in space missions, CubeSats and SmallSats, the use of recent generation FPGA's in space, and new approaches for radiation testing and validation. The authors provide essential background and fundamentals, in addition to information on the most recent advances and challenges in the sub-areas of radiation effects. Provides a concise introduction to the fundamentals of radiation effects, latest research results, and new test methods and procedures; Discusses the radiation effects and mitigation solutions for advanced integrated circuits and systems designed to operate in harsh radiation environments; Includes coverage of the impact of Small Satellites in the space industry.

This book offers readers an easy introduction into quantum computing as well as into the design for corresponding devices. The authors cover several design tasks which are important for quantum computing and introduce corresponding solutions. A special feature of the book is that those tasks and solutions are explicitly discussed from a design automation perspective, i.e., utilizing clever algorithms and data structures which have been developed by the design automation community for conventional logic (i.e., for electronic devices and systems) and are now applied for this new technology. By this, relevant design tasks can be conducted in a much more efficient fashion than before - leading to improvements of several orders of magnitude (with respect to runtime and other design objectives). Describes the current state of the art for designing quantum circuits, for simulating them, and for mapping them to real hardware; Provides a first comprehensive introduction into design automation for quantum computing that tackles practically relevant tasks; Targets the quantum computing community as well as the design automation community, showing both perspectives to quantum computing, and what impressive improvements are possible when combining the knowledge of both communities.

The book addresses the need to investigate new approaches to lower energy requirement in multiple application areas and serves as a guide into emerging circuit technologies. It explores revolutionary device concepts, sensors, and associated circuits and architectures that will greatly extend the practical engineering limits of energy-efficient computation. The book responds to the need to develop disruptive new system architecutres, circuit microarchitectures, and attendant device and interconnect technology aimed at achieving the highest level of computational energy efficiency for general purpose computing systems. Features Discusses unique technologies and material only available in specialized journal and conferences Covers emerging applications areas, such as ultra low power communications, emerging bio-electronics, and operation in extreme environments Explores broad circuit operation, ex. analog, RF, memory, and digital circuits Contains practical applications in the engineering field, as well as graduate studies Written by international experts from both academia and industry

The book presents design methods for analog integrated circuits with improved electrical performance. It describes different equivalent transistor models, design methods, and fabrication considerations for high-density integrated circuits in nanometer CMOS processes, and it analyzes circuit architectures that are suitable for analog building blocks. Highlighting various design challenges, the text offers a complete understanding of architectural- and transistor-level design issues of analog integrated circuits. It examines important trends in the design of high-speed and power-efficient front-end analog circuits that can be used for signal conditioning, filtering, and detection applications. Offers a comprehensive resource for mastering the analysis of analog integrated circuits. Describes circuit-level details of high-speed and power-efficient analog building blocks. Explores design methods based on various MOS transistor models (MOSFET, FinFET). Provides mathematical derivations of all equations and formulas. Emphasizes practical aspects relevant to integrated circuit implementation. Includes open-ended circuit design case studies.

With a focus on designing and verifying CMOS analog integrated circuits, the book reviews design techniques for mixed-signal building blocks, such as Nyquist and oversampling data converters, and circuits for signal generation, synthesis, and recovery. The text details all aspects, from specifications to the final circuit, of the design of digital-to-analog converters, analog-to-digital converters, phase-locked loops, delay-locked loops, high-speed input/output link transceivers, and class D amplifiers. Special emphasis is put on calibration methods that can be used to compensate circuit errors due to device mismatches and semiconductor process variations. Gives an overview of data converters, phase- and delay-locked loop architectures, highlighting basic operation and design trade-offs. Focus on circuit analysis methods useful to meet requirements for a high-speed and power-efficient operation. Outlines design challenges of analog integrated circuits using state-of-the-art CMOS processes. Presents design methodologies to optimize circuit performance on both transistor and architectural levels. Includes open-ended circuit design case studies.

The book addresses the need to investigate new approaches to lower energy requirement in multiple application areas and serves as a guide into emerging circuit technologies. It explores revolutionary device concepts, sensors, and associated circuits and architectures that will greatly extend the practical engineering limits of energy-efficient computation. The book responds to the need to develop disruptive new system architectures and semiconductor processes aimed at achieving the highest level of computational energy efficiency for general purpose computing systems. Discusses unique technologies and material only available in specialized journal and conferences. Covers emerging materials and device structures, such as ultra-low power technologies, nanoelectronics, and microsystem manufacturing. Explores semiconductor processing and manufacturing, device design, and performance. Contains practical applications in the engineering field, as well as graduate studies. Written by international experts from both academia and industry.

This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today's most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy ("become hot"), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.

The basic concepts and building blocks for the design of Fine- (or FPGA) and Coarse-Grain Reconfigurable Architectures are discussed in this book. Recently-developed integrated architecture design and software-supported design flow of FPGA and coarse-grain reconfigurable architecture are also described. The book is accompanied by an interactive CD which includes case studies and lab projects for the design of FPGA and Coarse-grain architectures.

This book describes a new design methodology that allows optimization-based synthesis of RF systems in a hierarchical multilevel approach, in which the system is designed in a bottom-up fashion, from the device level up to the (sub)system level. At each level of the design hierarchy, the authors discuss methods that increase the design robustness and increase the accuracy and efficiency of the simulations. The methodology described enables circuit sizing and layout in a complete and automated integrated manner, achieving optimized designs in significantly less time than with traditional approaches.

Logic Synthesis and Optimization presents up-to-date research information in a pedagogical form. The authors are recognized as the leading experts on the subject. The focus of the book is on logic minimization and includes such topics as two-level minimization, multi-level minimization, application of binary decision diagrams, delay optimization, asynchronous circuits, spectral method for logic design, field programmable gate array (FPGA) design, EXOR logic synthesis and technology mapping. Examples and illustrations are included so that each contribution can be read independently. Logic Synthesis and Optimization is an indispensable reference for academic researchers as well as professional CAD engineers.

Timely, authoritative, application-oriented… an in-depth exploration of current and future uses of FPGAs in digital systems The development of field-programmable gate arrays (FPGAs) may well be the most important breakthrough for the microelectronics industry since the invention of the microprocessor. Using FPGAs, a system designer working on a PC can now develop a working prototype in a few hours and change it at will in just a few minutes, rather than waiting weeks or months for a printed-circuit assembly or a custom integrated circuit to be built. This newfound ability to change a system by simply altering its configuration memory is also leading to exciting new forms of computing, such as array applications that exploit parallelism. Now in a book that functions equally well as a working professional reference and a pedagogically consistent computer engineering text, John V. Oldfield and Richard C. Dorf:

• Provide a detailed overview of FPGAs in digital systems design
• Explain the underlying principles, strengths, and limitations of most FPGA architectures
• Supply many real-life case studies, from elementary to advanced applications—including examples of "custom computing machines"
• Review cutting-edge developments, including new architectures and a new field-programmable interconnect chip
• Discuss key economic and business aspects of FPGA manufacture and applications and their role in intellectual property protection
• Demonstrate ways in which FPGAs offer plausible solutions to some of the major computing problems of our day

This book examines the new and important technology of asymmetric passive components for miniaturized microwave passive circuits. The asymmetric design methods and ideas set forth by the author are groundbreaking and have not been treated in previous works. Readers discover how these design methods reduce the circuit size of microwave integrated circuits and are also critical to reducing the cost of equipment such as cellular phones, radars, antennas, automobiles, and robots.
An introductory chapter on the history of asymmetric passive components, which began with asymmetric ring hybrids first described by the author, sets the background for the book. It lays a solid foundation with a chapter examining microwave circuit parameters such as scattering, ABCD, impedance, admittance, and image. A valuable feature of this chapter is a conversion table between the various circuit matrices characterizing two-port networks terminated in arbitrary impedances. The correct conversion has also never been treated in previous works.
Next, the author sets forth a thorough treatment of asymmetric passive component design, which covers the basic and indispensable elements for integration with other active or passive devices, including:
* Asymmetric ring hybrids
* Asymmetric branch-line hybrids
* Asymmetric three-port power dividers and N-way power dividers
* Asymmetric ring hybrid phase shifters and attenuators
* Asymmetric ring filters and asymmetric impedance transformers

With its focus on the principles of circuit element design, this is a must-have graduate-level textbook for students in microwave engineering, as well as a reference for design engineers who want to learn the new and powerful design method for asymmetric passive components.

Sunlight readable transflective liquid crystal displays, used on devices from cell phones and portable media players, to GPS and even some desktop monitors, have become indispensable in our day-to-day lives.

"Transflective Liquid Crystal Displays" is a methodical examination of this display technology, providing a useful reference to the fundamentals of the topic. Including thorough descriptions of the essential physics of transflective LCD technologies, the book also compares transflective LCD technology with alternatives, such as OLED displays, to enable display engineers to appropriately select the correct device for their particular application.Includes detailed descriptions of both pure transmissive and reflective LCDs, and the design considerations and performance of combining these into small mobile displays. Focuses on fundamental elements, such as double cell gap transflective LCDs, wide-viewing angle technology, light polarization and wide-view linear and circular polarizers, video rate display by colour sequential technologies, colour sciences and engineering, and backlights. Describes the latest LCD technologies, such as polymer-sustained surface alignment technology, and the possible trends which could be applied to transflective LCDs in the future.

Its focus on the fundamentals of transflective liquid crystal displays makes this an ideal graduate text, while display engineers, scientists, developers and technicians working with this technology will also welcome this resource.

The Society for Information Display (SID) is an international society, which has the aim of encouraging the development of all aspects of the field of information display. Complementary to the aims of the society, the Wiley-SID series is intended to explain the latest developments in information display technology at a professional level. The broad scope of the series addresses all facets of information displays from technical aspects through systems and prototypes to standards and ergonomics

This book presents the technology of millimetre waves and Terahertz (THz) antennas. It highlights the importance of moderate and high-gain aperture antennas as key devices for establishing point-to-point and point-to-multipoint radio links for far-field and near-field applications, such as high data-rate communications, intelligent transport, security imaging, exploration and surveillance systems. The book provides a comprehensive overview of the key antenna technologies developed for the mm wave and THz domains, including established ones - such as integrated lens antennas, advanced 2D and 3D horn antennas, transmit and reflect arrays, and Fabry-Perot antennas - as well as emerging metasurface antennas for near-field and far-field applications. It describes the pros and cons of each antenna technology in comparison with other available solutions, a discussion supplemented by practical examples illustrating the step-by-step implementation procedures for each antenna type. The measurement techniques available at these frequency ranges are also presented to close the loop of the antenna development cycle. In closing, the book outlines future trends in various antenna technologies, paving the way for further developments. Presenting content originating from the five-year ESF research networking program 'Newfocus' and co-authored by the most active and highly cited research groups in the domain of mm- and sub-mm-wave antenna technologies, the book offers a valuable guide for researchers and engineers in both industry and academia.

In the past ten years, heteroepitaxy has continued to increase in importance with the explosive growth of the electronics industry and the development of a myriad of heteroepitaxial devices for solid state lighting, green energy, displays, communications, and digital computing. Our ever-growing understanding of the basic physics and chemistry underlying heteroepitaxy, especially lattice relaxation and dislocation dynamic, has enabled an ever-increasing emphasis on metamorphic devices. To reflect this focus, two all-new chapters have been included in this new edition. One chapter addresses metamorphic buffer layers, and the other covers metamorphic devices. The remaining seven chapters have been revised extensively with new material on crystal symmetry and relationships, III-nitride materials, lattice relaxation physics and models, in-situ characterization, and reciprocal space maps.

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

In our abundant computing infrastructure, performance improvements across most all application spaces are now severely limited by the energy dissipation involved in processing, storing, and moving data. The exponential increase in the volume of data to be handled by our computational infrastructure is driven in large part by unstructured data from countless sources. This book explores revolutionary device concepts, associated circuits, and architectures that will greatly extend the practical engineering limits of energy-efficient computation from device to circuit to system level. With chapters written by international experts in their corresponding field, the text investigates new approaches to lower energy requirements in computing. Features * Has a comprehensive coverage of various technologies * Written by international experts in their corresponding field * Covers revolutionary concepts at the device, circuit, and system levels

This book explores up-to-date research trends and achievements on low-power and high-speed technologies in both electronics and optics. It offers unique insight into low-power and high-speed approaches ranging from devices, ICs, sub-systems and networks that can be exploited for future mobile devices, 5G networks, Internet of Things (IoT), and data centers. It collects heterogeneous topics in place to catch and predict future research directions of devices, circuits, subsystems, and networks for low-power and higher-speed technologies. Even it handles about artificial intelligence (AI) showing examples how AI technology can be combined with concurrent electronics. Written by top international experts in both industry and academia, the book discusses new devices, such as Si-on-chip laser, interconnections using graphenes, machine learning combined with CMOS technology, progresses of SiGe devices for higher-speed electronices for optic, co-design low-power and high-speed circuits for optical interconnect, low-power network-on-chip (NoC) router, X-ray quantum counting, and a design of low-power power amplifiers. Covers modern high-speed and low-power electronics and photonics. Discusses novel nano-devices, electronics & photonic sub-systems for high-speed and low-power systems, and many other emerging technologies like Si photonic technology, Si-on-chip laser, low-power driver for optic device, and network-on-chip router. Includes practical applications and recent results with respect to emerging low-power systems. Addresses the future perspective of silicon photonics as a low-power interconnections and communication applications.

A significant portion of biomedical applications necessitates the establishment of an interface between the cells of the patient and the components of the device. In many cases, such as in implants and engineered tissues, the interaction of the cells with the biomaterial is one of the main determinants of the success of the system. Cell and Material Interface: Advances in Tissue Engineering, Biosensor, Implant, and Imaging Technologies explores this interaction and its control at length scales ranging from the nano to the macro. Featuring contributions from leading molecular biologists, chemists, and material scientists, this authoritative reference: Presents practical examples of cell and material interface-based applications Reflects the interdisciplinary nature of bioengineering, covering topics such as biosensing, immunology, and controlled delivery Explains the role of the cell and material interface in the context of cardiac and skin tissue engineering, nanoparticles, natural polymers, and more Cell and Material Interface: Advances in Tissue Engineering, Biosensor, Implant, and Imaging Technologies addresses concepts essential to biomaterial production methods and cell and material interactions. The book provides a solid starting point for elucidating and exploiting the different aspects of cellular interactions with materials for biomedical engineering.

Efficient mobile systems that allow for vital sign monitoring and disease diagnosis at the point of care can help combat issues such as rising healthcare costs, treatment delays in remote and resource-poor areas, and the global shortage of skilled medical personnel. Covering everything from sensors, systems, and software to integration, usability, and regulatory challenges, Mobile Point-of-Care Monitors and Diagnostic Device Design offers valuable insight into state-of-the-art technologies, research, and methods for designing personal diagnostic and ambulatory healthcare devices. Presenting the combined expertise of contributors from various fields, this multidisciplinary text: Gives an overview of the latest mobile health and point-of-care technologies Discusses portable diagnostics devices and sensors, including mobile-phone-based health systems Explores lab-on-chip systems as well as energy-efficient solutions for mobile point-of-care monitors Addresses computer vision and signal processing for real-time diagnostics Considers interface design for lay healthcare providers and home users Mobile Point-of-Care Monitors and Diagnostic Device Design provides important background information about the design process of mobile health and point-of-care devices, using practical examples to illustrate key aspects related to instrumentation, information processing, and implementation.

This book discusses the digital design of integrated circuits under process variations, with a focus on design-time solutions. The authors describe a step-by-step methodology, going from logic gates to logic paths to the circuit level. Topics are presented in comprehensively, without overwhelming use of analytical formulations. Emphasis is placed on providing digital designers with understanding of the sources of process variations, their impact on circuit performance and tools for improving their designs to comply with product specifications. Various circuit-level "design hints" are highlighted, so that readers can use then to improve their designs. A special treatment is devoted to unique design issues and the impact of process variations on the performance of FinFET based circuits. This book enables readers to make optimal decisions at design time, toward more efficient circuits, with better yield and higher reliability.