This book is a review of the science and technology of the element carbon and its allotropes: graphite, diamond and the fullerenes. This field has expanded greatly in the last three decades stimulated by many major discoveries such as carbon fibers, low-pressure diamond, and the fullerenes. The need for such a book has been felt for some time. These carbon materials are very different in structure and properties. Some are very old (charcoal), others brand new (the fullerenes). They have different applications and markets and are produced by different segments of the industry.Few studies are available that attempt to review the entire field of carbon as a whole discipline. Moreover these studies were written several decades ago and a generally outdated since the development of the technology is moving very rapidly and scope of applications is constantly expanding and reaching into new fields such as aerospace, automotive, semiconductors, optics, and electronics. In this book the author provides a valuable, up-to-date account of both the newer and traditional forms of carbon, both naturally occurring and man-made. This volume will be a valuable resource for both specialists in, and occasional users of carbon materials.

This book is an original and timeless description of the elasticity of solids, and more particularly of crystals, covering all aspects from theory and elastic constants to experimental moduli. The first part is dedicated to a phenomenological and dimensionless representation of macroscopic crystal elasticity, which allows us to compare all crystals of the same symmetry with the concept of anisotropy and to establish new relations between elastic constants. Multi-scale approaches are then put forward to describe the elasticity at an atomic scale or for polycrystals. The relationship between elasticity and structural or physical properties is illustrated by many experimental data. The second part is entirely devoted to a Lagrangian theory of vibrations and its application to the characterization of elasticity by means of the dynamic resonant method. This unique approach applied to tension-compression, flexural and torsional tests allows for an accurate determination of elastic moduli of structural and functional crystals, varying from bulk to multi-coated materials.

This completely updated and revised second edition of "Surface Analysis: The Principal Techniques, " deals with the characterisation and understanding of the outer layers of substrates, how they react, look and function which are all of interest to surface scientists. Within this comprehensive text, experts in each analysis area introduce the theory and practice of the principal techniques that have shown themselves to be effective in both basic research and in applied surface analysis.

Examples of analysis are provided to facilitate the understanding of this topic and to show readers how they can overcome problems within this area of study.

This book consists of chapters that focus specifically on single figures that worked on Descriptive Geometry and also in Mechanisms Sciences and contain biographical notes, a survey of their work and their achievements, together with a modern interpretation of their legacy. Since Vitruvius in ancient times, and with Brunelleschi in the Renaissance, the two disciplines began to share a common direction which, over the centuries, took shape through less well-known figures until the more recent times in which Gaspard Monge worked. Over the years, a gap has been created between Descriptive Geometry and Mechanism Science, which now appear to belong to different worlds. In reality, however, there is a very close relationship between the two disciplines, with a link based on extremely solid foundations. Without the theoretical foundations of Geometry it would not be possible to draw and design mechanical parts such as gears, while in Kinematics it would be less easy to design and predict the reciprocal movements of parts in a complex mechanical assembly.

Enables readers to quickly understand core issues and field development of sodium-ion capacitors Sodium Ion Capacitors summarizes and outlines the dynamics and development of sodium-ion capacitors, covering key aspects of the technology including background, classification and configuration, key technologies, and more, allowing readers to gain an understanding of sodium-ion capacitors from the perspective of both industrial technology and electrochemistry. Sodium Ion Capacitors includes information on: EDLC-type mechanism of SCs and battery-type mechanism of SIBs, definition and types of pseudocapacitance, and energy storage mechanism of pseudocapacitors Cathode materials for sodium-ion capacitors, covering EDLC cathode materials, carbon nanotubes, reduced graphene oxide, and hollow carbon microspheres Flexible battery-type anode and capacitive cathode sics cell configurations, including flexible electrodes based on carbon nanofiber, graphene substrates, carbon cloth, MXenes, and metal foil Pre-sodiation technologies, covering operation with Li metal, usage of Li-based alternatives, and the sacrificial additives method Summarizing the development, directions, potential, and core issues of sodium ion capacitors, Sodium Ion Capacitors is an essential resource on the subject for materials scientists, solid state chemists, electrochemists, and semiconductor physicists in both industry and academia.

Composites have been studied for more than 150 years, and interest in their properties has been growing. This classic volume provides the foundations for understanding a broad range of composite properties, including electrical, magnetic, electromagnetic, elastic and viscoelastic, piezoelectric, thermal, fluid flow through porous materials, thermoelectric, pyroelectric, magnetoelectric, and conduction in the presence of a magnetic field (Hall effect). Exact solutions of the PDEs in model geometries provide one avenue of understanding composites; other avenues include microstructure-independent exact relations satisfied by effective moduli, for which the general theory is reviewed; approximation formulae for effective moduli; and series expansions for the fields and effective moduli that are the basis of numerical methods for computing these fields and moduli. The range of properties that composites can exhibit can be explored either through the model geometries or through microstructure-independent bounds on the properties. These bounds are obtained through variational principles, analytic methods, and Hilbert space approaches. Most interesting is when the properties of the composite are unlike those of the constituent materials, and there has been an explosion of interest in such composites, now known as metamaterials. The Theory of Composites surveys these aspects, among others, and complements the new body of literature that has emerged since the book was written. It remains relevant today by providing historical background, a compendium of numerous results, and through elucidating many of the tools still used today in the analysis of composite properties. This book is intended for applied mathematicians, physicists, and electrical and mechanical engineers. It will also be of interest to graduate students.

Biomaterials Effect on the Bone Microenvironment Practical resource on clinical bone regeneration from a variety of related interdisciplinary researchers Biomaterials Effect on the Bone Microenvironment focuses on the structure-activity relationship between bone biomaterials and microenvironment regulation, presenting a systematic exposition from all aspects of biomaterials regulated microenvironment in bone regeneration and covering design strategies, applications, and mechanisms of biomaterials that regulate bone microenvironment, along with the methods for manufacturing biomaterials and their clinical translation. The subject's potential challenges and future development direction are discussed, and the design and initiative principle of tailored biomaterials with various features, including bioactive components and physicochemical property, are elucidated in depth. Numerous biomaterials, including natural and synthetic, are summarized and compared. Their advantages and features are also evaluated, particularly in bone microenvironmental regulation and bone generation. Moreover, the stimulation mechanism of the microenvironment to bone generation is discussed in detail, including mechanical-support effect, redox effect, pro-angiogenesis effect, inflammatory immune effect, and anti-aging effect. Biomaterials Effect on the Bone Microenvironment provides further coverage of sample topics such as: Role of bone microenvironment and its associated biomaterials in modulation bone diseases, reviewing the biomaterials used to regulate bone microenvironment Relationship between biological factors of various materials and physiological functions in bone microenvironment Application of the third generation of biomaterials, which would regenerate the bone to regulate bone microenvironment Emerging biological material manufacturing technology and mechanisms of novel biomaterial modulating microenvironment for bone regeneration Future outlook of bone tissue engineering along with the general process of bone remodeling and regeneration With comprehensive coverage of one of the most promising and valuable candidates for clinical bone regeneration, Biomaterials Effect on the Bone Microenvironment is an ideal resource for materials scientists, biotechnologists, biochemists, bioengineers, orthopedists, and clinical chemists who want to stay on the cutting edge of this rapidly evolving field.

This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Including papers from the 9th edition of the International Conference on Computational Methods and Experiments in Material and Contact Characterisation this volume presents the work of selected researchers on the subject. Material and contact characterisation is a rapidly advancing field and this volume contains the latest research. Of particular interest to industry and society is the knowledge of surface treatment and contact mechanics of these materials to determine the in-service behaviour of components subject to contact conditions. Modern society requires systems that operate at conditions that use resources effectively. In terms of components durability, the understanding of surface engineering wear frictional and lubrication dynamics has never been so important. Current research is focussed on modification technologies that can increase the surface durability of materials. The characteristics of the system reveal which surface engineering methods should be chosen and as a consequence it is essential to study the combination of surface treatment and contact mechanics. The accurate characterisation of the physical and chemical properties of materials requires the application of both experimental techniques and computer simulation methods in order to gain a correct analysis. A very wide range of materials, starting with metals through polymers and semiconductors to composites, necessitates a whole spectrum of characteristic experimental techniques and research methods. The papers in the book cover a number of topics, including: Experimental approaches; Recycled materials; Metallic materials; Mechanical properties; Mechanical and thermal properties; Composite materials; Materials for bioengineering applications; Performance based design materials and Numerical models.

Arc welding is one of the key processes in industrial manufacturing, with welders using two types of processes - gas metal arc welding (GMAW) and gas tungsten arc welding (GTAW). This new book provides a survey-oriented account of the modeling, sensing, and automatic control of the GMAW process.
Researchers are presented with the most recent information in the areas of modeling, sensing and automatic control of the GMAW process, collecting a number of original research results on the topic from the authors and colleagues.

Providing an overview of a variety of topics, this book looks at the classification of various welding processes; the modeling aspects of GMAW; physics of welding; metal transfer characteristics; weld pool geometry; process voltages and variables; power supplies; sensing (sensors for arc length, weld penetration control, weld pool geometry, using optical and intelligent sensors); control techniques of PI, PID, multivariable control, adaptive control, and intelligent control. Finally, the book illustrates a case study presented by the authors and their students at Idaho State University, in collaboration with researchers at the Idaho National Engineering and Environment Laboratory.

Introduction to Mechatronics and Measurement Systems, Fifth Edition, provides comprehensive and accessible coverage of the field of mechatronics for mechanical, electrical and aerospace engineering majors. The author presents a concise review of electrical circuits, solid-state devices, digital circuits, and motors- all of which are fundamental to understanding mechatronic systems. Mechatronics design considerations are presented throughout the text, and in "Design Example" features. The text's numerous illustrations, examples, class discussion items, and chapter questions & exercises provide an opportunity to understand and apply mechatronics concepts to actual problems encountered in engineering practice. This text has been tested over several years to ensure accuracy. Introduction to Mechatronics and Measurement Systems, Fifth Edition - is a multifaceted resource which is designed to serve as a text for modern instrumentation and measurements courses, hybrid electrical and mechanical engineering courses replacing traditional circuits and instrumentation courses, as well as for stand-alone mechatronics courses, or the first course in a mechatronics sequence. It can also work for hybrid courses, providing an opportunity to reduce the number of credit hours in a typical mechanical engineering curriculum. Written by the academic award winning author and mechanical engineering professor, Dr. David G. Alciatore. The author's webpage (linked to from OLC) has additional computer files and resources, including MATLAB examples, videos demonstrations, and lab exercises.

The latest edition in the gold standard of project management case study collections As a critical part of any successful, competitive business, project management sits at the intersection of several functional areas. And in the newly revised Sixth Edition of Project Management Case Studies, world-renowned project management professional Dr. Harold Kerzner delivers practical and in-depth coverage of project management in industries as varied as automotive, healthcare, government, manufacturing, communications, construction, chemical, aerospace, and more. The latest edition of this bestselling book acts as the perfect supplement to any project management textbook or as an aid in the preparation for the PMP certification exam. The author includes new topics, like risk management, information sharing, scope changes, crisis dashboards, and innovation. The Sixth Edition includes ten new case studies and a wide array of updates to existing cases to meet today's industry standards and reflect the unique challenges facing modern project management professionals. This new edition: Features 10 new case studies from LEGO, NorthStar, Berlin Brandenburg Airport, and more Includes over 100 case studies drawn from real companies illustrating successful and poor implementation of project management Provides coverage of broad areas of project management as well as focused content on the automotive, healthcare, government, manufacturing, communications, construction, chemical, and aerospace industries Offers new topics including risk management, information sharing, scope changes, crisis dashboards, and innovation Perfect for students taking courses on project management during their undergraduate degrees and at the graduate level as part of an MBA or graduate engineering program, Project Management Case Studies is also an indispensable resource for consulting and training companies who work with other professionals.

Polymer Electrolyte Membrane (PEM) fuel cells hold great promise as a potential alternative to conventional fossil-fuel-powered energy sources. However, they produce waste heat, and the water used in their system must be carefully controlled and monitored. This monograph in Momentum Press's 'Sustainable Energy Series' offers the most up-to-date research on advanced methods for managing both waste heat and monitoring water flows and water concentration in PEM fuel cells. The most workable solutions to these problems and the challenges that still lie ahead are emphasized. The reader will find: A review of multi-component mass transport phenomena, particularly as they apply to gas flow and hydrogen and air flow Coverage of multi-phase flow and heat transfer characteristics of PEM fuel cells Unique coverage of solid water phase behavior of PEM fuel cells and subfreezing temperature operation

This volume focuses on recent scientific and technological developments in silicon-based (i.e., silicon nitride, SiAlONs, silicon carbide, silicon oxynitride) structural ceramics. Authors from academia and industry assess the current state of the art in slilicon-based structual ceramics. Industrial case studies are advocated to highlight the development and application of these materials in real engineering environments.

This book highlights key methods for the mathematical modeling and solution of nonstationary dynamic problems in the theory of magnetoelasticity. It also reveals the richness of physical effects caused by the interaction of electromagnetic and mechanical phenomena in both conducting non-ferromagnetic and dielectric magnetically active deformable bodies. The studies are limited to elastic bodies considering small deformations. The book consists of two parts, the first of which derives the system of equations for describing magnetoelasticity, the surface conditions, and equations describing the perturbations behavior of non-ferromagnetic conducting media interacting with external magnetic fields. These equations are based on the main nonlinear equations and relations of mechanics and quasistatic electrodynamics of continuous media. On this basis, the book puts forward a number of qualitative and quantitative results, solving selected problems of magnetoelastic wave propagation. In turn, the second part considers surface waves in magnetostrictive and piezomagnetic media. It obtains the system of equations, surface conditions and state equations describing the perturbations behavior in magnetoactive ferromagnetic dielectric media interacting with external magnetic fields. Lastly, the book studies the excitations and propagation of new types of surface waves and oscillations in these media, conditioned by the magnetostrictive properties of the respective medium and its interaction with an external magnetic field.

During the last years computational methods lead to new approaches that can be applied within medical practice. Based on the tremendous advances in medical imaging and high-performance computing, virtual testing is able to help in medical decision processes or implant designs. Current challenges in medicine and engineering are related to the application of computational methods to clinical medicine and the study of biological systems at different scales. Additionally manufacturers will be able to use computational tools and methods to predict the performance of their medical devices in virtual patients. The physical and animal testing procedures could be reduced by virtual prototyping of medical devices. Here simulations can enhance the performance of alternate device designs for a range of virtual patients. This will lead to a refinement of designs and to safer products. This book summarizes different aspects of approaches to enhance function, production, initialization and complications of different types of implants and related topics.

A comprehensive introduction to the emerging field of nonequilibrium thermodynamics

Nonequilibrium thermodynamics has emerged as a promising new field of study dealing with irreversible processes in matter, and is fundamental to understanding these systems on a wide range of length scales, including the micro- or nanoscopic level. Many of the most cutting-edge technological applications within this field require a fully nonlinear framework far from equilibrium. To create a unified framework that accommodates such needs, author Hans Christian ִtinger presents a new paradigm--beyond equilibrium thermodynamics.

In addition to being based on the latest developments, Beyond Equilibrium Thermodynamics is itself a significant development in the field. This groundbreaking text presents the first comprehensive approach to thermodynamics and statistical methods far from equilibrium. It clearly explains physical concepts, describes mathematics, and presents problems and solutions. In defining the new paradigm of beyond equilibrium thermodynamics, this book has the potential for opening a new field in the study of irreversible processes.

The text features: A presentation based on a unified framework A comprehensive list of applications of nonequilibrium thermodynamics An introduction to simulation techniques--a key to future applications Systematic classification of beyond equilibrium simulation techniques Guidance in anticipating the logical structure of results before actually deriving them Inclusion of a covariant version of the thermodynamic framework for relativistic applications More than 200 exercises with detailed solutions Careful referencing, including section or pagenumbers

Suitable for use as a graduate-level teaching tool or a reference for working scientists, Beyond Equilibrium Thermodynamics provides a concrete understanding of what had previously been a largely abstract field.

This extensively updated and revised version builds on the success of the first edition featuring new discoveries in powder technology, spraying techniques, new coatings applications and testing techniques for coatings -- Many new spray techniques are considered that did not exist when the first edition was published!

The book begins with coverage of materials used, pre-spray treatment, and the techniques used. It then leads into the physics and chemistry of spraying and discusses coatings build-up. Characterization methods and the properties of the applied coatings are presented, and the book concludes with a lengthy chapters on thermal spray applications covers such areas as the aeronautics and space, automobiles, ceramics, chemicals, civil engineering, decorative coatings, electronics, energy generation and transport, iron and steel, medicine, mining and the nuclear industries.

MICROBIAL INTERACTIONS AT NANOBIOTECHNOLOGY INTERFACES This book covers a wide range of topics including synthesis of nanomaterials with specific size, shape, and properties, structure-function relationships, tailoring the surface of nanomaterials for improving the properties, interaction of nanomaterials with proteins/microorganism/eukaryotic cells, and applications in different sectors. This book also provides a strong foundation for researchers who are interested to venture into developing functionalized nanomaterials for any biological applications in their research. Practical concepts such as modelling nanomaterials, and simulating the molecular interactions with biomolecules, transcriptomic or genomic approaches, advanced imaging techniques to investigate the functionalization of nanomaterials/interaction of nanomaterials with biomolecules and microorganisms are some of the chapters that offer significant benefits to the researchers.

A long-awaited text that fills the void in non-ferrous metallurgy literature

While most undergraduate metallurgy textbooks focus on iron, the most commercially important metallic element, Structure-Property Relations in Nonferrous Metals is a comprehensive textbook covering the remaining eighty-two nonferrous metals. Designed to be readily accessible to materials engineering students at all academic levels, the text describes the relationships between the atomic-, crystal-, and micro-structures of nonferrous metals, and such physical behaviors as strength, ductility, electrical conductivity, and corrosion.

In order to capture and retain students' interest, the authors maintain a strong focus on practical application. Each chapter supplements fundamental concepts with engaging examples from actual engineering case studies and industrial projects, directly relating content to real-world application.

Part One describes the general concepts of crystal- and micro-structures and the implications of these structures for the mechanical, thermal, and electronic properties of nonferrous metals, intermetallic compounds, and metal matrix composites.

Chapters focus on such relevant topics as: Point, line, and planar defects and their effects on a material's properties Dislocations and strengthening mechanisms Fracture and fatigue Strain rate effects and creep Deviations from classic crystallinity Processing methods Composites and intermetallic compounds

Part Two builds on Part One by exploring how the concepts presented define the properties of a particular metallic element and its alloys, and how these properties contribute to the engineering uses of each nonferrous metal.

Anaccompanying ftp site contains homework problems, appendices, bibliographies, and tables of data indicating the nations producing metallic elements and the quantities produced. Structure-Property Relations in Nonferrous Metals is a valuable reference for both students in undergraduate metallurgy courses and practicing engineers.

In contrast with previous books on mechatronics and machine vision in practice, a significant number of chapters focus on systems designed for human interaction and deciphering human motion. Examples illustrate assistive actuation of hip joints, the augmentation of touch sense in artificial hand prostheses and helping stroke survivors in repetitive motion therapy. Interactive mechatronics and the experience of developing machine interfaces has enabled an examination of how we use mechatronics in the service of training, and even to consider why computer games perhaps appear to capture attention so much more readily than a human instructor! Mechatronics continues to be an exciting and developing field. It is now an essential part of our world and living experience. This and the previous books in this series illustrate the journey in developing the use of mechatronics so far. We anticipate that you will find the chapters here an equal source of inspiration for new devices to solve the challenges of new applications, and of course as a resource for teaching and inspiring the new generation of mechatronics engineers.

Focusing on spectroscopic properties of molecular systems, Quantum Modeling of Molecular Materials presents the state-of-the-art methods in theoretical chemistry that are used to determine molecular properties relevant to different spectroscopies. This timely reference gives a basic presentation of response theory and its application to the simulation of spectroscopic properties of molecular materials. This in-depth presentation of time-dependent response theory and its applications in spectroscopy provides an important advance towards a modern vision of theoretical tools for researchers in academia and industry and postgraduate students.