Electrochemical Micromachining for Nanofabrication, MEMS and Nanotechnology is the first book solely dedicated to electrochemical micromachining (EMM). It begins with fundamentals, techniques, processes, and conditions, continuing with in-depth discussions of mechanisms of material removal, including an empirical model on the material removal rate for EMM (supported by experimental validation). The book moves next to construction-related features of EMM setup suitable for industrial micromachining applications, varying types of EMM, and the latest developments in the improvement of EMM setup. Further, it covers power supply, roll of electrolyte, and other major factors influencing EMM processes, and reports research findings concerning the improvement of machining accuracy and efficiency. Finally, the book devotes a chapter to the design and development of micro-tools, one of the most vital components in EMM.

Efficiently and profitably delivering quality flexible packaging to the marketplace requires designing and manufacturing products that are both "fit-to-use" and "fit-to-make." The engineering function in a flexible packaging enterprise must attend to these dual design challenges.

"Flexible Packaging" discusses the basic processes used to manufacture flexible packaging products, including rotogravure printing, flexographic printing, adhesive lamination, extrusion lamination/coating; and finishing/slitting. These processes are then related to the machines used to practice them, emphasising the basics of machines control systems, and options to minimize wasted time and materials between production jobs.

Raw materials are also considered, including the three basic forms: "Rollstock" (paper, foil, plastic films); "Resin"; and "Wets" (inks, varnishes, primers). Guidance is provided on both material selection, and on adding value through enhancement or modification of the materials physical features.

A measures section covers both primary material features - such as tensile, elongation, modulus and elastic and plastic regions - and secondary quality characteristics such as seal and bond strengths, coefficient of friction, oxygen barrier and moisture vapour barrier.
Helps engineers improve existing raw material selection and manufacturing processes for manufacturing functional flexible packaging materials.Covers all aspects of delivering high value packaging to the customer from the raw materials, to the methods of processing them, the machines used to do it, and the measures required to gauge the characteristics of the product.Helps engineers to minimize waste and unproductive time in production."

Additive manufacturing (AM) of metals and composites using laser energy, direct energy deposition, electron beam methods, and wire arc melting have recently gained importance due to their advantages in fabricating the complex structure. Today, it has become possible to reliably manufacture dense parts with certain AM processes for many materials, including steels, aluminum and titanium alloys, superalloys, metal-based composites, and ceramic matrix composites. In the near future, the AM material variety will most likely grow further, with high-performance materials such as intermetallic compounds and high entropy alloys already under investigation. Additive Manufacturing Applications for Metals and Composites is a pivotal reference source that provides vital research on advancing methods and technological developments within additive manufacturing practices. Special attention is paid to the material design of additive manufacturing of parts, the choice of feedstock materials, the metallurgical behavior and synthesis principle during the manufacturing process, and the resulted microstructures and properties, as well as the relationship between these factors. While highlighting topics such as numerical modeling, intermetallic compounds, and statistical techniques, this publication is ideally designed for students, engineers, researchers, manufacturers, technologists, academicians, practitioners, scholars, and educators.

Hermeticity of Electronic Packages is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageuespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journalsuor only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.

This book provides a comprehensive overview of how to strategically manage the movement and storage of products or materials from any point in the manufacturing process to customer fulfillment. Topics covered include important tools for strategic decision making, transport, packaging, warehousing, retailing, customer services and future trends.

Man-made or industrial processes, localised or geographically distributed, need be automated in order to ensure they produce quality, consistent, and cost-effective goods or services. Automation systems for these processes broadly consist of instrumentation, control, human interface, and communication subsystems. This book introduces the basics of philosophy, technology, terminology, and practices of modern automation systems with simple illustrations and examples.

3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and Additive Manufacturing of Electronics: Principles and Applications provides a comprehensive overview of the recent progress and discusses the fundamentals of the 3D printed electronics technologies, their respective advantages, shortcomings and potential applications. The book covers conventional contact printing techniques for printed electronics, 3D electronics printing techniques, materials and inks inks for 3D-printed electronics, substrates and processing for 3D-printed electronics, sintering techniques for metallic nanoparticle inks, designs and simulations, applications of 3D-printed electronics, and future trends. The book includes several related problems for the reader to test his or her understanding of the topics.This book is a good guide for anyone who is interested in the 3D printing of electronics. The book is also an effective textbook for undergraduate and graduate courses that aim to arm their students with a thorough understanding of the fundamentals of 3D printed electronics.Related Link(s)

3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and Additive Manufacturing of Electronics: Principles and Applications provides a comprehensive overview of the recent progress and discusses the fundamentals of the 3D printed electronics technologies, their respective advantages, shortcomings and potential applications. The book covers conventional contact printing techniques for printed electronics, 3D electronics printing techniques, materials and inks inks for 3D-printed electronics, substrates and processing for 3D-printed electronics, sintering techniques for metallic nanoparticle inks, designs and simulations, applications of 3D-printed electronics, and future trends. The book includes several related problems for the reader to test his or her understanding of the topics.This book is a good guide for anyone who is interested in the 3D printing of electronics. The book is also an effective textbook for undergraduate and graduate courses that aim to arm their students with a thorough understanding of the fundamentals of 3D printed electronics.Related Link(s)

Any time objects and their (self-)organization are to be put into use, their models and methods of thinking as well as their designing and manufacturing need to be reinvented.4D printing is a future technology that is capable of bringing 3D objects to life. This ability, which gives objects the power to change shape or properties over time through energy stimulation from active materials and additive manufacturing, makes it possible to envisage technological breakthroughs while challenging the relationship between people and objects.4D Printing 1 presents the different facets of this technology, providing an objective, critical and even disruptive viewpoint to enable its existence and development, and to stimulate the creative drive that industry, society and humanity need in the perpetual quest for evolution and transformation.

Biology and Engineering of Stem Cell Niches covers a wide spectrum of research and current knowledge on embryonic and adult stem cell niches, focusing on the understanding of stem cell niche molecules and signaling mechanisms, including cell-cell/cell-matrix interactions. The book comprehensively reviews factors regulating stem cell behavior and the corresponding approaches for understanding the subsequent effect of providing the proper matrix molecules, mechanical cues, and/or chemical cues. It encompasses a variety of tools and techniques for developing biomaterials-based methods to model synthetic stem cell niches in vivo, or to enhance and direct stem cell fate in vitro. A final section of the book discusses stem cell niche bioengineering strategies and current advances in each tissue type.

Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle explores the latest technologies resulting from the integration of sensing components throughout the production supply chain, and the resulting possibilities to improve efficiency, flexibility, and product quality. The authors present cutting edge research into data storage in components, communication devices, data acquisition, as well as new industrial applications. Detailed technical descriptions of the tools are presented in addition to discussions of how these systems have been used, the benefits they provide, and what industry problems they could tackle in the future. This is essential reading for researchers and production engineers interested in the potential of cyber physical systems to optimize all parts of the supply chain.

The manufacturing industry has experienced dramatic change over the years with growing advancements, implementations, and applications in technology. Manufacturing Intelligence for Industrial Engineering: Methods for System Self-Organization, Learning, and Adaptation focuses on the latest innovations for developing, describing, integrating, sharing, and processing intelligent activities in the process of manufacturing in engineering. Containing research from leading international experts, this publication provides readers with scientific foundations, theories, and key technologies of manufacturing intelligence.

Algal Green Chemistry: Recent Progress in Biotechnology presents emerging information on green algal technology for the production of diverse chemicals, metabolites, and other products of commercial value. This book describes and emphasizes the emerging information on green algal technology, with a special emphasis on the production of diverse chemicals, metabolites, and products from algae and cyanobacteria. Topics featured in the book are exceedingly valuable for researchers and scientists in the field of algal green chemistry, with many not covered in current academic studies. It is a unique source of information for scientists, researchers, and biotechnologists who are looking for the development of new technologies in bioremediation, eco-friendly and alternative biofuels, biofertilizers, biogenic biocides, bioplastics, cosmeceuticals, sunscreens, antibiotics, anti-aging, and an array of other biotechnologically important chemicals for human life and their contiguous environment. This book is a great asset for students, researchers, and biotechnologists.

Recent improvements in business process strategies have allowed more opportunities to attain greater developmental performances. This has led to higher success in day-to-day production and overall competitive advantage. The Handbook of Research on Manufacturing Process Modeling and Optimization Strategies is a pivotal reference source for the latest research on the various manufacturing methodologies and highlights the best optimization approaches to achieve boosted process performance. Featuring extensive coverage on relevant areas such as genetic algorithms, fuzzy set theory, and soft computing techniques, this publication is an ideal resource for researchers, practitioners, academicians, designers, manufacturing engineers, and institutions involved in design and manufacturing projects.

The goal of this book is to crystallize the emerging mobile computing technologies and trends into positive efforts to focus on the most promising solutions in services computing. Many toys built today are increasingly using these technologies together and it is important to understand the various research and practical issues. The book will provide clear proof that mobile technologies are playing an ever increasing important and critical role in supporting toy computing, which is a new research discipline in computer science. It is also expected that the book will further research new best practices and directions in toy computing. The goal of this book is to bring together academics and practitioners to describe the use and synergy between the above-mentioned technologies. This book is mainly intended for researchers and students working in computer science and engineering, and for toy industry technology providers, having particular interests in mobile services. The wide range of authors of this book will help the various communities understand both specific and common problems. This book facilities software developers and researchers to become more aware of this challenging research opportunity. As well, the book is soliciting shall provide valuable strategic outlook on the emerging toy industry.

This thesis studies the general heat conduction law, irreversible thermodynamics and the size effect of thermal conductivity exhibited in nanosystems from the perspective of recently developed thermomass theory. The derivation bridges the microscopic phonon Boltzmann equation and macroscopic continuum mechanics. Key concepts such as entropy production, temperature and the Onsager reciprocal relation are revisited in the case of non-Fourier heat conduction. Lastly, useful expressions are extracted from the picture of phonon gas dynamics and are used to successfully predict effective thermal conductivity in nanosystems.

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations.
Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability.
With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs).
This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.
Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
Coverage of environmentally friendly 'green encapsulants'
Practical coverage of faults and defects: how to analyze them and how to avoid them"

Digital factory is a comprehensive approach providing methodologies, models and tools that support manufacturing enterprises in the rearrangement of their organizational structures to deal with expected changes in manufacturing processes and markets. Digital Factory for Human-oriented Production Systems investigates the impact of the digital factory through a consideration of the entire product/process lifecycle, and the broad network of product engineering, material and component suppliers, manufacturing equipment suppliers, and customers involved in current and next generation manufacturing. It covers the utilization and integration of: human body ergonomics models; production system discrete event simulation; 3D/virtual and augmented reality visualization; collaborative design tools; automatic data capture; and knowledge management systems based on semantic web ontologies integrated by a continuous data management. The coverage of various types of factory and manufacturing phases, representations and simulations allows researchers in academia and industry to perform a dynamic analysis and up-to-date modeling of the processes involved. Digital Factory for Human-oriented Production Systems describes the tools that allow a move towards the integrated digital factory and underlines the business impact that companies can obtain by adopting these tools. As well as benefiting international organizations, the proposed methodologies and technologies have also been developed in order to facilitate their adoption by small or medium-sized businesses, making them relevant to all product engineers and managers who want improve the efficiency and effectiveness of their enterprises.

This book is a comprehensive source of the fundamentals, process parameters, instrumental components and applications of laser-induced breakdown spectroscopy (LIBS). The effect of multiple pulses on material ablation, plasma dynamics and plasma emission is presented. A heuristic plasma modeling allows to simulate complex experimental plasma spectra. These methods and findings form the basis for a variety of applications to perform quantitative multi-element analysis with LIBS. These application potentials of LIBS have really boosted in the last years ranging from bulk analysis of metallic alloys and non-conducting materials, via spatially resolved analysis and depth profiling covering measuring objects in all physical states: gaseous, liquid and solid. Dedicated chapters present LIBS investigations for these tasks with special emphasis on the methodical and instrumental concepts as well as the optimization strategies for a quantitative analysis. Requirements, concepts, design and characteristic features of LIBS instruments are described covering laboratory systems, inspections systems for in-line process control, mobile systems and remote systems. State-of-the-art industrial applications of LIBS systems are presented demonstrating the benefits of inline process control for improved process guiding and quality assurance purposes.

The importance of surface metrology has long been acknowledged in manufacturing and mechanical engineering, but has now gained growing recognition in an expanding number of new applications in fields such as semiconductors, electronics and optics. Metrology is the scientific study of measurement, and surface metrology is the study of the measurement of rough surfaces. In this book, Professor David Whitehouse, an internationally acknowledged subject expert, covers the wide range of theory and practice, including the use of new methods of instrumentation.
- Written by one of the world's leading metrologists
- Covers electronics and optics applications as well as mechanical
- Written for mechanical and manufacturing engineers, tribologists and precision engineers in industry and academia

* Covers all aspects of the data acquisition system from design and specification to programming, installation and configuration
* Gives both the novice and experienced user a solid understanding of interfacing the PC and standalone instruments to real-world signals from the laboratory to the industrial plant
* Provides a thorough grasp of PC data acquisition systems and the ability to design, specify, install and configure and program data acquisition systems quickly and effectively
This book focuses on data acquisition and control using the PC and standalone instruments. The PC has made a dramatic impact in the ease with which the technician, scientist and engineer today can set up their own test and measurement system at a remarkably low cost. And this book aims to show you how easy it is with plenty of carefully researched information. The popular IEEE 488 interface is also covered. All aspects of the data acquisition system are included from design and specification to programming, installation and configuration. This book gives both the novice and experienced user a solid grasp of the principles and practical implementation of interfacing the PC and standalone instruments to real-world signals from the laboratory to the industrial plant. Once you have read the book, you will have a thorough grasp of PC data acquisition systems and will be able to design, specify, install and configure and program data acquisition systems quickly and effectively.
* Covers all aspects of the data acquisition system from design and specification to programming, installation and configuration
* Gives both the novice and experienced user a solid understanding of interfacing the PC and standalone instruments to real-world signals from the laboratory to the industrial plant
* Provides a thorough grasp of PC data acquisition systems and the ability to design, specify, install and configure and program data acquisition systems quickly and effectively

This authored monograph provides in-depth analysis and methods for aligning electricity demand of manufacturing systems to VRE supply. The book broaches both long-term system changes and real-time manufacturing execution and control, and the author presents a concept with different options for improved energy flexibility including battery, compressed air and embodied energy storage. The reader will also find a detailed application procedure as well as an implementation into a simulation prototype software. The book concludes with two case studies. The target audience primarily comprises research experts in the field of green manufacturing systems.

3D Printing in Podiatric Medicine compiles an interdisciplinary range of scientific literature, laboratory developments, industrial implications and futuristic avenues in this field. The book provides recent developments and research breakthroughs in 3D printing in podiatric medicine, such as functionalized feedstock systems, smart products, process characteristics, modeling and optimization of printed systems and products, and industrial applications. It covers best practices for 3D printing methods to capture, document and validate challenges at the early stage of the design process. The book's content then goes into mitigating design strategies to address these challenges without compromising the cost, safety and quality of the device. This book supports new and emerging specializations and provides a comprehensive collection of technical notes, research designs, design methods and processes and case studies.

Metal protectin, including both metal treatments and coating systems. affords mutual protection for both can and contents. this book is the first reference to meld the knowledge of chemical companies and canmaking companies, covering materials and processes used in both protective and decorative aspects of metal packaging. Topics include basic substrates (aluminum and steel), demands of the markets served, basic metal-forming processes, and the specific decorative and protctive needs of different packaging types, with emphasis give to the technologies most likely to be used, such as ultraviolet curing. This practical reference gives readers a backround and familiarity with terminology and technology and gives insight into why certain technologies are used over others.