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Books > Science & Mathematics > Chemistry > Analytical chemistry > Qualitative analytical chemistry > Chemical spectroscopy, spectrochemistry
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Advances in Rapid Thermal and Integrated Processing (Paperback, Softcover reprint of hardcover 1st ed. 1996)
Loot Price: R11,895
Discovery Miles 118 950
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Advances in Rapid Thermal and Integrated Processing (Paperback, Softcover reprint of hardcover 1st ed. 1996)
Series: NATO Science Series E:, 318
Expected to ship within 10 - 15 working days
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Rapid thermal and integrated processing is an emerging single-wafer
technology in ULSI semiconductor manufacturing, electrical
engineering, applied physics and materials science. Here, the
physics and engineering of this technology are discussed at the
graduate level. Three interrelated areas are covered. First, the
thermophysics of photon-induced annealing of semiconductor and
related materials, including fundamental pyrometry and emissivity
issues, the modelling of reactor designs and processes, and their
relation to temperature uniformity. Second, process integration,
treating the advances in basic equipment design, scale-up,
integrated cluster-tool equipment, including wafer cleaning and
integrated processing. Third, the deposition and processing of thin
epitaxial, dielectric and metal films, covering selective
deposition and epitaxy, integrated processing of layer stacks, and
new areas of potential application, such as the processing of III-V
semiconductor structures and thin- film head processing for
high-density magnetic data storage.
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