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Power Electronic Packaging - Design, Assembly Process, Reliability and Modeling (Paperback, 2012 ed.)
Loot Price: R7,386
Discovery Miles 73 860
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Power Electronic Packaging - Design, Assembly Process, Reliability and Modeling (Paperback, 2012 ed.)
Expected to ship within 10 - 15 working days
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"Power Electronic Packaging "presents an in-depth overview of power
electronic packaging design, assembly, reliability and modeling.
Since there is a drastic difference between IC fabrication and
power electronic packaging, the book systematically introduces
typical power electronic packaging design, assembly, reliability
and failure analysis and material selection soreaders can clearly
understand each task's unique characteristics. Power electronic
packaging is one of the fastest growing segments in the power
electronic industry, due to the rapid growth of power integrated
circuit (IC) fabrication, especially for applications like
portable, consumer, home, computing and automotive electronics.
This book alsocovers how advances in both semiconductor content and
power advanced package design have helped cause advances in power
device capability in recent years. The author extrapolates themost
recenttrends in the book's areas of focus to highlight where
further improvement in materials and techniques can drive continued
advancements, particularly in thermal management, usability,
efficiency, reliability and overall cost of power semiconductor
solutions."
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