Dispersed Manufacturing Networks provides new perspectives of dispersed manufacturing systems from three points of view. The first is that offered by complex systems theory, particularly on how agents in these industrial networks interact and how that provides possibility for coordination. The book also elaborates on issues of coordination and planning, as well as examining new solutions and challenges for logistics problems and collaboration in engineering networks within the internationalisation perspective.

The impact of globalization is discussed for both managerial decision-making and operational performance of supply chains. A strong emphasis is placed on the need for continuous decision-making with recognition of the fact that networks of loosely connected agents require different approaches.

Both researchers and professionals will welcome Dispersed Manufacturing Networks. It is an informative guide for those researching and working across a range of fields.

Although many books outline approaches for successful ERP implementations, the data shows that most ERP efforts yield minimal return on investment (ROI), with most projects failing. Directing the ERP Implementation: A Best Practice Guide to Avoiding Program Failure Traps While Tuning System Performance supplies best practices along with a proven roadmap for improving the odds of system implementation success. By adhering to the time-tested framework outlined in the book, your organization will be able to commit to the precepts and practices that lead to successful implementations. Supplying an innovative and fast-track, yet comprehensive, approach to ERP implementation success, the book provides practical guidance to help executive leadership do the right things along the ERP journey. Explains how to engineer a project plan, generate requirements, and obtain a results-oriented commitment Details the practical deployment framework essential for success and includes a variety of tools to position an organization for success Describes how to ensure proactive involvement by the project team, executive sponsors, stakeholders, and working-level systems champions Highlighting the essential planning ingredients that are frequently omitted from ERP implementation start-ups, the book provides readers with the planning framework and proven foundational methods and principles to ensure smooth planning and systems deployment, product quality, and maximum ROI. The book covers everything from software selection and integration to common snags, traps, and black holes. Best practice tool sets include proven methods such as information workmanship standard, which defines quality; conference room piloting, which assists in matching teams to objectives seamlessly; education, training, and implementation framework, which addresses preparing the operating production environment; and project monitoring and deployment, covering project and risk management.

Efficiently and profitably delivering quality flexible packaging to the marketplace requires designing and manufacturing products that are both "fit-to-use" and "fit-to-make." The engineering function in a flexible packaging enterprise must attend to these dual design challenges.

"Flexible Packaging" discusses the basic processes used to manufacture flexible packaging products, including rotogravure printing, flexographic printing, adhesive lamination, extrusion lamination/coating; and finishing/slitting. These processes are then related to the machines used to practice them, emphasising the basics of machines control systems, and options to minimize wasted time and materials between production jobs.

Raw materials are also considered, including the three basic forms: "Rollstock" (paper, foil, plastic films); "Resin"; and "Wets" (inks, varnishes, primers). Guidance is provided on both material selection, and on adding value through enhancement or modification of the materials physical features.

A measures section covers both primary material features - such as tensile, elongation, modulus and elastic and plastic regions - and secondary quality characteristics such as seal and bond strengths, coefficient of friction, oxygen barrier and moisture vapour barrier.
Helps engineers improve existing raw material selection and manufacturing processes for manufacturing functional flexible packaging materials.Covers all aspects of delivering high value packaging to the customer from the raw materials, to the methods of processing them, the machines used to do it, and the measures required to gauge the characteristics of the product.Helps engineers to minimize waste and unproductive time in production."

Applies Lean concepts to a high-variety, low-volume service business, which are more prevalent than high volume manufacturing companies. Illustrates all the Lean concepts in a real-world example that approached Lean management in the intended way-to support and develop people to continually improve processes in a respectful environment. Illustrates an effective organic change management process that grows the new culture rather than trying to force tools mechanistically on employees and assiociates. The vibrant graphic novel format visually brings the story to life. Co-Written by best-selling author Jeffrey Liker -- the world's expert on the Toyota Way.

This book facilitates the access to the various disciplines, highlighting their many points of contacts and making the clear the message that membrane-based sensors represent the future of the research in every field, including chemistry, biology, biomedicine, textiles, and electronics.

Design for Manufacturability: How to Use Concurrent Engineering to Rapidly Develop Low-Cost, High-Quality Products for Lean Production shows how to use concurrent engineering teams to design products for all aspects of manufacturing with the lowest cost, the highest quality, and the quickest time to stable production. Extending the concepts of design for manufacturability to an advanced product development model, the book explains how to simultaneously make major improvements in all these product development goals, while enabling effective implementation of Lean Production and quality programs. Illustrating how to make the most of lessons learned from previous projects, the book proposes numerous improvements to current product development practices, education, and management. It outlines effective procedures to standardize parts and materials, save time and money with off-the-shelf parts, and implement a standardization program. It also spells out how to work with the purchasing department early on to select parts and materials that maximize quality and availability while minimizing part lead-times and ensuring desired functionality. Describes how to design families of products for Lean Production, build-to-order, and mass customization Emphasizes the importance of quantifying all product and overhead costs and then provides easy ways to quantify total cost Details dozens of design guidelines for product design, including assembly, fastening, test, repair, and maintenance Presents numerous design guidelines for designing parts for manufacturability Shows how to design in quality and reliability with many quality guidelines and sections on mistake-proofing (poka-yoke) Describing how to design parts for optimal manufacturability and compatibility with factory processes, the book provides a big picture perspective that emphasizes designing for the lowest total cost and time to stable production. After reading this book you will understand how to reduce total costs, ramp up quickly to volume production without delays or extra cost, and be able to scale up production rapidly so as not to limit growth.

This text explains just how and why the best-of-class pump users are consistently achieving superior run lengths, low maintenance expenditures and unexcelled safety and reliability. Written by practicing engineers whose working career was marked by involvement in pump specification, installation, reliability assessment, component upgrading, maintenance cost reduction, operation, troubleshooting and all conceivable facets of pumping technology, this text describes in detail how to accomplish best-of-class performance and low life cycle cost.

Happiness is...a whole new book of Peanuts collectibles! Attention Peanuts Gang lovers! Here is another huge volume of treasures from our favorite crowd of kids. Jan Lindenberger has made another visit to the massive collection of Cher Porges to bring back over six hundred full color photographs of "Peanut-phernalia" not seen in any other book! In the enormous field of Peanuts collectibles, this series is a must, providing the photography, information, and up-to-date prices you need to keep your collection at its best. This is a fantastic book for the serious collector, but it's also a great Peanuts tribute-if you'd rather just play catch with Charlie Brown, get advice from Lucy, play a duet with Schroeder, fly with Snoopy against the Red Baron, or hang around the pumpkin patch to get philosophical with Linus. This book celebrates the wonderful innocence, cleverness, and unique humor of Charles Schulz's Peanut Gang.

The Malcolm Baldrige National Quality Award is the highest level of national recognition for performance excellence that a U.S. organization can receive. Now in its 18th edition, Baldrige Award Winning Quality is still the most widely used and recognized book on the Malcolm Baldrige National Quality Award. It provides readers with a simple, yet comprehensive resource, for understanding the most current criteria for this prestigious business performance award. The definitive resource for helping companies achieve world-class results, Baldrige Award Winning Quality - 18th Edition: How to Interpret the Baldrige Criteria for Performance Excellence is the only book on the Baldrige criteria to detail, in simple and straightforward language, every category, examination item, and area to address. From understanding the scoring system to preparing for a site visit, it guides you through all stages in the process. Reflecting the new criteria (2013-2014) that address education and healthcare, this edition outlines a comprehensive plan that is suitable for any company in any industry. Offering detailed explanations of each of the 17 "Examination Items" and the 36 "Areas to Address" that compose the seven major categories, the book reveals exactly what examiners look for in each area and suggests what you need to include. It also discusses: Criteria of leadership and the role of senior management in the award process Importance of a long- and short-term strategic plan Where and how to satisfy the requirements for demonstrating effective "process" and "results" Lists of state award programs based on the Baldrige criteria Core values and themes that underlie the award How to weigh the importance of the 36 "Areas to Address" The significance of the Baldrige scoring scale, and its role in achieving performance excellence The book devotes a chapter to supplying a clear and concise explanation on how to prepare for a site visit from the board of examiners. It details each facet of the site visit, including its purpose, what a Baldrige examiner looks for, and the questions typically asked during the visit. Complete with rules for preparing graphics and charts, the book includes helpful tips to help you avoid common mistakes when completing the application.

This is a comprehensive look at decorative walking sticks, including their use, history, and craftsmanship. Stoeber explores the rise and fall of the cane industry. A chapter on materials familiarizes the reader with the wide range of canes available. This cultural history will become a useful reference for antique dealers and collectors as well as the beginner.

With 30 years of driving Lean transformations under his belt-both in-house at Danaher and as the founder of Lean Horizons-Mark C. DeLuzio has a vantage point across a variety of industries. He often hears the challenges Lean leaders face now that they've been implementing Lean for a decade or more. They are concerned that they aren't getting the results they used to, and they don't know why. Most leaders believe their problems are unique to their company, but Mark sees more commonalities than differences. Flatlined: Why Lean Transformations Fail and What to Do About It draws on the author's experience as the original pioneer of the most successful Lean business system next to Toyota, as well as his progress over the past 18 years in helping companies replicate what Danaher achieved. Mark DeLuzio knows you need an actionable approach to make rapid shifts, not theory. With this book, Mark DeLuzio gives you: * the reasons why companies are now flatlining with Lean; * five steps to solving this problem, no matter what your industry or corporate culture; * real talk on why your organization is probably mediocre (even if it's making a lot of money) and how to disrupt it to make it genuinely world class; * the questions you should always be asking at every stage and level of your Lean initiative.

This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging."

Since the first edition of "Principles of Packaging Development" was published, the packaging industry has undergone many profound changes. These have included the virtual elimination of cellophane and its replacement with oriented polypropylene as a carton overwrap, fluid milk in blow-molded HDPE bottles, PET beverage bottles, cookie bags and cartons lined with polyolefin coextrusions instead of waxed glassine, and bread in reclosable polyolefin and coextruded film bags. New phrases have also worked their way into the lexicon of the practic ing packaging technologist, such as "child resistance" and "tamper evident. " This most popular text on packaging demanded updating. How these phrases and ideas have affected the industry in the 1980s and how they will probably alter its course in the future are treated. New concepts of packaging system planning and forecasting tech niques are intruding into package management, and new chapters will introduce them to the reader. The years have added a certain degree of maturity to the packaging industry. Not only have the original authors broadened their per spectives and changed professional responsibilities, we have also in cluded a third co-author, Dr. Aaron L. Brody, whose experience in the industry, academic background, and erudite insights into the very na ture of packaging have added an unparalled degree of depth to this book. We would like to thank David L."

Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC), the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology."

The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. * Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. * Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. * Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. * Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Your customers have become increasingly sophisticated and more connected than ever-broadcasting real-time feedback to a cloud of followers who are watching your every move. As savvy customers continue to demand more for less, organizations that choose to rest on their laurels will quickly see their market share evaporate. Gemba Walks for Service Excellence: The Step-by-Step Guide for Identifying Service Delighters guides readers on a journey towards organizational effectiveness that supports a culture of service excellence. It provides a fresh perspective on how to apply Gemba Walks-visiting the areas where the service provider interacts directly with the customer-to identify new service delighters and make a lasting positive impression on customers.Using an abundance of color pictures and hand-drawn graphics, Robert Petruska builds on his considerable experience implementing Lean and quality systems to demonstrate how to create the infrastructure required for service excellence to flourish. Presented in an easy-to-follow format that anyone in the service industry can enjoy, this workbook: Shares proven techniques used in Lean manufacturing that can easily be applied to the service industry Guides new employees and veterans alike through a journey filled with real-life stories that inspire confidence Contains hands-on exercises that allow you to immediately apply the ideas to your own work Includes downloadable resources with innovative "placemats" designed to provide stepping stones on a development path for your team to achieve a competitive advantage Filled with real-world examples and stories of service excellence, the book will help you develop the counterintuitive thinking needed to discover new sources of customer delight. Designed to be used with your entire team, this workbook will guide your organization, step by step, through a plan for assessing, prioritizing, and implementing innovative ideas that will lead to unprecedented levels of service excellence.

Man-made or industrial processes, localised or geographically distributed, need be automated in order to ensure they produce quality, consistent, and cost-effective goods or services. Automation systems for these processes broadly consist of instrumentation, control, human interface, and communication subsystems. This book introduces the basics of philosophy, technology, terminology, and practices of modern automation systems with simple illustrations and examples.

Transition Engineering: Building a Sustainable Future examines new strategies emerging in response to the mega-issues of global climate change, decline in world oil supply, scarcity of key industrial minerals, and local environmental constraints. These issues pose challenges for organizations, businesses, and communities, and engineers will need to begin developing ideas and projects to implement the transition of engineered systems. This work presents a methodology for shifting away from unsustainable activities. Teaching the Transition Engineering approach and methodology is the focus of the text, and the concept is presented in a way that engineers can begin applying it in their work.

This book provides a comprehensive overview of how to strategically manage the movement and storage of products or materials from any point in the manufacturing process to customer fulfillment. Topics covered include important tools for strategic decision making, transport, packaging, warehousing, retailing, customer services and future trends.

In an environment of diminishing resources, growing enrollment, and increasing expectations of accountability, Lean Higher Education: Increasing the Value and Performance of University Processes, Second Edition provides the understanding and the tools required to return education to the consumers it was designed to serve - the students. It supplies a unifying framework for implementing and sustaining a Lean Higher Education (LHE) transformation at any institution, regardless of size or mission. Using straightforward language, relevant examples, and step-by-step guidelines for introducing Lean interventions, this authoritative resource explains how to involve stakeholders in the delivery of quality every step of the way. The author details a flexible series of steps to help ensure stakeholders understand all critical work processes. He presents a wealth of empirical evidence that highlights successful applications of Lean concepts at major universities and provides proven methods for uncovering and eliminating activities that overburden staff yet contribute little or no added value to stakeholders. Complete with standardized methods for correctly diagnosing workplace problems and implementing appropriate solutions, this valuable reference arms you with the understanding and the tools to effectively balance the needs of all stakeholders. By implementing the Lean practices covered in these pages, your school will be better positioned to provide higher quality education, at reduced costs, with efficient processes that instill pride, maximize value, and respect the long-term interests of your students, faculty, and staff. This second edition contains a substantial update with expanded material and reflects the significant growth of LHE practices in colleges and universities worldwide. Because of advances in best practices, as well as some modest research-based evidence, this second edition includes many enhancements that provide particular value to LHE practitioners and higher education (HE) leaders. Since the initial publication of Lean Higher Education in 2010, the challenges of cost and affordability, competition for students and faculty, and calls for efficiency and accountability have only continued to grow, requiring colleges and universities to pursue more radical and transformative change to ensure their success. This new edition provides a model for change based on more than 50 years of application in business and industry and almost 20 years in HE. It provides the information and evidence demanded by HE leadership to understand and embrace LHE as well as best practices processes and tools for implementing LHE in targeted areas or institution-wide. This book provides a conceptual framework for redesigning any university process, such as admitting students, paying a bill, hiring faculty, or processing a donor gift, in a way that delights the beneficiary of that process, respects the employees who support the process, and reduce the cost of the process. A free companion guide to this book is available here: https://cabaa139-7c62-47ae-af03-e18f51efab1c.filesusr.com/ugd/f5359d_a064ca39f666408f851ffd282eb9a0a7.pdf The goal of this companion guide is to help you get the most out of your reading of Lean Higher Education. The guide is designed to support your deeper understanding and application of LHE whether you are reading the book (a) from cover to cover or select chapters; (b) reading it alone, as a member of a workplace reading group, or as a student in a classroom; (c) facilitating discussions of the chapters in the book; or (d) seeking guidance as you begin your own personal Lean Higher Education journey.

The industrial revolution, mechanization, water and steam power, computers, and automation have given an enormous boost to manufacturing productivity. "Faster, Better, Cheaper" in the History of Manufacturing shows how the ability to make products faster, better, and cheaper has evolved from the stone age to modern times. It explains how different developments over time have raised efficiency and allowed the production of more and better products with less effort and materials, and hence faster, better, and cheaper. In addition, it describes the stories of inventors, entrepreneurs, and industrialists and looks at the intersection between technology, society, machines, materials, management, and - most of all - humans. "Faster, Better, Cheaper" in the History of Manufacturing follows this development throughout the ages. This book covers not only the technical aspects (mechanization, power sources, new materials, interchangeable parts, electricity, automation), but organizational innovations (division of labor, Fordism, Talyorism, Lean). Most of all, it is a story of the people that invented, manufactured, and marketed the products. The book shows how different developments over time raised efficiency and allowed production of more with less effort and materials, which brought us a large part of the wealth and prosperity we enjoy today. The stories of real inventors and industrialists are told, which includes not only their successes but also their problems and failures. The effect of good or bad management on manufacturing is a recurring theme in many chapters, as is the fight for intellectual property through thrilling tales of espionage. This is a story of successes and failures. It is not only about technology but also about social aspects. Ultimately, it is not a book about machines but about people!

People do their best work when they are motivated. This may sound obvious, but while people managers instinctively agree with the centrality of motivation at work and its impact on employee engagement, their practices do not follow. With so much "real work" to do every day, how can managers also carve out time to learn, engage, build relationships, tap motivation, encourage development, and inspire? The problem is a false dichotomy between the world of business and that of people development. What if managers were able to systematically transform everyday business issues into meaningful, developmental coaching opportunities with employees at the same time? This proven coaching approach radically shifts conversations away from either-or propositions and uses an entirely different lens: transforming business challenges by connecting them directly to employee motivation to achieve the desired business result while dramatically increasing employee engagement. And all this comes none too soon as leaders must rethink the way they lead given the modern realities of organizational life. Among them: A rapidly changing workplace and increasing uncertainty that requires a fundamental shift in the leader's approach, including the distribution of authority and the expectation that employees take responsibility for their own learning Pervasive and persistent employee disengagement, characterized by employees who no longer accept the organization's priorities at the expense of their own, where organizations that continue to dictate terms will find ongoing challenges with costly employee turnover and lack of engagement During the past decade, the Developmental Coaching Model has been taught across the globe in nine languages and has been enthusiastically embraced by thousands of managers while dissolving the invisible barriers that block individual and organizational development and business success.