This is the fifth edition of the highly successful work first published in 1968, comprising two definitive volumes on particle characterisation. The first volume is devoted to sampling and particle size measurement, while surface area and pore size determination are reviewed in volume 2. Particle size and characterisation are central to understanding powder properties and behaviour. This book describes numerous potential measuring devices, how they operate and their advantages and disadvantages. It comprise a fully comprehensive treatise on the wide range of available equipment with an extensive literature survey, and a list of manufacturers and suppliers. The author's blend of academic and industrial experience results in a readable technical book with information on how to analyse, present, and extract useful information from data. This is an essential reference book for both industrial and academic research workers in a variety of areas including: pharmaceuticals, food science, pollution analysis and control, electronic materials, agricultural products, polymers, pigments and chemicals.

This volume aims at bringing together the results of extensive research done during the last fifteen years on the interfacial photoelectronic properties of the inorganic layered semiconducting materials, mainly in relation to solar energy conversion. Significant contributions have been made both on the fundamental aspects of interface characteristics and on the suitability of the layered materials in photoelectrochemical (semiconductor/electrolyte junctions) and in solid state photovoltaic(Schottky and p-n junctions) cells. New insights into the physical and chemical characteristics of the contact surfaces have been gained and many new applications of these materials have been revealed. In particular, the basal plane surface of the layered materials shows low chemical reactivity and specific electronic behaviour with respect to isotropic solids. In electrochemical systems, the inert nature of these surfaces characterized by saturated chemical bonds has been recognized from studies on charge transfer reactions and catalysis. In addition, studies on the role of the d-band electronic transitions and the dynamics of the photogene rated charge carriers in the relative stability of the photoelectrodes of the transition metal dichalcogenides have deepened the understanding of the interfacial photoreactions. Transition metal layered compounds are also recognized as ideal model compounds for the studies Involving surfaces: photoreactions, adsorption phenomena and catalysis, scanning tunneling microscopy and spectroscopy and epitaxial growth of thin films. Recently, quantum size effects have been investigated in layered semiconductor colloids.

"Thermo-Fluid Behaviour of Periodic Cellular Metals" introduces the study of coupled thermo-fluid behaviour of cellular metals with periodic structure in response to thermal loads, which is an interdisciplinary research area that requires a concurrent-engineering approach. The book, for the first time, systematically adopts experimental, numerical, and analytical approaches, presents the fluid flow and heat transfer in periodic cellular metals under forced convection conditions, aiming to establish structure-property relationships for tailoring material structures to achieve properties and performance levels that are customized for defined multifunctional applications. The book, as a textbook and reference book, is intended for both academic and industrial people, including graduate students, researchers and engineers.

Dr. Tian Jian Lu is a professor at the School of Aerospace, Xi an Jiaotong University, Xi an, China. Dr. Feng Xu is a professor at the Key Laboratory of Biomedical Information Engineering of Ministry of Education, School of Life Science and Technology, Xi an Jiaotong University. Dr. Ting Wen is now an engineer at Shell Global Solutions Inc. Dr. Lu and Dr. Xu are also affiliated with Biomedical Engineering and Biomechanics Center, Xi an Jiaotong University."

This book entails the developments in the field of e-waste management with particular focus on urban mining, sustainability, and circular economy aspects. It further explains e-waste recycling technologies, supply chain aspects, e-waste disposal in IT industries including health and environmental effects of E-waste recycling processes and associated issues, challenges, and solutions. Further, it describes economic potential of resource recovery from e-waste. Features: Covers recent developments in e-waste management. Explores technological advancements such as nanotech from e-waste, MREW, fungal biotech and so forth. Reviews electronic component recycling aspects. Discusses implementation of circular economy in e-waste sector. Includes urban mining and sustainability aspects of e-waste. This book is aimed at graduate students and researchers in environmental engineering, waste management, urban mining, circular economy, waste processing, electronics, and telecommunication engineering, electrical and electronics engineering, and chemical engineering.

From the prediction of complex weather patterns to the design of swimsuits, modeling has, over the years, quietly but steadily become an essential part of almost every field and industry and steelmaking is no exception. Factors such as visual opacity, high operating temperature, and the relatively large size of industrial reactors often preclude direct experimental observation in steel manufacturing. Therefore the industry is overwhelmingly dependent on modeling to quickly and cost-effectively provide insight into analysis, design, optimization, and control of processing. However, few, if any, books offer the adequate coverage of modeling.

Addresses Fundamental Principles of Physical and Mathematical Modeling in Steelmaking Processes

Modeling of Steelmaking Processes meets that ever-present demand and provides a solid knowledge base on which to build. With content designed to serve professionals and students, this book starts with an overview of steelmaking and develops into a focused description of underlying scientific fundamentals and applications.

This powerful learning tool:

• Presents an overview of steelmaking, the relevance of modeling and measurements, the evolution of steelmaking, and modern technology
• Discusses emerging issues, such as environmental emissions, recycling, and product development and quality
• Reviews computational fluid dynamics (CFD) software
• Analyzes mechanistic, AI-based, and macroscopic models, to provide a holistic view of steelmaking process modeling
• Provides useful questions and problems, as well as a practice session on modeling, to reinforce understanding

Developed as a self-tutorial, this text explores thermodynamic principles, analysis of metallurgical kinetics and transport phenomena, and key numerical methods, helping readers easily navigate a generally complex subject.

This fourth volume in the series opens some new arenas in the realm of molten salts technology, with research reports on amides, amide mixtures, and their electrochemical properties; chromatography in liquid organic salts; thermal conductivity; magnetic, calorimetric, and ultra-high-pressure measure

This is a collection of papers presented in the symposium on extraction of rare metals as well as rare extraction processing techniques used in metal production. Paper topics include the extraction and processing of elements like antimony, arsenic, gold, indium, palladium, platinum, rare earth metals including yttrium and neodymium, titanium, tungsten, and vanadium. The rare processing techniques covered include direct extraction process for rare earth element recovery; biosorption of precious metals; fluorination behavior of uranium and zirconium mixture of fuel debris treatment; and recovery of valuable components of commodity metals such as zinc, nickel, and metals from slag.

This book describes a series of research topics investigated during the 6 years from 2010 through 2015 in the project "Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials". Every section of the book is aimed at understanding the most advanced research by describing details starting with the fundamentals as often as possible. Because both fundamental and cutting-edge topics are contained in this book, it provides a great deal of useful information for chemists as well as for materials scientists and engineers who wish to consider future prospects and innovations. The contents of Novel Structured Metallic and Inorganic Materials are unique in materials science and technology. The project was carried out through the cooperation of research groups in the following six institutes in Japan: the Institute for Materials Research (IMR), Tohoku University; the Materials and Structures Laboratory (MSL), Tokyo Institute of Technology; the Joining and Welding Research Institute (JWRI), Osaka University; the Eco-Topia Science Institute (EST), Nagoya University; the Institute of Biomaterials and Bioengineering (IBB), Tokyo Medical and Dental University; and the Institute for Nanoscience and Nanotechnology (INN), Waseda University. Major objectives of the project included creation of advanced metallic and inorganic materials with a novel structure, as well as development of materials-joining technologies for development of cutting-edge applications as environmental and energy materials, biomedical materials, and electronic materials for contributing to the creation of a safer and more secure society.

CONTENTS - Introduction - I. Mechanism of Electrodeposition - 2. Laws and Characteristics of Plating Baths - 3. The Deposit - 4. Preparatory Steps of Plating - 5. Preparation of the Surface - 6. Cleaning - 7. Pickling - 8. Strike Plating - 9. Rinsing - 10. Anodizing - 1 I. Brass Plating - 12. Bronze Plating - 13. Cadmium Plating - 14. Chromate Coatings - 15. Chromium Plating - 16. Acid Copper Plating - 17. Copper Cyanide Baths - 18. Iron Plating - 19. Lead Plating - 20. Lead-Tin - 21. Nickel Plating - 22. Electroless Nickel - 23. Phosphate Coatings - 24. Silver Plating - 25. Acid Tin Plating - 26. Alkaline Tin Plating - 27. Tin-Nickel - 28. Tin-Zinc - 29. Acid Zinc Baths - 30. Zinc Cyanide Baths - 31. Control of a Plating Bath - 32. Plating Tests - 33. Gravity, Conductivity, and Voltage - 34. Electroplated Alloys - 35. Layer Plating - 36. Applications of Electroplating - 37. Plating Bath Troubles - 38. Continuous Plating - 39. Plating on Plastics - 40. Preparation of Metals for Painting - 41. Analytical Methods for Plating Baths - Appendix - Conversion Factors - Electrochemical Yields - Electrochemical Formulas - Electrochemical Equivalents - Single Electrode Potentials - Stripping Chart - Glossary - Index -

This volume discusses the physical and chemical factors involved in the production of glass-metal seals and metallizing ceramic surfaces, including a discussion of the bonding involved, and methods of active metal brazing. The book also deals with diffusion metal bonding and testing methods for the measurement of bond strength of ceramic-metal joints. An explanation of methods for the non-destructive evaluation of ceramic materials and joints includes a discussion of ultrasonic testing, radiography and thermography. The final section is a case history of ceramic-metal diffusion bonding, which is a step-by-step guide including design objectives, process development and the final production run.

This book is focused on composites involving powders as the starting materials. It provides relevant information for questions related to the selection of constituent phases, most economic fabrication routes, proper testing procedures, and product optimization. The field is sufficiently advanced that predictive models guide many decisions. Applications are illustrated over a broad range of material and property combinations. This title includes: *Selection of phases with consideration of intersolubility & interface *Microstructure, especially the role of phase connectivity *Fabrication approaches, especially net-shape consolidation *Assessment of typical properties, testing techniques & industry standards *Design & trade-off decisions involved in optimization, including cost *Applications, both those that have matured and some emerging prospects. The reader may have little appreciation for how particulate composites are literally everywhere. Examples include new wear resistant consumer products(Apple watch), longer lasting automotive tires with reduced rolling resistance(Yokohama tires), and new diamond heat sinks for computers(Element Six substrates). Particulate composites also form critical components in applications such as magnets, dental fillings, brakes, darts, bio-implants, & cutting tools. Particulate composites are a multi-billion dollar industry, and can be a cost-effective solution ripe for innovation and continued rapid growth. For the engineer, the wide range of particulate composite formulation and property combinations offers the ability to design for a variety of application and provides ample opportunity for innovation. Particulate Composites: Fundamentals & Applications is ideal for use in a one-semester eng. course at the senior UG/graduate level, and is also suitable as a practical reference for materials scientists in academia and industry.

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry. Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

The operation of a powder mixer requires a knowledge not only of the mixing mechanisms but of the physical properties of the powders being mixed. Powder Mixing is unique in that it explores the relevant physics of the powder systems including characterization procedures and rheology, and contains an extensive review of different methods that have been employed to study the structure of mixtures. The techniques for achieving structured mixtures such as microencapsulation, and recent developments in deterministic chaos theory and fractal geometry as applied to the study of powder mixing systems, are reviewed. In particular, new techniques for studying the mixing powders based on avalanching theory and critically self-organized systems are studied. These are followed by a review of the wide range of different mixers commercially available and an extensive bibliography. Powder Mixing is an essential reference for all those interested in the basic science of powder mixing and the availability of industrial systems to achieve a mixture of different kinds. The main emphasis of the text is on working principles and operative systems, and is suitable for industrial workers, chemical engineers and students alike.

Surface engineering is an increasingly important field and consequently those involved need to be aware of the vast range of technologies available to modify surfaces. This text provides an up-to-date, authoritative exposition of the major condensed phase methods used for producing metallurgical and ceramic coatings. Each method is discussed thoroughly by an expert in that field. In each chapter the principle of the method, its range of applications and technical aspects involved are described. The book not only informs the reader about established technologies familiar only to specialists, but also details activity on the frontier of coating technology providing an insight into those potential technologies not yet fully developed but which should emerge in the near future.

Chemistry of Powder Production focuses on the solid-state chemistry of powder materials and relates this to the structure, properties and preparation, and characterization techniques for these important industrial products. Additionally, the properties of the particles are discussed in relation to their surface structure and characteristics. This book describes the fundamentals of statistical methods for measuring the characteristics of particles. New advanced materials being developed in powder technology manufacturing techniques are also emphasised, including powdered materials for advanced ceramics as well as magnetic and pigment materials.

This book explains how the specifics of Stiff Extrusion influence on the metallurgical properties of Extruded Briquettes. The practical experience of the utilization of Stiff Extrusion in metallurgy obtained so far suggests that this technology can substitute (partially or by 100%) environmentally unfriendly sintering. The authors start reviewing the existing briquetting technologies, providing the reader later on with the specifics of stiff extrusion briquetting technology. Other aspects treated are the applications of extruded briquettes on blast furnace and for the production of manganese ferro alloys. The authors suggest stuff extrusion briquetting technology for direct reduction iron production and list several alternative unconventional applications.

The knowledge and use of metals has played an important role in the evolution of many African cultures. This bibliography brings together, in one volume, publications on the origins, spread, mining, smelting, smithing, use, functions, aesthetics, significance, and impact of various metals and their alloys on African cultures. Covering African metallurgy from the African Iron Age to the present, this guide is a useful reference tool for archaeology, anthropology, ethnology, history, art, and religion.

Arranged geographically by country, the volume is fully annotated and includes both printed and electronic sources.

Covers all aspects of gold nanorods along with selected protocols Focuses on synthetic chemistry, optical property, and fictionalization approach of colloidal gold nanorods Describes standard synthetic methods and advantage of gold nanorods in biomedical applications Includes authentic and reproducible experimental procedures Discusses applications like redox catalyst, catalyst promoter, delivery carrier, solar cell material, and so forth

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Hausner's handbook covers the entire field of powder metallurgy with its various branches and refinements, while at the same time remaining within the bounds of manageable size and readability. It is a concise presentation concentrating on graphical presentations and tables to explain basic relationships between the principles and technology of powder metallurgy.

This book is a valuable guide not only for students and teachers but also for the practical powder metallurgists involved in research, development and production of P/M parts and compounds.

The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.