This book discusses the mechanisms of electric conductivity in various ionic liquid systems (protic, aprotic as well as polymerized ionic liquids). It hence covers the electric properties of ionic liquids and their macromolecular counterpanes, some of the most promising materials for the development of safe electrolytes in modern electrochemical energy devices such as batteries, super-capacitors, fuel cells and dye-sensitized solar cells. Chapter contributions by the experts in the field discuss important findings obtained using broadband dielectric spectroscopy (BDS) and other complementary techniques. The book is an excellent introduction for readers who are new to the field of dielectric properties of ionic conductors, and a helpful guide for every scientist who wants to investigate the interplay between molecular structure and dynamics in ionic conductors by means of dielectric spectroscopy.

This collection focuses on all aspects of science and technology related to friction stir welding and processing.

With both nickel and cobalt featuring heavily in modern industry, there is an ongoing and intense interest in ore supplies and processing, applications development, and recycling. This book presents a collection of authoritative papers covering the latest advances in all aspects of nickel and cobalt processing, including fundamentals, technology, operating practices, and related areas of Platinum-Group Metals (PGM) processing. Special emphasis is given to the treatment of sulphide and laterite ores, concentrates, and secondary materials for the production of nickel and cobalt.

Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.

This book addresses the current status, challenges and future directions of data-driven materials discovery and design. It presents the analysis and learning from data as a key theme in many science and cyber related applications. The challenging open questions as well as future directions in the application of data science to materials problems are sketched. Computational and experimental facilities today generate vast amounts of data at an unprecedented rate. The book gives guidance to discover new knowledge that enables materials innovation to address grand challenges in energy, environment and security, the clearer link needed between the data from these facilities and the theory and underlying science. The role of inference and optimization methods in distilling the data and constraining predictions using insights and results from theory is key to achieving the desired goals of real time analysis and feedback. Thus, the importance of this book lies in emphasizing that the full value of knowledge driven discovery using data can only be realized by integrating statistical and information sciences with materials science, which is increasingly dependent on high throughput and large scale computational and experimental data gathering efforts. This is especially the case as we enter a new era of big data in materials science with the planning of future experimental facilities such as the Linac Coherent Light Source at Stanford (LCLS-II), the European X-ray Free Electron Laser (EXFEL) and MaRIE (Matter Radiation in Extremes), the signature concept facility from Los Alamos National Laboratory. These facilities are expected to generate hundreds of terabytes to several petabytes of in situ spatially and temporally resolved data per sample. The questions that then arise include how we can learn from the data to accelerate the processing and analysis of reconstructed microstructure, rapidly map spatially resolved properties from high throughput data, devise diagnostics for pattern detection, and guide experiments towards desired targeted properties. The authors are an interdisciplinary group of leading experts who bring the excitement of the nascent and rapidly emerging field of materials informatics to the reader.

This book highlights time reversal acoustics, techniques based on the symmetry properties of acoustic fields. It has the unique feature that the first eleven chapters of the book are on the indepth studies of the theories of time reversal acoustics. The remaining chapters are on the four major applications of time reversal acoustics, together with their experimental setups and case studies: underwater communication, seismic exploration,nondestructive evaluation, and medical ultrasound imaging.. The gauge invariance approach to acoustic fields, proposed by the author in 2007, is confirmed by the successful fabrication of acoustical metamaterials and the applications of time reversal acoustics to superresolution. The book also presents groundbreaking applications of time reversal acoustics to underwater communication technology and the application of metamaterials to time reversal acoustics.

This volume constitutes the state-of-the-art in active interrogation, widely recognized as indispensable methods for addressing current and future nuclear security needs. Written by a leading group of science and technology experts, this comprehensive reference presents technologies and systems in the context of the fundamental physics challenges and practical requirements. It compares the features, limitations, technologies, and impact of passive and active measurement techniques; describes radiation sources for active interrogation including electron and ion accelerators, intense lasers, and radioisotope-based sources; and it describes radiation detectors used for active interrogation. Entire chapters are devoted to data acquisition and processing systems, modeling and simulation, data interpretation and algorithms, and a survey of working active measurement systems. Active Interrogation in Nuclear Security is structured to appeal to a range of audiences, including graduate students, active researchers in the field, and policy analysts. The first book devoted entirely to active interrogation Presents a focused review of the relevant physics Surveys available technology Analyzes scientific and technology trends Provides historical and policy context Igor Jovanovic is a Professor of Nuclear Engineering and Radiological Sciences at the University of Michigan and has previously also taught at Penn State University and Purdue University. He received his Ph.D. from University of California, Berkeley and worked as physicist at Lawrence Livermore National Laboratory. Dr. Jovanovic has made numerous contributions to the science and technology of radiation detection, as well as the radiation sources for use in active interrogation in nuclear security. He has taught numerous undergraduate and graduate courses in areas that include radiation detection, nuclear physics, and nuclear security. At University of Michigan Dr. Jovanovic is the director of Neutron Science Laboratory and is also associated with the Center for Ultrafast Optical Science. Anna Erickson is an Assistant Professor in the Nuclear and Radiological Engineering Program of the G.W. Woodruff School of Mechanical Engineering at Georgia Institute of Technology. Previously, she was a postdoctoral researcher in the Advanced Detectors Group at Lawrence Livermore National Laboratory. Dr. Erickson received her PhD from Massachusetts Institute of Technology with a focus on radiation detection for active interrogation applications. Her research interests focus on nuclear non-proliferation including antineutrino analysis and non-traditional detector design and characterization. She teaches courses in advanced experimental detection for reactor and nuclear nonproliferation applications, radiation dosimetry and fast reactor analysis.

This volume introduces a comprehensive theory of deformation and fracture to engineers and applied scientists. Here "comprehensive" means that the theory can describe all stages of deformation from elastic to plastic and plastic to fracturing stage on the same basis (equations). The comprehensive approach is possible because the theory is based on a fundamental physical principle called the local symmetry, or gauge invariance, as opposed to phenomenology. Professor Yoshida explains the gist of local symmetry (gauge invariance) intuitively so that engineers and applied physicists can digest it easily, rather than describing physical or mathematical details of the principle. The author also describes applications of the theory to practical engineering, such as nondestructive testing in particular, with the use of an optical interferometric technique called ESPI (Electronic Speckle-Pattern Interferometry).The book is not a manual of applications. Instead, it provides information on how to apply physical concepts to engineering applications.

This monograph deals with the mechanics and thermodynamics of materials with memory, including properties of the dynamical equations that describe their evolution in time under varying loads. A work in four parts, the first is an introduction to continuum mechanics, including classical fluid mechanics, linear and non-linear elasticity. The second part considers continuum thermodynamics and its use to derive constitutive equations of materials with memory, including viscoelastic solids, fluids, heat conductors and some examples of non-simple materials. In the third part, free energies for materials with linear memory constitutive relations are discussed. The concept of a minimal state is introduced. Explicit formulae are presented for the minimum and related free energies. The final part deals with existence, uniqueness, and stability results for the integrodifferential equations describing the dynamical evolution of viscoelastic materials, including a new approach based on minimal states rather than histories. There are also chapters on the controllability of thermoelastic systems with memory, the Saint-Venant problem for viscoelastic materials and on the theory of inverse problems. The second edition includes a new chapter on thermoelectromagnetism as well as recent findings on minimal states and free energies. It considers the case of minimum free energies for non-simple materials and dielectrics, together with an introduction to fractional derivative models.

This book demonstrates the potential of novel in-situ experiments, performed on microscopic and macroscopic length scales, for investigating localized deformation processes in metallic materials, particularly their kinetics and the associated evolution of local strain fields. It features a broad methodological portfolio, spanning optical and electron microscopy, digital image correlation, infrared theromgraphy and acoustic emission testing, and particularly focuses on identifying the localized microscopic deformation processes in high-strength/high-ductility CrMnNi TRIP/TWIP (TRansformation Induced Plasticity/TWinning Induced Plasticity) steels. Presenting state-of-the art methodology applied to topical and pertinent problems in materials engineering, this book is a valuable resource for researchers and graduate students working in the field of plasticity and deformation of structural materials.

The vast majority of vibrations encountered in the real environment are random in nature. Such vibrations are intrinsically complicated and this volume describes the process that enables us to simplify the required analysis, along with the analysis of the signal in the frequency domain. The power spectrum density is also defined, together with the requisite precautions to be taken in its calculations as well as the processes (windowing, overlapping) necessary to obtain improved results. An additional complementary method the analysis of statistical properties of the time signal is also described. This enables the distribution law of the maxima of a random Gaussian signal to be determined and simplifies the calculation of fatigue damage by avoiding direct peak counting.

This book highlights the symmetry properties of acoustic fields and describes the gauge invariance approach, which can be used to reveal those properties. Symmetry is the key theoretical framework of metamaterials, as has been demonstrated by the successful fabrication of acoustical metamaterials. The book first provides the necessary theoretical background, which includes the covariant derivative, the vector potential, and invariance in coordinate transformation. This is followed by descriptions of global gauge invariance (isotropy), and of local gauge invariance (anisotropy). Sections on time reversal symmetry, reflection invariance, and invariance of finite amplitude waves round out the coverage.

Due to their high stiffness and strength and their good processing properties short fibre reinforced thermoplastics are well-established construction materials. Up to now, simulation of engineering parts consisting of short fibre reinforced thermoplastics has often been based on macroscopic phenomenological models, but deformations, damage and failure of composite materials strongly depend on their microstructure. The typical modes of failure of short fibre thermoplastics enriched with glass fibres are matrix failure, rupture of fibres and delamination, and pure macroscopic consideration is not sufficient to predict those effects. The typical predictive phenomenological models are complex and only available for very special failures. A quantitative prediction on how failure will change depending on the content and orientation of the fibres is generally not possible, and the direct involvement of the above effects in a numerical simulation requires multi-scale modelling. One the one hand, this makes it possible to take into account the properties of the matrix material and the fibre material, the microstructure of the composite in terms of fibre content, fibre orientation and shape as well as the properties of the interface between fibres and matrix. On the other hand, the multi-scale approach links these local properties to the global behaviour and forms the basis for the dimensioning and design of engineering components. Furthermore, multi-scale numerical simulations are required to allow efficient solution of the models when investigating three-dimensional problems of dimensioning engineering parts. Bringing together mathematical modelling, materials mechanics, numerical methods and experimental engineering, this book provides a unique overview of multi-scale modelling approaches, multi-scale simulations and experimental investigations of short fibre reinforced thermoplastics. The first chapters focus on two principal subjects: the mathematical and mechanical models governing composite properties and damage description. The subsequent chapters present numerical algorithms based on the Finite Element Method and the Boundary Element Method, both of which make explicit use of the composite's microstructure. Further, the results of the numerical simulations are shown and compared to experimental results. Lastly, the book investigates deformation and failure of composite materials experimentally, explaining the applied methods and presenting the results for different volume fractions of fibres. This book is a valuable resource for applied mathematics, theoretical and experimental mechanical engineers as well as engineers in industry dealing with modelling and simulation of short fibre reinforced composites.

This book describes the advanced developments in methodology and applications of NMR spectroscopy to life science and materials science. Experts who are leaders in the development of new methods and applications of life and material sciences have contributed an exciting range of topics that cover recent advances in structural determination of biological and material molecules, dynamic aspects of biological and material molecules, and development of novel NMR techniques, including resolution and sensitivity enhancement. First, this book particularly emphasizes the experimental details for new researchers to use NMR spectroscopy and pick up the potentials of NMR spectroscopy. Second, the book is designed for those who are involved in either developing the technique or expanding the NMR application fields by applying them to specific samples. Third, the Nuclear Magnetic Resonance Society of Japan has organized this book not only for NMR members of Japan but also for readers worldwide who are interested in using NMR spectroscopy extensively.

The field of stress analysis has gained its momentum from the widespread applications in industry and technology and has now become an important part of materials science. Various destructive as well as nondestructive methods have been developed for the determination of stresses. This timely book provides a comprehensive review of the nondestructive techniques for strain evaluation written by experts in their respective fields.

The main part of the book deals with X-ray stress analysis (XSA), focussing on measurement and evaluation methods which can help to solve the problems of today, the numerous applications of metallic, polymeric and ceramic materials as well as of thin-film-substrate composites and of advanced microcomponents. Furthermore it contains data, results, hints and recommendations that are valuable to laboratories for the certification and accreditation of their stress analysis.

Stress analysis is an active field in which many questions remain unsettled. Accordingly, unsolved problems and conflicting results are discussed as well. The assessment of the experimentally determined residual and structural stress states on the static and dynamic behavior of materials and components is handled in a separate chapter.

Students and engineers of materials science and scientists working in laboratories and industries will find this book invaluable.

This book highlights fundamental research on the design and application of engineering materials, and predominantly mechanical engineering applications. This area includes a wide range of technologies and materials, including metals, polymers, composites, and ceramics. Advanced applications include manufacturing cutting-edge materials, testing methods, and multi-scale experimental and computational aspects. The book introduces readers to a wealth of engineering applications in transport, civil, packaging and power generation.

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

This book presents selected papers presented at the 8th International Conference "Design, Modeling and Experiments of Advanced Structures and Systems" (DeMEASS VIII, held in Moscow, Russia in May 2017) and reflects the modern state of sciences in this field. The contributions contain topics like Piezoelectric, Ferroelectric, Ferroelastic and Magnetostrictive Materials, Shape Memory Alloys and Active Polymers, Functionally Graded Materials, Multi-Functional Smart Materials and Structures, Coupled Multi-Field Problems, Design and Modeling of Sensors and Actuators, Adaptive Structures.

The series Advances in Polymer Science presents critical reviews of the present and future trends in polymer and biopolymer science. It covers all areas of research in polymer and biopolymer science including chemistry, physical chemistry, physics, material science. The thematic volumes are addressed to scientists, whether at universities or in industry, who wish to keep abreast of the important advances in the covered topics. Advances in Polymer Science enjoys a longstanding tradition and good reputation in its community. Each volume is dedicated to a current topic, and each review critically surveys one aspect of that topic, to place it within the context of the volume. The volumes typically summarize the significant developments of the last 5 to 10 years and discuss them critically, presenting selected examples, explaining and illustrating the important principles, and bringing together many important references of primary literature. On that basis, future research directions in the area can be discussed. Advances in Polymer Science volumes thus are important references for every polymer scientist, as well as for other scientists interested in polymer science - as an introduction to a neighboring field, or as a compilation of detailed information for the specialist. Review articles for the individual volumes are invited by the volume editors. Single contributions can be specially commissioned. Readership: Polymer scientists, or scientists in related fields interested in polymer and biopolymer science, at universities or in industry, graduate students

Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.

This book summarizes the main methods of experimental stress analysis and examines their application to various states of stress of major technical interest, highlighting aspects not always covered in the classic literature. It is explained how experimental stress analysis assists in the verification and completion of analytical and numerical models, the development of phenomenological theories, the measurement and control of system parameters under operating conditions, and identification of causes of failure or malfunction. Cases addressed include measurement of the state of stress in models, measurement of actual loads on structures, verification of stress states in circumstances of complex numerical modeling, assessment of stress-related material damage, and reliability analysis of artifacts (e.g. prostheses) that interact with biological systems. The book will serve graduate students and professionals as a valuable tool for finding solutions when analytical solutions do not exist.

This monograph addresses the foundations of mechanothermodynamics and analyzes two of its key principles-damage of everything that exists has no conceivable limits, and effective energy (entropy) flows caused by loads of a different nature do not have a cumulative property; they interact dialectically. The authors examine a generalized model of energy and entropy states of a mechanothermodynamical medium, which generally is a continuum (liquid, gaseous) containing distributed solid deformable, and, therefore, damageable bodies, as a problem of information states of movable and damageable systems and express a solution in the first approximation. The book goes on to analyze some directions of further research in its conclusion. It is ideal for scientists, engineers, post graduate and master students of mechanics, mathematics and physics.

This thesis presents a combination of material synthesis and characterization with process modeling. In it, the CO2 adsorption properties of hydrotalcites are enhanced through the production of novel supported hybrids (carbon nanotubes and graphene oxide) and the promotion with alkali metals. Hydrogen is regarded as a sustainable energy carrier, since the end users produce no carbon emissions. However, given that most of the hydrogen produced worldwide comes from fossil fuels, its potential as a carbon-free alternative depends on the ability to capture the carbon dioxide released during manufacture. Sorption-enhanced hydrogen production, in which CO2 is removed as it is formed, can make a major contribution to achieving this. The challenge is to find solid adsorbents with sufficient CO2 capacity that can work in the right temperature window over repeated adsorption-desorption cycles. The book presents a highly detailed characterization of the materials, together with an accurate measurement of their adsorption properties under dry conditions and in the presence of steam. It demonstrates that even small quantities of graphene oxide provide superior thermal stability to hydrotalcites due to their compatible layered structure, making them well suited as volume-efficient adsorbents for CO2. Lastly, it identifies suitable catalysts for the overall sorption-enhanced water gas shift process.

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

This book presents a collection of contributions on the advanced mechanics of materials and mechanics of structures approaches, written in honor of Professor Kienzler. It covers various topics related to constitutive models for advanced materials, recent developments in mechanics of configuration forces, as well as new approaches to the efficient modeling and analysis of engineering structures.